公开(公告)号：US20060099733A1

公开(公告)日：2006-05-11

申请号：US10985312

申请日：2004-11-09

Applicant: Frank Geefay ,  Richard Ruby

Inventor： Frank Geefay ,  Richard Ruby

IPC: H01L21/44

CPC classification number: H01L21/50 ,  B81C1/00269 ,  B81C2203/0118 ,  H01L21/6835

Abstract: The present invention provides a first wafer and a second wafer having a device. A separation layer is formed on the first wafer. A cap is formed on the separation layer. The cap and the second wafer are bonded using a gasket. The first wafer is separated from the cap to form the semiconductor package comprised of the cap, the gasket, and the second wafer.

Abstract translation: 本发明提供了具有装置的第一晶片和第二晶片。 在第一晶片上形成分离层。 在分离层上形成盖。 盖和第二晶片使用垫圈结合。 第一晶片与盖分离以形成由盖，垫圈和第二晶片组成的半导体封装。

公开(公告)号：US20070020807A1

公开(公告)日：2007-01-25

申请号：US11540412

申请日：2006-09-28

Applicant: Frank Geefay ,  Richard Ruby

Inventor： Frank Geefay ,  Richard Ruby

IPC: H01L21/00

CPC classification number: H01L21/50 ,  B81C1/00269 ,  B81C2203/0118 ,  H01L21/6835

Abstract: A method of fabricating a protective structure and a packaged structure are described.

Abstract translation: 描述了制造保护结构和封装结构的方法。

公开(公告)号：US20070001544A1

公开(公告)日：2007-01-04

申请号：US11174364

申请日：2005-06-30

Applicant: Frank Geefay

Inventor： Frank Geefay

IPC: H02N2/00

CPC classification number: H03H9/173 ,  H03H3/02 ,  H03H9/0547 ,  H03H2003/021

Abstract: A device includes a device substrate defining a pit in a topside of the device substrate, a film bulk-wave acoustic resonator (FBAR) mounted over the pit on the device substrate, a first contact pad on a backside of the device substrate that is coupled to a bottom electrode of the FBAR, and a second contact pad on the backside of the device substrate that is coupled to a top electrode of the FBAR.

Abstract translation: 一种器件包括在器件衬底的顶侧中限定凹坑的器件衬底，安装在器件衬底上的凹坑上的膜体波声共振器（FBAR），在器件衬底背面的第一接触焊盘， 到FBAR的底部电极，以及耦合到FBAR的顶部电极的器件衬底的背面上的第二接触焊盘。

公开(公告)号：US20070004079A1

公开(公告)日：2007-01-04

申请号：US11173367

申请日：2005-06-30

Applicant: Frank Geefay ,  Richard Ruby

Inventor： Frank Geefay ,  Richard Ruby

IPC: H01L21/00 ,  H01L21/4763 ,  H01L21/44

CPC classification number: H03H9/105 ,  H01L21/76898 ,  H03H9/10

Abstract: A device package includes a device substrate and a cap mounted on the device substrate. The device substrate includes a contact pad. The cap defines a via with a slightly sloped sidewall through the cap, a contactor extending from an interior surface of the cap, a contactor pad over the contactor, a via pad on the interior surface of the cap over the via and coupled to the contactor pad, and a via contact over the exterior surface of the cap and in the via coupled to the via pad. The contactor is offset from the via. When the cap is mounted on the device substrate, the contactor pad on the contactor is pressed and cold welded onto the contact pad on the device substrate.

Abstract translation: 器件封装包括器件衬底和安装在器件衬底上的帽。 器件衬底包括接触焊盘。 所述盖限定了通过所述盖具有稍微倾斜的侧壁的通孔，从所述盖的内表面延伸的接触器，所述接触器上的接触器垫，所述盖的内表面上的通孔垫在所述通孔上并且联接到所述接触器 垫，以及在盖的外表面上的通孔接触件和连接到通孔垫的通孔中。 接触器偏离通孔。 当盖安装在设备基板上时，接触器上的接触器垫被压制并冷焊在设备基板上的接触垫上。

公开(公告)号：US20070075402A1

公开(公告)日：2007-04-05

申请号：US11243569

申请日：2005-10-05

Applicant: Frank Geefay ,  David Dutton ,  Qing Bai

Inventor： Frank Geefay ,  David Dutton ,  Qing Bai

IPC: H01L29/40

CPC classification number: B81C1/00269 ,  B81C2203/019 ,  H01L23/10 ,  H01L23/3142 ,  H01L24/29 ,  H01L24/32 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29298 ,  H01L2224/83365 ,  H01L2224/83385 ,  H01L2225/06575 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/01031 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: An attachment system. The attachment system includes a first structure and a second structure. The first structure has a surface and a recess in the surface. The second structure is molded into the recess and extends above the surface. The second structure adheres to the first structure at a boundary of the recess.

Abstract translation: 附件系统。 附件系统包括第一结构和第二结构。 第一结构在表面具有表面和凹部。 第二结构被模制成凹槽并在表面上方延伸。 第二结构在凹槽的边界附着于第一结构。

公开(公告)号：US20050142692A1

公开(公告)日：2005-06-30

申请号：US11071550

申请日：2005-03-02

Applicant: Kendra Gallup ,  Frank Geefay ,  Ronald Fazzio ,  Martha Johnson ,  Carrie Guthrie ,  Tanya Snyder ,  Richard Ruby

Inventor： Kendra Gallup ,  Frank Geefay ,  Ronald Fazzio ,  Martha Johnson ,  Carrie Guthrie ,  Tanya Snyder ,  Richard Ruby

IPC: H01L23/02 ,  B81B7/00 ,  B81C3/00 ,  G02B6/42 ,  H01L21/00 ,  H01L21/46 ,  H01L21/60 ,  H01L23/495 ,  H01L31/0203 ,  H01L31/0232 ,  H01L33/00 ,  H01S5/00 ,  H01S5/02 ,  H01S5/022 ,  H01S5/026

CPC classification number: H01S5/02288 ,  G02B6/4206 ,  H01L2924/0002 ,  H01S5/02248 ,  H01S5/02292 ,  H01L2924/00

Abstract: A wafer-level package includes a first wafer comprising a bonding pad, an optoelectronic device on the first wafer, and a second wafer comprising a gasket. The second wafer is attached to the first wafer by a bond between the gasket and the bonding pad.

公开(公告)号：US20050062122A1

公开(公告)日：2005-03-24

申请号：US10666363

申请日：2003-09-19

Applicant: Kendra Gallup ,  Frank Geefay ,  Ronald Fazzio ,  Martha Johnson ,  Carrie Guthrie ,  Tanya Snyder ,  Richard Ruby

Inventor： Kendra Gallup ,  Frank Geefay ,  Ronald Fazzio ,  Martha Johnson ,  Carrie Guthrie ,  Tanya Snyder ,  Richard Ruby

IPC: H01L23/02 ,  B81B7/00 ,  B81C3/00 ,  G02B6/42 ,  H01L21/00 ,  H01L21/46 ,  H01L21/60 ,  H01L23/495 ,  H01L31/0203 ,  H01L31/0232 ,  H01L33/00 ,  H01S5/00 ,  H01S5/02 ,  H01S5/022 ,  H01S5/026

CPC classification number: H01S5/02288 ,  G02B6/4206 ,  H01L2924/0002 ,  H01S5/02248 ,  H01S5/02292 ,  H01L2924/00

Abstract: A wafer-level package includes a first wafer comprising a bonding pad, an optoelectronic device on the first wafer, and a second wafer comprising a gasket. The second wafer is attached to the first wafer by a bond between the gasket and the bonding pad.