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公开(公告)号：US5063366A
公开(公告)日：1991-11-05
申请号：US529907
申请日：1990-05-29
摘要： Disclosed is an electromagnetic relay whose armature assembly is protected against jarring impacts. The armature assembly is tiltably supported in a recess stamped out in an end portion of the magnetic yoke of the relay. Lateral inner walls of the recess are formed at their free ends with shoulders for engaging a flat biasing spring of the armature assembly. At least one lateral portion of the magnetic yoke delimiting the recess is formed with a constricted region, for example with a cutout in a corner between an inner wall and the bottom wall of the recess. The constriction permits the bending of the lateral projection into an open condition in which the corresponding shoulder is out of the way during the insertion of the armature assembly into the recess. Upon the insertion, the lateral projection is bent toward the armature until the corresponding shoulder overlaps the armature edge.
摘要翻译： 公开了一种电磁继电器，其电枢组件被防止刺耳的冲击。 电枢组件可倾斜地支撑在冲压在继电器的磁轭的端部中的凹部中。 凹部的横向内壁在其自由端处形成有用于接合电枢组件的平坦偏置弹簧的肩部。 限定凹部的磁轭的至少一个横向部分形成有缩窄区域，例如在内壁和凹部的底壁之间的角落中具有切口。 收缩部分允许横向突起部弯曲成打开状态，其中相应的肩部在将电枢组件插入凹槽期间不通过。 在插入时，横向突起朝向衔铁弯曲，直到相应的肩部与电枢边缘重叠。
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2.发明授权Process and device for the production of metal-complex compounds suitable for electroless metal deposition 失效用于生产适用于无电金属沉积的金属络合物的方法和装置
公开(公告)号：US4208255A
公开(公告)日：1980-06-17
申请号：US885649
申请日：1978-03-13
申请人： Fritz Stahl , Horst Steffen
发明人： Fritz Stahl , Horst Steffen
CPC分类号： C25B3/12 , C23C18/1619 , C23C18/1653 , C23C18/1669 , C23C18/1671
摘要： Metal-complex compounds suitable for use in the electroless deposition of said metal are formed in aqueous solution by a method which comprises providing an aqueous solution of the complexing agent, immersing in the solution at least one anode comprising the metal to be deposited and at least one cathode, the anode and cathode being connected to an adjustable current source, applying a current to the anode and cathode to create a voltage difference therebetween which is sufficient to dissolve metal from the anode into the aqueous solution of the complexing agent and thereby form a compound of the metal and complexing agent, and depositing a lesser amount of metal from solution onto the cathode to enrich the solution in the metal-complex compound. In other embodiments of the invention, devices for carrying out the process are also provided.
摘要翻译： 适合用于所述金属的无电沉积的金属络合物通过包括提供络合剂的水溶液的方法在水溶液中形成，将至少一个阳极包含待沉积的金属和至少 一个阴极，阳极和阴极连接到可调节的电流源，向阳极和阴极施加电流以在它们之间产生电压差，其足以将金属从阳极溶解到络合剂的水溶液中，从而形成 金属和络合剂的化合物，以及从溶液中将少量金属沉积到阴极上以富集金属络合物的溶液。 在本发明的其他实施例中，还提供了用于执行该过程的装置。
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公开(公告)号：US4430154A
公开(公告)日：1984-02-07
申请号：US358226
申请日：1982-03-15
申请人： Fritz Stahl , Horst Steffen
发明人： Fritz Stahl , Horst Steffen
CPC分类号： H05K3/26 , H05K2201/0761 , H05K2203/0796 , H05K2203/1407 , H05K3/108 , H05K3/184 , H05K3/387
摘要： The present invention relates to a semi-additive or full-additive process for producing printed circuit or conductor boards having improved electrical resistance in which the coating of adhesive medium exposed between the trains of conductors is removed or partially removed without corroding the base material or copper of the conductor trains by a treatment with an alkaline permanganate or chromic acid solution and suitable washing steps carried out subsequently.
