公开(公告)号：US20060128600A1

公开(公告)日：2006-06-15

申请号：US11347154

申请日：2006-02-03

申请人： Erik Freer ,  John de Larios ,  Katrina Mikhaylichenko ,  Michael Ravkin ,  Mikhail Korolik ,  Fred Redeker

发明人： Erik Freer ,  John de Larios ,  Katrina Mikhaylichenko ,  Michael Ravkin ,  Mikhail Korolik ,  Fred Redeker

IPC分类号： B08B3/02 ,  C11D3/20

CPC分类号： H01L21/02052 ,  B08B7/02 ,  C11D3/2079 ,  C11D9/02 ,  C11D9/26 ,  C11D9/267 ,  C11D11/0047 ,  C11D17/0013 ,  C11D17/0017 ,  C23G1/18 ,  G03F7/425 ,  G03F7/426 ,  H05K3/26

摘要： A cleaning compound is provided. The cleaning compound includes about 0.1 weight percent to about 10 weight percent of a fatty acid dispersed in water. The cleaning compound includes an amount of a base sufficient to bring a pH of the fatty acid water solution to about a level where above about 50% of the dispersed fatty acid is ionized. A method for cleaning a substrate, a system for cleaning a substrate, and a cleaning solution prepared by a process are also provided.

摘要翻译： 提供清洁化合物。 清洁化合物包括分散在水中的约0.1重量％至约10重量％的脂肪酸​​。 清洁化合物包括一定量的足以使脂肪酸水溶液的pH达到大约50％的分散脂肪酸被离子化的水平的碱。 还提供了清洁基板的方法，用于清洁基板的系统以及通过工艺制备的清洁溶液。

公开(公告)号：US20070079848A1

公开(公告)日：2007-04-12

申请号：US11336215

申请日：2006-01-20

申请人： Erik Freer ,  John de Larios ,  Katrina Mikhaylichenko ,  Michael Ravkin ,  Mikhail Korolik ,  Fred Redeker ,  Clint Thomas ,  John Parks

发明人： Erik Freer ,  John de Larios ,  Katrina Mikhaylichenko ,  Michael Ravkin ,  Mikhail Korolik ,  Fred Redeker ,  Clint Thomas ,  John Parks

IPC分类号： C23G1/00 ,  B08B7/00 ,  B08B7/04 ,  B08B3/00 ,  B08B3/12

CPC分类号： H01L21/02057 ,  B05D3/10 ,  B08B7/02 ,  C11D1/04 ,  C11D3/042 ,  C11D3/044 ,  C11D3/18 ,  C11D3/2079 ,  C11D3/222 ,  C11D3/225 ,  C11D3/3765 ,  C11D9/00 ,  C11D9/02 ,  C11D9/267 ,  C11D11/0047 ,  C11D17/0004 ,  C11D17/0013 ,  C11D17/0017 ,  C11D17/003 ,  C11D17/041 ,  C23G1/00 ,  C23G1/18 ,  G03F7/42 ,  G03F7/423 ,  H01L21/02052 ,  H01L21/02096 ,  H01L21/31133 ,  H01L21/67051 ,  H01L21/67057 ,  H01L21/6708 ,  H01L21/67086

摘要： A cleaning material is disposed over a substrate. The cleaning material includes solid components dispersed within a liquid medium. A force is applied to the solid components within the liquid medium to bring the solid components within proximity to contaminants present on the substrate. The force applied to the solid components can be exerted by an immiscible component within the liquid medium. When the solid components are brought within sufficient proximity to the contaminants, an interaction is established between the solid components and the contaminants. Then, the solid components are moved away from the substrate such that the contaminants having interacted with the solid components are removed from the substrate.

摘要翻译： 清洁材料设置在基板上。 清洁材料包括分散在液体介质中的固体组分。 将力施加到液体介质中的固体组分以使固体组分接近存在于基底上的污染物。 施加到固体组分的力可以通过液体介质中的不混溶组分施加。 当固体组分被充分接近污染物时，在固体组分和污染物之间建立了相互作用。 然后，将固体组分从衬底移开，使得与固体组分相互作用的污染物从衬底上除去。

公开(公告)号：US20060128590A1

公开(公告)日：2006-06-15

申请号：US11346894

申请日：2006-02-03

申请人： Erik Freer ,  John de Larios ,  Katrina Mikhaylichenko ,  Michael Ravkin ,  Mikhail Korolik ,  Fred Redeker

发明人： Erik Freer ,  John de Larios ,  Katrina Mikhaylichenko ,  Michael Ravkin ,  Mikhail Korolik ,  Fred Redeker

