MAGNETORESISTIVE STACK/STRUCTURE AND METHODS THEREFOR

    公开(公告)号:US20200235288A1

    公开(公告)日:2020-07-23

    申请号:US16744963

    申请日:2020-01-16

    Abstract: The present disclosure is drawn to, among other things, a magnetoresistive device and a magnetoresistive memory comprising a plurality of such magnetoresistive devices. In some aspects, a magnetoresistive device may include a magnetically fixed region, a magnetically free region above or below the magnetically fixed region, and an intermediate region positioned between the magnetically fixed region and the magnetically free region, wherein the intermediate region includes a first dielectric material. The magnetoresistive device may also include encapsulation layers formed on opposing side walls of the magnetically free region, wherein the encapsulation layers include the first dielectric material.

    MAGNETORESISTIVE DEVICES AND METHODS THEREFOR

    公开(公告)号:US20210249589A1

    公开(公告)日:2021-08-12

    申请号:US16783740

    申请日:2020-02-06

    Abstract: A magnetoresistive device may include one or more electrodes or electrically conductive lines and a fixed region and a free region disposed between the electrodes or electrically conductive lines. The fixed region may have a fixed magnetic state and the free region may be configured to have a first magnetic state and a second magnetic state. The free region may store a first value when in the first magnetic state and store a second value when in the second magnetic state. The magnetoresistive device may further include a dielectric layer between the free region and the fixed region and a spin-Hall (SH) material proximate to at least a portion of the free region. An insertion layer may be disposed between the SH material and the free region.

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