PROCESS FOR SELECTIVE MASKING OF III-N LAYERS AND FOR THE PREPARATION OF FREE-STANDING III-N LAYERS OR OF DEVICES, AND PRODUCTS OBTAINED THEREBY
    1.
    发明申请
    PROCESS FOR SELECTIVE MASKING OF III-N LAYERS AND FOR THE PREPARATION OF FREE-STANDING III-N LAYERS OR OF DEVICES, AND PRODUCTS OBTAINED THEREBY 有权
    III-N层的选择性掩蔽和自由置换III-N层或器件的制备方法以及获得的产品

    公开(公告)号:US20070163490A1

    公开(公告)日:2007-07-19

    申请号:US11614508

    申请日:2006-12-21

    IPC分类号: C30B23/00 C30B25/00 C30B28/12

    摘要: In a process for forming a mask material on a III-N layer, wherein III denotes an element of the group III of the Periodic Table of Elements, selected from Al, Ga and In, a III-N layer having a surface is provided which comprises more than one facet. Mask material is selectively deposited only on one or multiple, but not on all facets. The deposition of mask material may be particularly carried out during epitaxial growth of a III-N layer under growth conditions, by which (i) growth of at least a further III-N layer selectively on a first type or a first group of facet(s) and (ii) a deposition of mask material selectively on a second type or a second group of facet(s) proceed simultaneously. By the process according to the invention, it is possible to produce free-standing thick III-N layers. Further, semiconductor devices or components having special structures and layers can be produced.

    摘要翻译: 在III-N层上形成掩模材料的方法中,III表示选自Al,Ga和In的元素周期表第III族的元素,提供了具有表面的III-N层, 包括多个方面。 掩模材料仅选择性地沉积在一个或多个上,但不在所有小平面上。 掩模材料的沉积可以在生长条件下在III-N层的外延生长期间特别地进行,其中(i)在第一类型或第一组面上选择性地生长至少另外的III-N层( s)和(ii)选择性地在第二类型或第二组面上沉积掩模材料同时进行。 通过根据本发明的方法,可以生产独立的厚III-N层。 此外,可以制造具有特殊结构和层的半导体器件或部件。

    Process for selective masking of III-N layers and for the preparation of free-standing III-N layers or of devices, and products obtained thereby
    2.
    发明授权
    Process for selective masking of III-N layers and for the preparation of free-standing III-N layers or of devices, and products obtained thereby 有权
    选择性掩蔽III-N层和制备独立III-N层或器件的方法以及由此得到的产物

    公开(公告)号:US07727332B2

    公开(公告)日:2010-06-01

    申请号:US11614508

    申请日:2006-12-21

    IPC分类号: C30B28/12 C30B25/00

    摘要: In a process for forming a mask material on a III-N layer, wherein III denotes an element of the group III of the Periodic Table of Elements, selected from Al, Ga and In, a III-N layer having a surface is provided which comprises more than one facet. Mask material is selectively deposited only on one or multiple, but not on all facets. The deposition of mask material may be particularly carried out during epitaxial growth of a III-N layer under growth conditions, by which (i) growth of at least a further III-N layer selectively on a first type or a first group of facet(s) and (ii) a deposition of mask material selectively on a second type or a second group of facet(s) proceed simultaneously. By the process according to the invention, it is possible to produce free-standing thick III-N layers. Further, semiconductor devices or components having special structures and layers can be produced.

