公开(公告)号：US20180120485A1

公开(公告)日：2018-05-03

申请号：US15802803

申请日：2017-11-03

Applicant: FUJIFILM Corporation

Inventor： Kazuya OOTA ,  Daisuke SASAKI ,  Yuki HIRAI ,  Takahiro OKAWARA ,  Kazuto SHIMADA ,  Keisuke ARIMURA

IPC: G02B5/22 ,  G02B13/14 ,  C09B23/00

Abstract: An infrared absorbing composition which is used for forming an infrared cut filter in a solid image pickup element having the infrared cut filter includes at least one infrared absorber having an absorption maximum at a wavelength of 650 nm or longer which is selected from polymethine colorants.

公开(公告)号：US20180188428A1

公开(公告)日：2018-07-05

申请号：US15899850

申请日：2018-02-20

Applicant: FUJIFILM Corporation

Inventor： Keisuke ARIMURA ,  Kazuto SHIMADA ,  Takahiro OKAWARA ,  Takashi KAWASHIMA ,  Hidenori TAKAHASHI

IPC: G02B5/20

CPC classification number: G02B5/208 ,  B32B7/02 ,  B32B27/18 ,  G02B5/22 ,  H01L27/14 ,  H01L27/1462

Abstract: A near-infrared cut filter has a first infrared absorbing layer including an infrared absorber A, a second infrared absorbing layer including an infrared absorber C, and a resin layer disposed between the first infrared absorbing layer and the second infrared absorbing layer.

公开(公告)号：US20150197079A1

公开(公告)日：2015-07-16

申请号：US14669369

申请日：2015-03-26

Applicant: FUJIFILM Corporation

Inventor： Takao MIZOGUCHI ,  Keisuke ARIMURA

IPC: B41C1/02 ,  B32B38/00 ,  B32B37/14

CPC classification number: B41C1/02 ,  B29C63/06 ,  B32B37/142 ,  B32B38/0008 ,  B41C1/05 ,  B41N1/12

Abstract: There is provided a process for producing a cylindrical printing plate precursor, comprising (1) a preparation step of preparing a cured resin sheet, (2) a wrapping step of wrapping the cured resin sheet around a cylindrical support, (3) a supply step of supplying a curable composition to a gap formed between end parts to be joined of the cured resin sheet, and (4) a curing step of curing the curable composition, the curable composition comprising a solvent that dissolves or swells the cured resin sheet, the solvent having a content of 0.2 to 2.0 mass % of the total amount of the curable composition, and the curable composition having a percentage dimensional change on curing of no greater than 2%.

Abstract translation: 提供了一种制造圆柱形印版前体的方法，包括（1）制备固化树脂片的制备步骤，（2）将固化的树脂片缠绕在圆柱形支撑体上的包裹步骤，（3）供应步骤 将固化性组合物供给到形成在所述固化树脂片的接合端部之间的间隙，以及（4）固化所述固化性组合物的固化步骤，所述固化性组合物含有使所述固化树脂片溶解或溶胀的溶剂， 溶剂，其含量为可固化组合物总量的0.2〜2.0质量％，固化组合物的固化倍率的百分比不大于2％。

公开(公告)号：US20150190991A1

公开(公告)日：2015-07-09

申请号：US14662312

申请日：2015-03-19

Applicant: FUJIFILM CORPORATION

Inventor： Keisuke ARIMURA

IPC: B32B37/02 ,  B41F5/24 ,  B32B37/06 ,  B32B37/14 ,  B32B38/00

CPC classification number: B32B37/02 ,  B29C53/40 ,  B29C63/42 ,  B32B37/06 ,  B32B37/142 ,  B32B38/0008 ,  B32B2038/0052 ,  B41C1/05 ,  B41C1/18 ,  B41F5/24 ,  B41N1/22

Abstract: To provide a production process that can easily produce a cylindrical printing plate precursor having excellent thickness precision.A process for producing a cylindrical printing plate precursor, comprising in this order (i) a preparation step of preparing a sheet-shaped resin, (ii) a disposition step of disposing on the outer periphery of a cylindrical support a cylindrical resin formed into a cylindrical shape by joining opposite end parts of the sheet-shaped resin, and (iii) a shrinkage step of shrinking the cylindrical resin so as to be in intimate contact with the cylindrical support.

