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公开(公告)号：US09599472B2
公开(公告)日：2017-03-21
申请号：US14658579
申请日：2015-03-16
发明人： Cenk Acar
IPC分类号： G01P15/18 , G01C19/5733 , G01P15/125 , G01P15/08
CPC分类号： G01C19/5733 , G01P15/125 , G01P15/18 , G01P2015/0811 , G01P2015/082 , G01P2015/0848
摘要： This document discusses among other things apparatus and methods for a proof mass including split z-axis portions. An example proof mass can include a center portion configured to anchor the proof-mass to an adjacent layer, a first z-axis portion configure to rotate about a first axis using a first hinge, the first axis parallel to an x-y plane orthogonal to a z-axis, a second z-axis portion configure to rotate about a second axis using a second hinge, the second axis parallel to the x-y plane, wherein the first z-axis portion is configured to rotate independent of the second z-axis portion.
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公开(公告)号：US09586813B2
公开(公告)日：2017-03-07
申请号：US14804691
申请日：2015-07-21
CPC分类号： B81B7/008 , B81B2201/0235 , B81B2201/0242 , B81B2201/0264 , B81B2207/07 , B81C1/0023 , H01L23/481 , H01L2224/131 , H01L2924/1461 , H05K1/18 , H01L2924/014 , H01L2924/00
摘要： This document refers to multi-die micromechanical system (MEMS) packages. In an example, a multi-die MEMS package can include a controller integrated circuit (IC) configured to couple to a circuit board, a MEMS IC mounted to a first side of the controller IC, a through silicon via extending through the controller IC between the first side and a second side of the controller IC, the second side opposite the first side, and wherein the MEMS IC is coupled to the through silicon via.
摘要翻译： 本文件涉及多模微机械系统（MEMS）封装。 在一个示例中，多管芯MEMS封装可以包括被配置为耦合到电路板的控制器集成电路（IC），安装到控制器IC的第一侧的MEMS IC，穿过控制器IC的贯穿硅通孔 控制器IC的第一侧和第二侧，与第一侧相对的第二侧，并且其中MEMS IC耦合到通过硅通孔。
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公开(公告)号：US10050155B2
公开(公告)日：2018-08-14
申请号：US15005783
申请日：2016-01-25
发明人： Cenk Acar
IPC分类号： G01P21/02 , H01L29/84 , G01C19/5755 , G01P15/125 , G01P15/18 , B81B7/04 , G01P15/08
CPC分类号： H01L29/84 , B81B7/04 , B81B2201/0235 , B81B2201/0242 , B81B2203/051 , B81B2203/053 , B81B2203/055 , B81B2203/056 , B81B2203/058 , B81B2207/094 , G01C19/5755 , G01P15/125 , G01P15/18 , G01P2015/0848
摘要： This document discusses, among other things, a cap wafer and a via wafer configured to encapsulate a single proof-mass 3-axis gyroscope formed in an x-y plane of a device layer. The single proof-mass 3-axis gyroscope can include a main proof-mass section suspended about a single, central anchor, the main proof-mass section including a radial portion extending outward towards an edge of the 3-axis gyroscope sensor, a central suspension system configured to suspend the 3-axis gyroscope from the single, central anchor, and a drive electrode including a moving portion and a stationary portion, the moving portion coupled to the radial portion, wherein the drive electrode and the central suspension system are configured to oscillate the 3-axis gyroscope about a z-axis normal to the x-y plane at a drive frequency.
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公开(公告)号：US20150185012A1
公开(公告)日：2015-07-02
申请号：US14658579
申请日：2015-03-16
发明人： Cenk Acar
IPC分类号： G01C19/5733
CPC分类号： G01C19/5733 , G01P15/125 , G01P15/18 , G01P2015/0811 , G01P2015/082 , G01P2015/0848
摘要： This document discusses among other things apparatus and methods for a proof mass including split z-axis portions. An example proof mass can include a center portion configured to anchor the proof-mass to an adjacent layer, a first z-axis portion configure to rotate about a first axis using a first hinge, the first axis parallel to an x-y plane orthogonal to a z-axis, a second z-axis portion configure to rotate about a second axis using a second hinge, the second axis parallel to the x-y plane, wherein the first z-axis portion is configured to rotate independent of the second z-axis portion.