IPC分类号： C23G1/00 ,  B08B5/04 ,  B08B3/00 ,  C11D17/00

CPC分类号： H01L21/02052 ,  B08B7/02 ,  C11D9/00 ,  C11D9/02 ,  C11D9/267 ,  C11D11/0047 ,  C11D17/0013 ,  C11D17/0017 ,  C23G1/18 ,  G03F7/42 ,  H01L21/02057 ,  H01L21/02096

摘要： A method is provided for removing contamination from a substrate. The method includes applying a cleaning solution having a dispersed phase, a continuous phase and particles dispersed within the continuous phase to a surface of the substrate. The method includes forcing one of the particles dispersed within the continuous phase proximate to one of the surface contaminants. The forcing is sufficient to overcome any repulsive forces between the particles and the surface contaminants so that the one of the particles and the one of the surface contaminants are engaged. The method also includes removing the engaged particle and surface contaminant from the surface of the substrate. A process to manufacture the cleaning material is also provided.

公开(公告)号：US20070084483A1

公开(公告)日：2007-04-19

申请号：US11612352

申请日：2006-12-18

申请人： Erik Freer ,  John deLarios ,  Katrina Mikhaylichenko ,  Michael Ravkin ,  Mikhail Korolik ,  Fred Redeker

发明人： Erik Freer ,  John deLarios ,  Katrina Mikhaylichenko ,  Michael Ravkin ,  Mikhail Korolik ,  Fred Redeker

IPC分类号： B08B7/00 ,  B08B3/00

CPC分类号： H01L21/67092 ,  B08B3/00 ,  B08B7/00 ,  B08B7/02 ,  C11D9/02 ,  C11D11/0047 ,  C11D17/0017 ,  C23G1/18 ,  G03F7/423 ,  H01L21/02052 ,  H01L21/02057 ,  H01L21/02096 ,  H01L21/31133 ,  H01L21/67028 ,  H01L21/6708 ,  H01L21/67086 ,  Y10T137/4891

摘要： A method for cleaning a substrate is provided. The method initiates with applying an activation solution to a surface of the substrate. The activation solution and the surface of the substrate are contacted with a surface of a solid cleaning surface. The activation solution is absorbed into a portion of the solid cleaning element and then the substrate or the solid cleaning surface is moved relative to each other to clean the surface of the substrate. A method for cleaning the surface of the substrate with a solid cleaning element that experiences plastic deformation is also provided. Corresponding cleaning apparatuses are also provided.

摘要翻译： 提供一种清洗基板的方法。 该方法通过将激活溶液施加到基底的表面来启动。 活化溶液和基材的表面与固体清洁表面的表面接触。 活化溶液被吸收到固体清洁元件的一部分中，然后基底或固体清洁表面相对于彼此移动以清洁基底的表面。 还提供了一种用经历塑性变形的固体清洁元件来清洁基板的表面的方法。 还提供了相应的清洁装置。

公开(公告)号：US20070084485A1

公开(公告)日：2007-04-19

申请号：US11612371

申请日：2006-12-18

申请人： Erik Freer ,  John deLarios ,  Katrina Mikhaylichenko ,  Michael Ravkin ,  Mikhail Korolik ,  Fred Redeker

发明人： Erik Freer ,  John deLarios ,  Katrina Mikhaylichenko ,  Michael Ravkin ,  Mikhail Korolik ,  Fred Redeker

IPC分类号： B08B3/00

CPC分类号： B08B7/00 ,  B08B3/00 ,  B08B7/02 ,  C11D9/02 ,  C11D11/0047 ,  C11D17/0017 ,  C23G1/18 ,  G03F7/423 ,  H01L21/02052 ,  H01L21/31133 ,  H01L21/67028 ,  H01L21/6708 ,  H01L21/67086

摘要： A method for cleaning a substrate is provided. The method initiates with disposing a fluid layer having solid components therein to a surface of the substrate. A shear force directed substantially parallel to the surface of the substrate and toward an outer edge of the substrate is then created. The shear force may result from a normal or tangential component of a force applied to a solid body in contact with the fluid layer in one embodiment. The surface of the substrate is rinsed to remove the fluid layer. A cleaning system and apparatus are also provided.