Abstract translation: 提供能够容易地制造出具有优异的厚度精度的圆筒形印版前体的制造方法。 一种制造圆柱形印版前体的方法，其包括以下步骤：（i）制备片状树脂的制备步骤，（ii）配置步骤，在圆柱形支撑体的外周上设置形成为 通过连接片状树脂的相对端部而形成圆柱形，和（iii）收缩步骤，使圆柱形树脂收缩以与圆柱形支撑件紧密接触。

公开(公告)号：US20180292586A1

公开(公告)日：2018-10-11

申请号：US16008209

申请日：2018-06-14

Applicant: FUJIFILM Corporation

Inventor： Seiichi HITOMI ,  Takashi KAWASHIMA ,  Keisuke ARIMURA ,  Takahiro OKAWARA

IPC: G02B5/22 ,  C08L101/02 ,  C08L33/10 ,  C08L43/04 ,  C08K5/01 ,  H01L27/146 ,  G02B5/28 ,  C08K5/54

Abstract: Provided are a near infrared absorbing composition with which a cured film having excellent solvent resistance and thermal shock resistance can be manufactured, a near infrared cut filter, a method of manufacturing a near infrared cut filter, a solid image pickup element, a camera module, and an image display device. The near infrared absorbing composition includes: a resin A that satisfies the following condition a1; an infrared absorber B; and a solvent D. At least the resin A has a crosslinking group, or the near infrared absorbing composition further includes a compound C having a crosslinking group that is different from the resin A. condition a1: in a case where the resin A does not have a crosslinking group, a glass transition temperature of the resin A measured by differential scanning calorimetry is 0° C. to 100° C., and in a case where the resin A has a crosslinking group, a glass transition temperature of a resin having a structure in which a portion which forms a crosslinking bond in the crosslinking group of the resin A is substituted with a hydrogen atom is 0° C. to 100° C., the glass transition temperature being measured by differential scanning calorimetry.

公开(公告)号：US20180017720A1

公开(公告)日：2018-01-18

申请号：US15717025

申请日：2017-09-27

Applicant: FUJIFILM Corporation

Inventor： Keisuke ARIMURA ,  Kazuto SHIMADA ,  Daisuke SASAKI ,  Yuki HIRAI ,  Tokihiko MATSUMURA

IPC: G02B5/20 ,  C09B23/16 ,  C09B57/00 ,  G02B5/00 ,  H01L27/146

CPC classification number: G02B5/208 ,  C09B23/0066 ,  C09B23/086 ,  C09B23/164 ,  C09B57/00 ,  C09B57/007 ,  G02B5/003 ,  G02B5/22 ,  H01L27/14621

Abstract: To provide an infrared cut filter having a wide view angle and excellent infrared shieldability, a kit for manufacturing the infrared cut filter, and a solid-state imaging device. An infrared cut filter has: a copper-containing transparent layer 1. The copper-containing transparent layer 1 further contains an infrared absorbing agent, or an infrared absorbing agent-containing layer 2 is further provided.

公开(公告)号：US20170102483A1

公开(公告)日：2017-04-13

申请号：US15389546

申请日：2016-12-23

Applicant: FUJIFILM Corporation

Inventor： Takashi KAWASHIMA ,  Keisuke ARIMURA

IPC: G02B1/04 ,  C08K5/56 ,  H04N5/238 ,  G02B5/22 ,  G02B5/20

CPC classification number: G02B1/04 ,  C08K5/56 ,  G02B5/208 ,  G02B5/22 ,  H01L27/14618 ,  H01L27/14625 ,  H04N5/2257 ,  H04N5/238 ,  C08L25/06 ,  C08L33/26 ,  C08L33/08 ,  C08L33/10

Abstract: Provided are a near infrared ray absorbent composition which can form a cured film having excellent heat resistance while maintaining high near infrared ray shielding properties, and a near infrared ray cut filter, a manufacturing method of a near infrared ray cut filter, a solid image pickup element, and a camera module using the near infrared ray absorbent composition. The near infrared ray absorbent composition contains a compound having a partial structure represented by M-X, and a near infrared ray absorbent compound, and a content of the compound having a partial structure represented by M-X is greater than or equal to 15 mass % with respect to a total solid content of the near infrared ray absorbent composition. Here, M is an atom selected from Si, Ti, Zr, and Al, X is one type selected from a hydroxy group, an alkoxy group, an acyloxy group, a phosphoryloxy group, a sulfonyloxy group, an amino group, an oxime group, and O═C(Ra)(Rb), Ra and Rb each independently represent a monovalent organic group, and in a case in which X is O═C(Ra)(Rb), X is bonded to M by an unshared electron pair of an oxygen atom of a carbonyl group.

