METHODS OF FORMING MAGNETORESISTIVE DEVICES AND INTEGRATED CIRCUITS

    公开(公告)号:US20200286950A1

    公开(公告)日:2020-09-10

    申请号:US16881958

    申请日:2020-05-22

    Abstract: Magnetoresistive device architectures and methods for manufacturing are presented that facilitate integration of process steps associated with forming such devices into standard process flows used for surrounding logic/circuitry. In some embodiments, the magnetoresistive device structures are designed such that the devices are able to fit within the vertical dimensions of the integrated circuit associated with a single metal layer and a single layer of interlayer dielectric material. Integrating the processing for the magnetoresistive devices can include using the same standard interlayer dielectric material as used in the surrounding circuits on the integrated circuit as well as using standard vias to interconnect to at least one of the electrodes of the magnetoresistive devices.

    MAGNETORESISTIVE STACK/STRUCTURE AND METHODS THEREFOR

    公开(公告)号:US20200235288A1

    公开(公告)日:2020-07-23

    申请号:US16744963

    申请日:2020-01-16

    Abstract: The present disclosure is drawn to, among other things, a magnetoresistive device and a magnetoresistive memory comprising a plurality of such magnetoresistive devices. In some aspects, a magnetoresistive device may include a magnetically fixed region, a magnetically free region above or below the magnetically fixed region, and an intermediate region positioned between the magnetically fixed region and the magnetically free region, wherein the intermediate region includes a first dielectric material. The magnetoresistive device may also include encapsulation layers formed on opposing side walls of the magnetically free region, wherein the encapsulation layers include the first dielectric material.

    METHODS AND DEVICES FOR HEALING RESET ERRORS IN A MAGNETIC MEMORY

    公开(公告)号:US20190087250A1

    公开(公告)日:2019-03-21

    申请号:US16174557

    申请日:2018-10-30

    Abstract: A method is provided for healing reset errors for a magnetic memory using destructive read with selective write-back, including for example, a self-referenced read of spin-torque bits in an MRAM. Memory cells are prepared for write back by one of identifying memory cells determined in error using an error correcting code and inverting the inversion bit for those memory cells determined in error identifying memory cells determined in error using an error correcting code and resetting a portion of the memory cells to the first state; and resetting one or more memory cells to the first state.

    METHODS OF FORMING MAGNETORESISTIVE DEVICES AND INTEGRATED CIRCUITS

    公开(公告)号:US20230100514A1

    公开(公告)日:2023-03-30

    申请号:US18045539

    申请日:2022-10-11

    Abstract: Magnetoresistive device architectures and methods for manufacturing are presented that facilitate integration of process steps associated with forming such devices into standard process flows used for surrounding logic/circuitry. In some embodiments, the magnetoresistive device structures are designed such that the devices are able to fit within the vertical dimensions of the integrated circuit associated with a single metal layer and a single layer of interlayer dielectric material. Integrating the processing for the magnetoresistive devices can include using the same standard interlayer dielectric material as used in the surrounding circuits on the integrated circuit as well as using standard vias to interconnect to at least one of the electrodes of the magnetoresistive devices.

    ECC WORD CONFIGURATION FOR SYSTEM-LEVEL ECC COMPATIBILITY

    公开(公告)号:US20190199375A1

    公开(公告)日:2019-06-27

    申请号:US16288664

    申请日:2019-02-28

    CPC classification number: H03M13/2906 G06F11/1012 G06F11/1076

    Abstract: In some examples, a memory device includes memory arrays configured to store pages of data organized into multiple ECC words. The memory device also includes at least one input/output pad for each ECC word associated with a page, such that a first level of error correction may be performed by the memory device on each of the ECC words associated with a page and a second level of error correction may be performed on the data output by each of the input/output pads during a particular period of time. Each of the one or more input/output pads of the memory device may be configured to provide only one bit of data per ECC word to an external source during an access from an external source.

Patent Agency Ranking