摘要翻译： 提供一种清洗基板的方法。 该方法通过将其中具有固体组分的流体层设置在基底的表面来启动。 然后产生基本上平行于衬底的表面并朝向衬底的外边缘的剪切力。 在一个实施例中，剪切力可以由施加到与流体层接触的固体的力的正常或切向分量产生。 漂洗基材的表面以除去流体层。 还提供清洁系统和装置。

公开(公告)号：US20070087950A1

公开(公告)日：2007-04-19

申请号：US11519354

申请日：2006-09-11

申请人： Mikhail Korolik ,  Erik Freer ,  John de Larios ,  Katrina Mikhaylichenko ,  Mike Ravkin ,  Fritz Redeker

发明人： Mikhail Korolik ,  Erik Freer ,  John de Larios ,  Katrina Mikhaylichenko ,  Mike Ravkin ,  Fritz Redeker

IPC分类号： B08B3/00 ,  B08B7/00 ,  C11D7/32

CPC分类号： C11D11/0047 ,  B08B7/02 ,  C11D1/146 ,  C11D3/2079 ,  C11D9/02 ,  C11D17/0013 ,  C11D17/0017 ,  C23G1/18 ,  G03F7/423 ,  H01L21/02052 ,  H01L21/31133 ,  H01L21/6708 ,  H01L21/67086

摘要： Cleaning compounds, apparatus, and methods to remove contaminants from a substrate surface are provided. An exemplary cleaning compound to remove particulate contaminants from a semiconductor substrate surface is provided. The cleaning compound includes a viscous liquid with a viscosity between about 1 cP to about 10,000 cP. The cleaning compound also includes a plurality of solid components dispersed in the viscous liquid, the plurality of solid components interact with the particulate contaminants on the substrate surface to remove the particulate contaminants from the substrate surface.

摘要翻译： 提供了清除化合物，设备和从基材表面除去污染物的方法。 提供了从半导体衬底表面去除颗粒污染物的示例性清洁化合物。 清洁化合物包括粘度在约1cP至约10,000cP之间的粘性液体。 清洁化合物还包括分散在粘性液体中的多个固体组分，多个固体组分与基底表面上的颗粒污染物相互作用以从基底表面去除颗粒污染物。

公开(公告)号：US20080148595A1

公开(公告)日：2008-06-26

申请号：US11643479

申请日：2006-12-20

申请人： John M. de Larios ,  Paul A. Kittle ,  Michael Ravkin ,  Mikhail Korolik ,  Erik Freer ,  Katrina Mikhaylich ,  Fritz C. Redeker

发明人： John M. de Larios ,  Paul A. Kittle ,  Michael Ravkin ,  Mikhail Korolik ,  Erik Freer ,  Katrina Mikhaylich ,  Fritz C. Redeker

IPC分类号： F26B7/00 ,  F26B21/00

CPC分类号： F26B5/14 ,  F26B21/14 ,  H01L21/67034

摘要： A method for processing a substrate using a proximity head is disclosed. The method is initiated by, providing a head with a head surface positioned proximate to a surface of the substrate. The head has a width and a length, and the head has a plurality of ports that are configured in rows along the length of the head. The plurality of rows can extend over a width of the head, and there is a first group of ports configured to dispense a first fluid. The first fluid is dispensed to the surface of the substrate forming a meniscus between the surface of the substrate and the surface of the head. The method also includes delivering gaseous carbon dioxide from a second group of ports of the head to an interface between the meniscus and the substrate. The carbon dioxide assists in promoting a reduced surface tension on the meniscus relative to surface of the substrate.

摘要翻译： 公开了一种使用邻近头来处理衬底的方法。 该方法是通过提供具有靠近基板的表面定位的头表面的头来开始的。 头部具有宽度和长度，头部具有沿头部长度配置成行的多个端口。 多个行可以在头部的宽度上延伸，并且存在被配置为分配第一流体的第一组端口。 将第一流体分配到基材的表面，在基材的表面和头部表面之间形成弯液面。 该方法还包括将气态二氧化碳从头部的第二组端口输送到弯月面和基底之间的界面。 二氧化碳有助于相对于基底表面促进弯月面上的表面张力降低。

公开(公告)号：US20110165337A1

公开(公告)日：2011-07-07

申请号：US13009675

申请日：2011-01-19

申请人： J. Wallace Parce ,  James M. Hamilton ,  Samuel Martin ,  Erik Freer

发明人： J. Wallace Parce ,  James M. Hamilton ,  Samuel Martin ,  Erik Freer

IPC分类号： B05D1/04 ,  B05B5/025

CPC分类号： B82B3/00 ,  B82Y30/00 ,  B82Y40/00 ,  H01L21/6835 ,  H01L2221/68354 ,  H01L2221/68363

摘要： Methods and systems for applying nanowires and electrical devices to surfaces are described. In a first aspect, at least one nanowire is provided proximate to an electrode pair. An electric field is generated by electrodes of the electrode pair to associate the at least one nanowire with the electrodes. The electrode pair is aligned with a region of the destination surface. The at least one nanowire is deposited from the electrode pair to the region. In another aspect, a plurality of electrical devices is provided proximate to an electrode pair. An electric field is generated by electrodes of the electrode pair to associate an electrical device of the plurality of electrical devices with the electrodes. The electrode pair is aligned with a region of the destination surface. The electrical device is deposited from the electrode pair to the region.