    摘要翻译: 在III-N层上形成掩模材料的方法中,III表示选自Al,Ga和In的元素周期表第III族的元素,提供了具有表面的III-N层, 包括多个方面。 掩模材料仅选择性地沉积在一个或多个上,但不在所有小平面上。 掩模材料的沉积可以在生长条件下在III-N层的外延生长期间特别地进行,其中(i)在第一类型或第一组面上选择性地生长至少另外的III-N层( s)和(ii)选择性地在第二类型或第二组面上沉积掩模材料同时进行。 通过根据本发明的方法,可以生产独立的厚III-N层。 此外,可以制造具有特殊结构和层的半导体器件或部件。

    PROCESS FOR PRODUCING (Al, Ga)N CRYSTALS
    4.
    发明申请
    PROCESS FOR PRODUCING (Al, Ga)N CRYSTALS 审中-公开
    生产(Al,Ga)N晶体的方法

    公开(公告)号:US20080203409A1

    公开(公告)日:2008-08-28

    申请号:US12034950

    申请日:2008-02-21

    IPC分类号: H01L21/20 H01L33/00

    摘要: The present invention relates to a novel process for producing (Al, Ga)N and AlGaN single crystals by means of a modified HVPE process, and also to (Al, Ga)N and AlGaN single crystals of high quality.The III-V compound semiconductors produced by the process according to the invention are used in optoelectronics, in particular for blue, white and green LEDs and also for high-power, high-temperature and high-frequency field effect transistors.

    摘要翻译: 本发明涉及通过改进的HVPE工艺制备(Al,Ga)N和AlGaN单晶的新方法,以及高质量的(Al,Ga)N和AlGaN单晶。 通过根据本发明的方法生产的III-V族化合物半导体用于光电子学,特别是用于蓝色,白色和绿色LED以及高功率,高温和高频场效应晶体管。

    Method for Producing III-N Layers, and III-N Layers or III-N Substrates, and Devices Based Thereon
    5.
    发明申请
    Method for Producing III-N Layers, and III-N Layers or III-N Substrates, and Devices Based Thereon 有权
    生产III-N层,III-N层或III-N基板的方法及其设备

    公开(公告)号:US20080166522A1

    公开(公告)日:2008-07-10

    申请号:US11913739

    申请日:2006-05-05

    IPC分类号: B32B3/00 C30B25/02

    摘要: An epitaxial growth process for producing a thick III-N layer, wherein III denotes at least one element of group III of the periodic table of elements, is disclosed, wherein a thick III-N layer is deposited above a foreign substrate. The epitaxial growth process preferably is carried out by HVPE. The substrate can also be a template comprising the foreign substrate and at least one thin III-N intermediate layer. The surface quality is improved by providing a slight intentional misorientation of the substrate, and/or a reduction of the N/III ratio and/or the reactor pressure towards the end of the epitaxial growth process. Substrates and semiconductor devices with such improved III-N layers are also disclosed.

    摘要翻译: 公开了用于生产厚III-N层的外延生长方法,其中III表示元素周期表第III族中的至少一种元素,其中在异物底物上方沉积厚的III-N层。 外延生长工艺优选通过HVPE进行。 衬底也可以是包含异质衬底和至少一个薄III-N中间层的模板。 通过提供衬底的轻微故意取向,和/或在外延生长过程结束时降低N / III比和/或反应器压力来改善表面质量。 还公开了具有这种改进的III-N层的衬底和半导体器件。

    PROCESS FOR THE MANUFACTURE OF A DOPED III-N BULK CRYSTAL AND A FREE-STANDING III-N SUBSTRATE, AND DOPED III-N BULK CRYSTAL AND FREE-STANDING III-N SUBSTRATE AS SUCH
    6.
    发明申请
    PROCESS FOR THE MANUFACTURE OF A DOPED III-N BULK CRYSTAL AND A FREE-STANDING III-N SUBSTRATE, AND DOPED III-N BULK CRYSTAL AND FREE-STANDING III-N SUBSTRATE AS SUCH 有权
    用于制备掺杂的III-N块状晶体和自由置换的III-N基板的工艺,以及掺杂的III-N块状晶体和自由置换的III-N基板作为其

    公开(公告)号:US20080083910A1

    公开(公告)日:2008-04-10

    申请号:US11835669

    申请日:2007-08-08

    IPC分类号: C30B25/02 H01B1/06

    摘要: A process for producing a doped III-N bulk crystal, wherein III denotes at least one element of the main group III of the periodic system, selected from Al, Ga and In, wherein the doped crystalline III-N layer or the doped III-N bulk crystal is deposited on a substrate or template in a reactor, and wherein the feeding of at least one dopant into the reactor is carried out in admixture with at least one group III material. In this manner, III-N bulk crystals and III-N single crystal substrates separated therefrom can be obtained with a very homogeneous distribution of dopants in the growth direction as well as in the growth plane perpendicular thereto, a very homogeneous distribution of charge carriers and/or of the specific electric resistivity in the growth direction as well as in the growth plane perpendicular thereto, and a very good crystal quality.

