公开(公告)号：US10309587B2

公开(公告)日：2019-06-04

申请号：US13886878

申请日：2013-05-03

申请人： Srinath K. Aanegola ,  Emil V. Radkov ,  James Reginelli ,  Larry R. Stadelman ,  Matthew Mrakovich ,  Tomislav J. Stimac ,  Stanton Earl Weaver, Jr. ,  Thomas F. Soules

发明人： Srinath K. Aanegola ,  Emil V. Radkov ,  James Reginelli ,  Larry R. Stadelman ,  Matthew Mrakovich ,  Tomislav J. Stimac ,  Stanton Earl Weaver, Jr. ,  Thomas F. Soules

IPC分类号： F21K9/64 ,  F21K9/68 ,  F21V13/08 ,  H01L33/46 ,  H01L33/50 ,  H01L33/58 ,  H01L33/60 ,  F21Y105/10 ,  F21Y115/10

摘要： In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.

公开(公告)号：US20180080614A9

公开(公告)日：2018-03-22

申请号：US13886878

申请日：2013-05-03

申请人： Srinath K. Aanegola ,  Emil V. Radkov ,  James Reginelli ,  Larry R. Stadelman ,  Matthew Mrakovich ,  Tomislav J. Stimac ,  Stanton Earl Weaver, JR. ,  Thomas F. Soules

发明人： Srinath K. Aanegola ,  Emil V. Radkov ,  James Reginelli ,  Larry R. Stadelman ,  Matthew Mrakovich ,  Tomislav J. Stimac ,  Stanton Earl Weaver, JR. ,  Thomas F. Soules

IPC分类号： F21K99/00 ,  F21V13/08

CPC分类号： F21K9/64 ,  F21K9/68 ,  F21V13/08 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/46 ,  H01L33/505 ,  H01L33/507 ,  H01L33/508 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.

公开(公告)号：US20070273282A1

公开(公告)日：2007-11-29

申请号：US11440931

申请日：2006-05-25

申请人： Emil V. Radkov ,  Thomas F. Soules

发明人： Emil V. Radkov ,  Thomas F. Soules

IPC分类号： H01J1/62 ,  H01J63/04

CPC分类号： C09K11/7734 ,  C09K11/02 ,  C09K11/7739 ,  H01L33/501 ,  H01L33/502 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： The present invention provides an optoelectronic device comprising a light source, an encapsulant with Refractive Index n1, and a phosphor with Refractive Index n2 which is within the range of from about 0.85n1, to about 1.15n1. The present invention also provides a method of adjusting the Refractive Index nx of a phosphor which is higher than a predetermined value n2. The method comprises partially or completely replacing one or more first element(s) in the phosphor with one or more second elements which typically have lower atomic weight than the first element(s). The phosphor is chemically stable and optically comparable with the encapsulant; and the optoelectronic device has gained technical merits such as increased light output efficiency, easy manufacturability, and cost-effectiveness, among others.

摘要翻译： 本发明提供了一种光电子器件，其包括光源，具有折射率n 1的密封剂和具有折射率nλ2的磷光体，其范围在约 0.85n 1/2，至约1.15n 1/2。 本发明还提供了一种调节高于预定值n 2的磷光体的折射率n 的方法。 该方法包括用一个或多个通常具有比第一元件更低的原子量的第二元素部分或完全地替换荧光体中的一个或多个第一元素。 磷光体在化学上是稳定的，与密封剂相当; 光电子器件获得了光输出效率提高，易制造性和成本效益等技术优点。

公开(公告)号：US08362695B2

公开(公告)日：2013-01-29

申请号：US12884612

申请日：2010-09-17

申请人： Srinath K. Aanegola ,  Emil V. Radkov ,  James Reginelli ,  Larry R. Stadelman ,  Matthew Mrakovich ,  Tomislav J. Stimac

发明人： Srinath K. Aanegola ,  Emil V. Radkov ,  James Reginelli ,  Larry R. Stadelman ,  Matthew Mrakovich ,  Tomislav J. Stimac

IPC分类号： H01J1/62

CPC分类号： H01L25/0753 ,  F21K9/68 ,  F21V23/00 ,  H01L33/507 ,  H01L2224/48091 ,  H01L2924/01322 ,  H01L2924/00 ,  H01L2924/00014

摘要： In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.

摘要翻译： 在照明封装中，印刷电路板支撑至少一个发光管芯。 透光罩设置在至少一个发光管芯上。 荧光体设置在透光圆顶盖的内部或内部。 荧光体响应于至少一个发光管芯的照射而输出转换的光。 密封剂基本上填充由透光盖和印刷电路板限定的内部空间。

公开(公告)号：US10340424B2

公开(公告)日：2019-07-02

申请号：US14062169

申请日：2013-10-24

申请人： Srinath K. Aanegola ,  Emil V. Radkov ,  James Reginelli ,  Larry R. Stadelman ,  Matthew Mrakovich ,  Tomislav J. Stimac

发明人： Srinath K. Aanegola ,  Emil V. Radkov ,  James Reginelli ,  Larry R. Stadelman ,  Matthew Mrakovich ,  Tomislav J. Stimac

IPC分类号： F21V7/00 ,  H01L33/44 ,  H01L33/50 ,  H01L33/54 ,  H01L25/075 ,  F21K9/64

摘要： In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.