摘要翻译： 描述了将纳米线和电气装置应用于表面的方法和系统。 在第一方面，在电极对附近提供至少一个纳米线。 由电极对的电极产生电场，以将至少一个纳米线与电极相关联。 电极对与目的地表面的区域对准。 将至少一个纳米线从电极对沉积到该区域。 在另一方面，在电极对附近提供多个电气装置。 由电极对的电极产生电场，以将多个电气装置中的电气装置与电极相关联。 电极对与目的地表面的区域对准。 电器件从电极对沉积到该区域。

公开(公告)号：US07892610B2

公开(公告)日：2011-02-22

申请号：US12114446

申请日：2008-05-02

申请人： J. Wallace Parce ,  James M. Hamilton ,  Samuel Martin ,  Erik Freer

发明人： J. Wallace Parce ,  James M. Hamilton ,  Samuel Martin ,  Erik Freer

IPC分类号： B05D1/04

CPC分类号： B82B3/00 ,  B82Y30/00 ,  B82Y40/00 ,  H01L21/6835 ,  H01L2221/68354 ,  H01L2221/68363

摘要： Methods and systems for applying nanowires and electrical devices to surfaces are described. In a first aspect, at least one nanowire is provided proximate to an electrode pair. An electric field is generated by electrodes of the electrode pair to associate the at least one nanowire with the electrodes. The electrode pair is aligned with a region of the destination surface. The at least one nanowire is deposited from the electrode pair to the region. In another aspect, a plurality of electrical devices is provided proximate to an electrode pair. An electric field is generated by electrodes of the electrode pair to associate an electrical device of the plurality of electrical devices with the electrodes. The electrode pair is aligned with a region of the destination surface. The electrical device is deposited from the electrode pair to the region.

摘要翻译： 描述了将纳米线和电气装置应用于表面的方法和系统。 在第一方面，在电极对附近提供至少一个纳米线。 由电极对的电极产生电场，以将至少一个纳米线与电极相关联。 电极对与目的地表面的区域对准。 至少一个纳米线从电极对沉积到该区域。 在另一方面，在电极对附近提供多个电气装置。 由电极对的电极产生电场，以将多个电气装置中的电气装置与电极相关联。 电极对与目的地表面的区域对准。 电器件从电极对沉积到该区域。

公开(公告)号：US20120135158A1

公开(公告)日：2012-05-31

申请号：US13322117

申请日：2010-05-25

申请人： Erik Freer ,  James M. Hamilton ,  David P. Stumbo ,  Kenji Komiya ,  Akihide Shibata

发明人： Erik Freer ,  James M. Hamilton ,  David P. Stumbo ,  Kenji Komiya ,  Akihide Shibata

IPC分类号： B05D5/00 ,  B05C9/12 ,  B05D3/14 ,  B82Y30/00

CPC分类号： C25D13/02 ,  B82Y10/00 ,  B82Y40/00 ,  C25D13/22 ,  C25D17/12 ,  H01L21/02603 ,  H01L21/326 ,  H01L21/67703 ,  H01L29/0665 ,  H01L29/0673 ,  Y10S977/89 ,  Y10S977/936

摘要： Methods, systems, and apparatuses for nanowire deposition are provided. A deposition system includes an enclosed flow channel, an inlet port, and an electrical signal source. The inlet port provides a suspension that includes nanowires into the channel. The electrical signal source is coupled to an electrode pair in the channel to generate an electric field to associate at least one nanowire from the suspension with the electrode pair. The deposition system may include various further features, including being configured to receive multiple solution types, having various electrode geometries, having a rotatable flow channel, having additional electrical conductors, and further aspects.

摘要翻译： 提供了纳米线沉积的方法，系统和装置。 沉积系统包括封闭的流动通道，入口端口和电信号源。 入口端口提供了包括纳米线进入通道的悬浮液。 电信号源耦合到通道中的电极对以产生电场，以将至少一个来自悬架的纳米线与电极对相关联。 沉积系统可以包括各种其它特征，包括被配置为接收具有各种电极几何形状的多种溶液类型，具有可旋转的流动通道，具有附加的电导体以及其它方面。