摘要翻译： 本文件还讨论了包括分离z轴部分的证明质量的装置和方法。 示例性质量块可以包括构造成将证明物质锚定到相邻层的中心部分，第一z轴部分构造成使用第一铰链围绕第一轴线旋转，第一轴线平行于与 z轴，第二z轴部分构造成使用第二铰链绕第二轴线旋转，第二轴线平行于xy平面，其中第一z轴部分构造成独立于第二z轴部分旋转 。
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5.发明授权公开(公告)号：US08813564B2
公开(公告)日：2014-08-26
申请号：US13755841
申请日：2013-01-31
发明人： Cenk Acar
IPC分类号： G01C19/56 , B81B3/00 , B81C1/00 , G01C19/5712
CPC分类号： B81B3/0018 , B81B3/0059 , B81B2201/0242 , B81B2203/0154 , B81C1/00134 , G01C19/56 , G01C19/5712
摘要： Various examples include microelectromechanical die for sensing motion that includes symmetrical proof-mass electrodes interdigitated with asymmetrical stator electrodes. Some of these examples include electrodes that are curved around an axis orthogonal to the plane in which the electrodes are disposed. An example provides vertical flexures coupling an inner gimbal to a proof-mass in a manner permitting flexure around a horizontal axis.
摘要翻译： 各种示例包括用于感测运动的微机电模具，其包括与不对称定子电极相互指向的对称的证明质量电极。 这些示例中的一些包括围绕垂直于其中布置电极的平面的轴线弯曲的电极。 一个例子提供垂直弯曲，其以允许围绕水平轴线弯曲的方式将内万向架耦合到校验块。
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公开(公告)号：US20160264404A1
公开(公告)日：2016-09-15
申请号：US15005783
申请日：2016-01-25
发明人： Cenk Acar
IPC分类号： B81B7/04 , G01P15/18 , G01C19/5755
CPC分类号： H01L29/84 , B81B7/04 , B81B2201/0235 , B81B2201/0242 , B81B2203/051 , B81B2203/053 , B81B2203/055 , B81B2203/056 , B81B2203/058 , B81B2207/094 , G01C19/5755 , G01P15/125 , G01P15/18 , G01P2015/0848
摘要： This document discusses, among other things, a cap wafer and a via wafer configured to encapsulate a single proof-mass 3-axis gyroscope formed in an x-y plane of a device layer. The single proof-mass 3-axis gyroscope can include a main proof-mass section suspended about a single, central anchor, the main proof-mass section including a radial portion extending outward towards an edge of the 3-axis gyroscope sensor, a central suspension system configured to suspend the 3-axis gyroscope from the single, central anchor, and a drive electrode including a moving portion and a stationary portion, the moving portion coupled to the radial portion, wherein the drive electrode and the central suspension system are configured to oscillate the 3-axis gyroscope about a z-axis normal to the x-y plane at a drive frequency.
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公开(公告)号：US09278845B2
公开(公告)日：2016-03-08
申请号：US13755953
申请日：2013-01-31
发明人： Cenk Acar
IPC分类号： G01C19/56 , B81B3/00 , G01C19/5712 , B81C1/00
CPC分类号： B81B3/0018 , B81B3/0059 , B81B2201/0242 , B81B2203/0154 , B81C1/00134 , G01C19/56 , G01C19/5712
摘要： Various examples include microelectromechanical die for sensing motion that includes symmetrical proof-mass electrodes interdigitated with asymmetrical stator electrodes. Some of these examples include electrodes that are curved around an axis orthogonal to the plane in which the electrodes are disposed. An example provides vertical flexures coupling an inner gimbal to a proof-mass in a manner permitting flexure around a horizontal axis.
摘要翻译： 各种示例包括用于感测运动的微机电模具，其包括与不对称定子电极相互指向的对称的证明质量电极。 这些示例中的一些包括围绕垂直于其中布置电极的平面的轴线弯曲的电极。 一个例子提供垂直弯曲，其以允许围绕水平轴线弯曲的方式将内万向架耦合到校验块。
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公开(公告)号：US20150321904A1
公开(公告)日：2015-11-12
申请号：US14804691
申请日：2015-07-21
CPC分类号： B81B7/008 , B81B2201/0235 , B81B2201/0242 , B81B2201/0264 , B81B2207/07 , B81C1/0023 , H01L23/481 , H01L2224/131 , H01L2924/1461 , H05K1/18 , H01L2924/014 , H01L2924/00
摘要： This document refers to multi-die micromechanical system (MEMS) packages. In an example, a multi-die MEMS package can include a controller integrated circuit (IC) configured to couple to a circuit board, a MEMS IC mounted to a first side of the controller IC, a through silicon via extending through the controller IC between the first side and a second side of the controller IC, the second side opposite the first side, and wherein the MEMS IC is coupled to the through silicon via.
摘要翻译： 本文件涉及多模微机械系统（MEMS）封装。 在一个示例中，多管芯MEMS封装可以包括被配置为耦合到电路板的控制器集成电路（IC），安装到控制器IC的第一侧的MEMS IC，穿过控制器IC的贯穿硅通孔 控制器IC的第一侧和第二侧，与第一侧相对的第二侧，并且其中MEMS IC耦合到通过硅通孔。
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