公开(公告)号：US07800121B2

公开(公告)日：2010-09-21

申请号：US11312268

申请日：2005-12-20

申请人： Srinath K. Aanegola ,  Emil V. Radkov ,  James Reginelli ,  Larry R. Stadelman ,  Matthew Mrakovich ,  Tomislav J. Stimac

发明人： Srinath K. Aanegola ,  Emil V. Radkov ,  James Reginelli ,  Larry R. Stadelman ,  Matthew Mrakovich ,  Tomislav J. Stimac

IPC分类号： H01L29/22 ,  H01L29/227 ,  H01L27/15 ,  H01L29/267 ,  H01L29/24

CPC分类号： H01L25/0753 ,  F21K9/68 ,  F21V23/00 ,  H01L33/507 ,  H01L2224/48091 ,  H01L2924/01322 ,  H01L2924/00 ,  H01L2924/00014

摘要： In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.

摘要翻译： 在照明封装中，印刷电路板支撑至少一个发光管芯。 透光罩设置在至少一个发光管芯上。 荧光体设置在透光圆顶盖的内部或内部。 荧光体响应于至少一个发光管芯的照射而输出转换的光。 密封剂基本上填充由透光盖和印刷电路板限定的内部空间。

公开(公告)号：US20140049965A1

公开(公告)日：2014-02-20

申请号：US14062169

申请日：2013-10-24

申请人： Srinath K. Aanegola ,  Emil V. Radkov ,  James Reginelli ,  Larry R. Stadelman ,  Matthew Mrakovich ,  Tomislav J. Stimac

发明人： Srinath K. Aanegola ,  Emil V. Radkov ,  James Reginelli ,  Larry R. Stadelman ,  Matthew Mrakovich ,  Tomislav J. Stimac

IPC分类号： H01L33/44 ,  H01L33/54 ,  F21K99/00 ,  H01L33/50

CPC分类号： H01L33/44 ,  F21K9/64 ,  H01L25/0753 ,  H01L33/501 ,  H01L33/502 ,  H01L33/507 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2924/00014

摘要： In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.

公开(公告)号：US20110018014A1

公开(公告)日：2011-01-27

申请号：US12884717

申请日：2010-09-17

申请人： Srinath K. Aanegola ,  Emil V. Radkov ,  James Reginelli ,  Larry R. Stadelman ,  Matthew Mrakovich ,  Tomislav J. Stimac

发明人： Srinath K. Aanegola ,  Emil V. Radkov ,  James Reginelli ,  Larry R. Stadelman ,  Matthew Mrakovich ,  Tomislav J. Stimac

IPC分类号： H01L33/08 ,  H01L33/10

CPC分类号： H01L25/0753 ,  F21K9/68 ,  F21V23/00 ,  H01L33/507 ,  H01L2224/48091 ,  H01L2924/01322 ,  H01L2924/00 ,  H01L2924/00014

摘要： In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially tills an interior volume defined by the light-transmissive cover and the printed circuit board.

摘要翻译： 在照明封装中，印刷电路板支撑至少一个发光管芯。 透光罩设置在至少一个发光管芯上。 荧光体设置在透光圆顶盖的内部或内部。 荧光体响应于至少一个发光管芯的照射而输出转换的光。 密封剂基本上覆盖由透光盖和印刷电路板限定的内部空间。

公开(公告)号：US20140328046A1

公开(公告)日：2014-11-06

申请号：US13886878

申请日：2013-05-03

申请人： Srinath K. Aanegola ,  Emil V. Radkov ,  James Reginelli ,  Larry R. Stadelman ,  Matthew Mrakovich ,  Tomislav J. Stimac

发明人： Srinath K. Aanegola ,  Emil V. Radkov ,  James Reginelli ,  Larry R. Stadelman ,  Matthew Mrakovich ,  Tomislav J. Stimac

IPC分类号： F21K99/00 ,  F21V13/08

CPC分类号： F21K9/64 ,  F21K9/68 ,  F21V13/08 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/46 ,  H01L33/505 ,  H01L33/507 ,  H01L33/508 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.

摘要翻译： 在照明封装中，印刷电路板支撑至少一个发光管芯。 透光罩设置在至少一个发光管芯上。 荧光体设置在透光圆顶盖的内部或内部。 荧光体响应于至少一个发光管芯的照射而输出转换的光。 密封剂基本上填充由透光盖和印刷电路板限定的内部空间。

公开(公告)号：US08436380B2

公开(公告)日：2013-05-07

申请号：US12884717

申请日：2010-09-17

申请人： Srinath K. Aanegola ,  Emil V. Radkov ,  James Reginelli ,  Larry R. Stadelman ,  Matthew Mrakovich ,  Tomislav J. Stimac

发明人： Srinath K. Aanegola ,  Emil V. Radkov ,  James Reginelli ,  Larry R. Stadelman ,  Matthew Mrakovich ,  Tomislav J. Stimac

IPC分类号： H01L29/22 ,  H01L29/227 ,  H01L27/15 ,  H01L29/267 ,  H01L29/24

CPC分类号： H01L25/0753 ,  F21K9/68 ,  F21V23/00 ,  H01L33/507 ,  H01L2224/48091 ,  H01L2924/01322 ,  H01L2924/00 ,  H01L2924/00014

摘要： In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially tills an interior volume defined by the light-transmissive cover and the printed circuit board.

摘要翻译： 在照明封装中，印刷电路板支撑至少一个发光管芯。 透光罩设置在至少一个发光管芯上。 荧光体设置在透光圆顶盖的内部或内部。 荧光体响应于至少一个发光管芯的照射而输出转换的光。 密封剂基本上覆盖由透光盖和印刷电路板限定的内部空间。