    摘要翻译: 一种制备掺杂III-N体晶的方法,其中III表示选自Al,Ga和In的周期性系统的主要III族中的至少一种元素,其中掺杂的晶体III-N层或掺杂的III- N体晶体沉积在反应器中的基底或模板上,并且其中至少一种掺杂剂进料到反应器中与至少一种III族材料混合进行。 以这种方式,可以在生长方向以及与其垂直的生长平面中具有非常均匀的掺杂剂分布,电荷载流子非常均匀的分布和非常均匀的分布,可以获得从其分离的III-N本体晶体和III-N单晶衬底 /或生长方向以及与其垂直的生长面中的比电阻率,以及非常好的晶体质量。

    Semipolar semiconductor crystal and method for manufacturing the same
    7.
    发明授权
    Semipolar semiconductor crystal and method for manufacturing the same 有权
    半极性半导体晶体及其制造方法

    公开(公告)号:US08536030B2

    公开(公告)日:2013-09-17

    申请号:US13051154

    申请日:2011-03-18

    摘要: A method of manufacturing a semipolar semiconductor crystal comprising a group-III-nitride (III-N), the method comprising: providing a substrate comprising sapphire (Al2O3) having a first surface that intersects c-planes of the sapphire; forming a plurality of trenches in the first surface, each trench having a wall whose surface is substantially parallel to a c-plane of the substrate; epitaxially growing a group-III-nitride (III-N) material in the trenches on the c-plane surfaces of their walls until the material overgrows the trenches to form a second planar surface, substantially parallel to a (20-2l) crystallographic plane of the group-III-nitride, wherein l is an integer.

    摘要翻译: 一种制造包含III族氮化物(III-N)的半极性半导体晶体的方法,所述方法包括:提供包含具有与蓝宝石的c面相交的第一表面的蓝宝石(Al 2 O 3)的衬底; 在所述第一表面中形成多个沟槽,每个沟槽具有其表面基本上平行于所述衬底的c面的壁; 在其壁的c面表面上的沟槽中外延生长III-III族氮化物(III-N)材料,直到材料过度生长沟槽以形成基本上平行于(20-21)晶面的第二平坦表面 III族氮化物,其中l为整数。

    Method for producing III-N layers, and III-N layers or III-N substrates, and devices based thereon
    8.
    发明授权
    Method for producing III-N layers, and III-N layers or III-N substrates, and devices based thereon 有权
    III-N层和III-N层或III-N基板的制造方法和基于其的装置

    公开(公告)号:US07998273B2

    公开(公告)日:2011-08-16

    申请号:US11913739

    申请日:2006-05-05

    IPC分类号: C30B21/02

    摘要: An epitaxial growth process for producing a thick III-N layer, wherein III denotes at least one element of group III of the periodic table of elements, is disclosed, wherein a thick III-N layer is deposited above a foreign substrate. The epitaxial growth process preferably is carried out by HVPE. The substrate can also be a template comprising the foreign substrate and at least one thin III-N intermediate layer. The surface quality is improved by providing a slight intentional misorientation of the substrate, and/or a reduction of the N/III ratio and/or the reactor pressure towards the end of the epitaxial growth process. Substrates and semiconductor devices with such improved III-N layers are also disclosed.

