摘要:
Some embodiments include methods of forming memory cells. A stack includes ovonic material over an electrically conductive region. The stack is patterned into rails that extend along a first direction. The rails are patterned into pillars. Electrically conductive lines are formed over the ovonic material. The electrically conductive lines extend along a second direction that intersects the first direction. The electrically conductive lines interconnect the pillars along the second direction. Some embodiments include a memory array having first electrically conductive lines extending along a first direction. The lines contain n-type doped regions of semiconductor material. Pillars are over the first conductive lines and contain mesas of the n-type doped regions together with p-type doped regions and ovonic material. Second electrically conductive lines are over the ovonic material and extend along a second direction that intersects the first direction. The second electrically conductive lines interconnect the pillars along the second direction.
摘要:
Some embodiments include methods of forming memory cells. A stack includes ovonic material over an electrically conductive region. The stack is patterned into rails that extend along a first direction. The rails are patterned into pillars. Electrically conductive lines are formed over the ovonic material. The electrically conductive lines extend along a second direction that intersects the first direction. The electrically conductive lines interconnect the pillars along the second direction. Some embodiments include a memory array having first electrically conductive lines extending along a first direction. The lines contain n-type doped regions of semiconductor material. Pillars are over the first conductive lines and contain mesas of the n-type doped regions together with p-type doped regions and ovonic material. Second electrically conductive lines are over the ovonic material and extend along a second direction that intersects the first direction. The second electrically conductive lines interconnect the pillars along the second direction.
摘要:
A nonvolatile memory having a cell comprising an N.sup.+ type source region and drain region embedded in a P.sup.- type substrate and surrounded by respective P-pockets. The drain and source P-pockets are formed in two different high-angle boron implantation steps designed to optimize implantation energy and dosage for ensuring scalability of the cell and avoiding impairment of the snap-back voltage. The resulting cell also presents a higher breakdown voltage as compared with known cells.
摘要:
A CMOS logic portion embedded with a PCM portion is recessed by a gate structure height as measured by a thickness of a gate oxide and a polysilicon gate to provide planarity of the CMOS logic portion with the PCM portion is described.
摘要:
Method for localizing point defects causing column leakage currents in a non-volatile memory device including a plurality of memory cells arranged in rows and columns in a matrix structure, source diffusions, and metal lines which connect said source diffusions to each other. Such a method includes the steps of: modifying the memory device in order to make source diffusions independent of each other and each one electrically connected to a respective row; sequentially biasing the single columns of the matrix; localizing the column to which at least one defective cell belongs, as soon as the leakage current flow occurs in the biased column; by keeping biased the localized column, biasing sequentially the single rows of the matrix to the same potential as that of the localized column; localizing a couple of cells, wherein at least one of them involves the point defects, as soon as the leakage current flow does not occur.
摘要:
A MOS transistor capable of withstanding relatively high voltages is of a type integrated on a region included in a substrate of semiconductor material, having conductivity of a first type and comprising a channel region intermediate between a first active region of source and a second active region of drain. Both these source and drain regions have conductivity of a second type and extend from a first surface of the substrate. The transistor also has a gate which includes at least a first polysilicon layer overlying the first surface of at least the channel region, to which it is coupled capacitively through a gate oxide layer. According to the invention, the first polysilicon layer includes a mid-portion which only overlies the channel region and has a first total conductivity of the first type, and a peripheral portion with a second total conductivity differentiated from the first total conductivity. The peripheral portion partly overlies the source and drain active regions toward the channel region.
摘要:
The method includes the following steps: delimiting active areas on a substrate, forming gate electrodes insulated from the substrate on the active areas, and subjecting the front surface of the substrate to several implantation steps with doping ion beams to form source and drain regions with the use of the gate electrodes as masks. The direction of the implantation beam is defined by an angle of inclination to the front surface and by an orientation to a reference line on the front surface. To avoid performing numerous implantation steps without foregoing channels of uniform and constant length, the widths of the gate electrode strips are determined at the design stage in relation to the orientation of the strips to the reference line and on the orientation of the directions of the implant beams.
摘要:
A process for the formation of a device edge morphological structure for protecting and sealing peripherally an electronic circuit integrated in a major surface of a substrate of semiconductor material. The electronic circuit is of the type that calls for formation above the major surface of at least one dielectric multilayer. The dielectric multilayer includes a layer of amorphous planarizing material having a continuous portion extending between two contiguous areas with a more internal first area and a more external second area in the morphological structure. The device edge morphological structure includes in the substrate an excavation on the side of the major surface at the more internal first area of the morphological structure in a zone in which is present the continuous portion of the dielectric multilayer.
摘要:
A flash EEPROM having an array of memory cells which include a common source line connecting together source electrodes of the memory cells. A resistive feedback element is coupled in series between the common source line and a positive potential when the memory cells must be electrically erased. The Flash EEPROM includes a voltage limiting circuit coupled to the common source line for limiting the potential of the common source line to be prescribed maximum value lower than the positive potential.
摘要:
Chip Outline Band (COB) structure for an integrated circuit integrated in a semiconductor chip having a semiconductor substrate of a first conductivity type and biased at a common reference potential of the integrated circuit, the COB structure comprising a substantially annular region formed in the substrate along a periphery thereof, and at least one annular conductor region superimposed on and contacting the substantially annular region, wherein the substantially annular region is electrically connected at the common reference potential.