公开(公告)号：US20210139708A1

公开(公告)日：2021-05-13

申请号：US17157195

申请日：2021-01-25

Applicant: FUJIFILM Corporation

Inventor： Tokihiko MATSUMURA ,  Daisuke SASAKI ,  Kyohei ARAYAMA ,  Yoshihiro JIMBO ,  Kazuya OOTA ,  Keisuke ARIMURA ,  Takahiro OKAWARA

IPC: C09B23/14 ,  G02B5/20 ,  C09B57/00 ,  G02B5/22 ,  C08F2/48 ,  C08L33/10 ,  C09B23/08 ,  C09B23/01 ,  C08F220/18 ,  C08K5/55 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  G03F7/38 ,  H01L27/146 ,  H01L27/148

Abstract: A composition includes two or more near infrared absorbing compounds having an absorption maximum in a wavelength range of 650 to 1000 nm and having a solubility of 0.1 mass % or lower in water at 23° C., in which the two or more near infrared absorbing compounds include a first near infrared absorbing compound having an absorption maximum in a wavelength range of 650 to 1000 nm, and a second near infrared absorbing compound having an absorption maximum in a wavelength range of 650 to 1000 nm which is shorter than the absorption maximum of the first near infrared absorbing compound, and a difference between the absorption maximum of the first near infrared absorbing compound and the absorption maximum of the second near infrared absorbing compound is 1 to 150 nm.

公开(公告)号：US20190196073A1

公开(公告)日：2019-06-27

申请号：US16287263

申请日：2019-02-27

Applicant: FUJIFILM Corporation

Inventor： Suguru SAMEJIMA ,  Tokihiko MATSUMURA ,  Keisuke ARIMURA ,  Shunsuke KITAJIMA

IPC: G02B5/28 ,  H01L27/146 ,  H01L31/0216 ,  G02B1/04

CPC classification number: G02B5/282 ,  G02B1/04 ,  G02B5/20 ,  G02B5/22 ,  G02B5/285 ,  G02F1/1335 ,  G03F7/004 ,  G03F7/032 ,  H01L27/144 ,  H01L27/146 ,  H01L27/14625 ,  H01L31/02162

Abstract: Provided are a composition with which a film having excellent heat resistance and light fastness can be provided, the film, a near infrared cut filter, a pattern forming method, a laminate, a solid image pickup element, an image display device, a camera module, and an infrared sensor. The composition includes: a near infrared absorbing compound having an absorption maximum in a wavelength range of 650 to 1000 nm; an organic solvent; and a resin, in which the near infrared absorbing compound is at least one selected from the group consisting of a pyrrolopyrrole compound, a rylene compound, an oxonol compound, a squarylium compound, a croconium compound, a zinc phthalocyanine compound, a cobalt phthalocyanine compound, a vanadium phthalocyanine compound, a copper phthalocyanine compound, a magnesium phthalocyanine compound, a naphthalocyanine compound, a pyrylium compound, an azulenium compound, an indigo compound, and a pyrromethene compound, and a solubility of the near infrared absorbing compound in propylene glycol methyl ether acetate at 25° C. is 0.01 to 30 mg/L.

公开(公告)号：US20180305552A1

公开(公告)日：2018-10-25

申请号：US16019178

申请日：2018-06-26

Applicant: FUJIFILM Corporation

Inventor： Tokihiko MATSUMURA ,  Daisuke SASAKI ,  Kyohei ARAYAMA ,  Yoshihiro JIMBO ,  Kazuya OOTA ,  Keisuke ARIMURA ,  Takahiro OKAWARA

IPC: C09B23/14 ,  G03F7/00 ,  C08K5/55 ,  G03F7/033 ,  G03F7/031 ,  H01L27/146 ,  H01L27/148 ,  G03F7/16 ,  G03F7/20 ,  G03F7/38 ,  G03F7/32 ,  G02B5/20

CPC classification number: C09B23/145 ,  C08F2/44 ,  C08K5/55 ,  C09B23/00 ,  C09B57/00 ,  C09K3/00 ,  G02B5/20 ,  G02B5/208 ,  G02B5/22 ,  G03F7/0007 ,  G03F7/031 ,  G03F7/033 ,  G03F7/162 ,  G03F7/168 ,  G03F7/2004 ,  G03F7/322 ,  G03F7/38 ,  H01L27/14621 ,  H01L27/14649 ,  H01L27/14806 ,  H01L27/14875

Abstract: The composition includes two or more near infrared absorbing compounds having an absorption maximum in a wavelength range of 650 to 1000 nm and having a solubility of 0.1 mass % or lower in water at 23° C., in which the two or more near infrared absorbing compounds include a first near infrared absorbing compound having an absorption maximum in a wavelength range of 650 to 1000 nm, and a second near infrared absorbing compound having an absorption maximum in a wavelength range of 650 to 1000 nm which is shorter than the absorption maximum of the first near infrared absorbing compound, and a difference between the absorption maximum of the first near infrared absorbing compound and the absorption maximum of the second near infrared absorbing compound is 1 to 150 nm.