    摘要翻译: 公开了用于生产厚III-N层的外延生长方法,其中III表示元素周期表第III族中的至少一种元素,其中在异物底物上方沉积厚的III-N层。 外延生长工艺优选通过HVPE进行。 衬底也可以是包含异质衬底和至少一个薄III-N中间层的模板。 通过提供衬底的轻微故意取向,和/或在外延生长过程结束时降低N / III比和/或反应器压力来改善表面质量。 还公开了具有这种改进的III-N层的衬底和半导体器件。

    Process for the manufacture of a doped III-N bulk crystal and a free-standing III-N substrate, and doped III-N bulk crystal and free-standing III-N substrate as such
    9.
    发明授权
    Process for the manufacture of a doped III-N bulk crystal and a free-standing III-N substrate, and doped III-N bulk crystal and free-standing III-N substrate as such 有权
    用于制造掺杂的III-N本体晶体和独立的III-N衬底以及掺杂的III-N本体晶体和独立的III-N衬底的方法

    公开(公告)号:US08778078B2

    公开(公告)日:2014-07-15

    申请号:US11835669

    申请日:2007-08-08

    IPC分类号: C30B25/00

    摘要: A process for producing a doped III-N bulk crystal, wherein III denotes at least one element of the main group III of the periodic system, selected from Al, Ga and In, wherein the doped crystalline III-N layer or the doped III-N bulk crystal is deposited on a substrate or template in a reactor, and wherein the feeding of at least one dopant into the reactor is carried out in admixture with at least one group III material. In this manner, III-N bulk crystals and III-N single crystal substrates separated therefrom can be obtained with a very homogeneous distribution of dopants in the growth direction as well as in the growth plane perpendicular thereto, a very homogeneous distribution of charge carriers and/or of the specific electric resistivity in the growth direction as well as in the growth plane perpendicular thereto, and a very good crystal quality.

    摘要翻译: 一种制备掺杂III-N体晶的方法,其中III表示选自Al,Ga和In的周期性系统的主要III族中的至少一种元素,其中掺杂的晶体III-N层或掺杂的III- N体晶体沉积在反应器中的基底或模板上,并且其中至少一种掺杂剂进料到反应器中与至少一种III族材料混合进行。 以这种方式,可以在生长方向以及与其垂直的生长平面中具有非常均匀的掺杂剂分布,电荷载流子非常均匀的分布和非常均匀的分布,可以获得从其分离的III-N本体晶体和III-N单晶衬底 /或生长方向以及与其垂直的生长面中的比电阻率,以及非常好的晶体质量。

    Method for producing III-N layers, and III-N layers or III-N substrates, and devices based thereon
    10.
    发明授权
    Method for producing III-N layers, and III-N layers or III-N substrates, and devices based thereon 有权
    III-N层和III-N层或III-N基板的制造方法和基于其的装置

    公开(公告)号:US09115444B2

    公开(公告)日:2015-08-25

    申请号:US12896352

    申请日:2010-10-01

    IPC分类号: H01L21/02 C30B29/40 C30B25/02

    摘要: An epitaxial growth process for producing a thick III-N layer, wherein III denotes at least one element of group III of the periodic table of elements, is disclosed, wherein a thick III-N layer is deposited above a foreign substrate. The epitaxial growth process preferably is carried out by HVPE. The substrate can also be a template comprising the foreign substrate and at least one thin III-N intermediate layer. The surface quality is improved by providing a slight intentional misorientation of the substrate, and/or a reduction of the N/III ratio and/or the reactor pressure towards the end of the epitaxial growth process. Substrates and semiconductor devices with such improved III-N layers are also disclosed.

    摘要翻译: 公开了用于生产厚III-N层的外延生长方法,其中III表示元素周期表第III族中的至少一种元素,其中在异物底物上方沉积厚的III-N层。 外延生长工艺优选通过HVPE进行。 衬底也可以是包含异质衬底和至少一个薄III-N中间层的模板。 通过提供衬底的轻微故意取向,和/或在外延生长过程结束时降低N / III比和/或反应器压力来改善表面质量。 还公开了具有这种改进的III-N层的衬底和半导体器件。