摘要翻译： 本发明涉及用于制造具有改进的电阻的印刷电路或导体板的半添加剂或全添加方法，其中暴露在导体列之间的粘合剂介质的涂层被去除或部分地除去而不腐蚀基材或铜 通过用碱性高锰酸盐或铬酸溶液处理并且随后进行的合适的洗涤步骤。
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4.发明授权Method and device for the electrochemical treatment with treatment liquid of an item to be treated 失效用于处理物品的处理液进行电化学处理的方法和装置
公开(公告)号：US06071400A
公开(公告)日：2000-06-06
申请号：US162659
申请日：1998-09-29
CPC分类号： H05K3/07 , C25D17/005 , C25D17/008 , C25D5/02 , C25F7/00 , H05K3/241
摘要： The invention relates to a method and device for the electrochemical treatment of electrically mutually insulated, electrically conductive areas on an item to be treated by means of a treatment liquid. Insulated, for example etched structures on circuit boards cannot be treated electrochemically with known methods since there exists no electrical connection to the bath current source from individual areas. According to the invention, this connection is produced by brushes which touch the structured surfaces to be treated with their electrically conductive and thin fibres. A large number of brushes which are arranged transversely to the direction of transportation take care of the fact that all the electrically conductive areas on the item to be treated which are arranged in an insulated manner from one another are contacted electrically at least one after another and that the achieved contact time is sufficiently long. Counter-electrodes, which may be also designed as movable brushes, are situated preferably between the brush electrodes. In electrochemical processes, in which metal is deposited, the brushes are deplated cyclically. For this purpose, various possible solutions are proposed.
摘要翻译： PCT No.PCT / EP97 / 01544 Sec。 371日期1997年7月16日 102（e）日期1997年7月16日PCT 1997年3月26日PCT公布。 出版物WO97 / 37062 日期1997年10月9日本发明涉及一种用于通过处理液体处理的物品上的电相互绝缘的导电区域的电化学处理的方法和装置。 绝缘的，例如电路板上的蚀刻结构不能用已知的方法进行电化学处理，因为不存在来自各个区域的电泳电源的电连接。 根据本发明，这种连接是通过用它们的导电和细纤维接触要处理的结构化表面的刷产生的。 横向于运输方向布置的大量刷子涉及以下事实：待处理物品上彼此绝缘地布置的所有导电区域电连接至少一个接一个， 实现的接触时间足够长。 也可以设计为可动刷的对电极优选位于刷电极之间。 在其中沉积金属的电化学工艺中，电刷循环地脱落。 为此，提出了各种可能的解决方案。
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5.发明授权Method for producing printed circuit boards with punched holes having metallized walls 失效印刷电路板的制造方法，该印刷电路板具有金属化壁的冲孔
公开(公告)号：US4374868A
公开(公告)日：1983-02-22
申请号：US239385
申请日：1981-03-02
申请人： Fritz Stahl , Horst Steffen
发明人： Fritz Stahl , Horst Steffen
摘要： A method for producing printed circuit boards with holes having walls provided with a metal coating on base material provided with an adhesive layer which, in turn, is covered by a masking foil composed of plastic material or metal. Following the preparation of the pattern of holes and prior to the removal of the masking foil, the layer of adhesive coating is removed at the edges of the holes by chemical action, so that an annular zone free of adhesive is formed underneath the masking foil. The masking foil is subsequently removed and the metallization of the pattern of conductors and walls of the holes is produced by currentless deposition alone or combined with galvanic precipitation.
摘要翻译： 一种用于制造具有孔的印刷电路板的方法，所述印刷电路板具有在基材上设置有金属涂层的壁，其具有粘合剂层，所述粘合剂层又由由塑料材料或金属构成的掩模箔覆盖。 在孔的图案的制备之后，在除去掩模箔之前，通过化学作用在孔的边缘处去除粘合剂涂层，使得在掩模箔下方形成无粘合剂的环形区。 随后去除掩模箔，并且通过无电沉积单独或与电沉淀组合来产生导体和孔的壁的图案的金属化。
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6.发明授权Process for the catalytic sensitization of non-metallic surfaces for subsequent electroless metallization 失效用于非金属表面的催化敏化以用于随后的无电镀金属化的方法
公开(公告)号：US4020197A
公开(公告)日：1977-04-26
申请号：US547360
申请日：1975-02-05
申请人： Horst Steffen
发明人： Horst Steffen
CPC分类号： C23C18/28
摘要： The present invention provides copper (I) ion compound bath solutions for the catalytic sensitization and metallization by electroless metal deposition of non-metallic surfaces, as well as processes for the application and re-claiming of said solutions.
摘要翻译： 本发明提供了用于通过无金属金属沉积非金属表面的催化敏化和金属化的铜（I）离子化合物浴溶液，以及用于所述溶液的应用和重新申请的方法。
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