公开(公告)号：US07276802B2

公开(公告)日：2007-10-02

申请号：US10123827

申请日：2002-04-15

申请人： Frank L. Hall ,  Cary J. Baerlocher

发明人： Frank L. Hall ,  Cary J. Baerlocher

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/73 ,  H01L21/563 ,  H01L23/3121 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/0558 ,  H01L2224/05644 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45164 ,  H01L2224/48644 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/85138 ,  H01L2224/92125 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Integrated circuit packages that connect solder balls between solder ball pads of a die and substrate pads of a printed circuit board (PCB). The solder balls are electrically disconnected from any circuit of the die, i.e., “dummy” solder balls, and are used to temporarily hold the die in position with respect to the PCB until the circuit is wire bonded and an underfill material is cured between the die and the PCB to more permanently connect them together. The underfill material is selected to have a coefficient of thermal expansion (CTE) that is substantially equal to the CTE of the solder balls to prevent thermal mismatch problems. An overmolding compound is disposed about the die and the underfill material and about the wire bonds to complete the package. Various arrangements of the solder ball pads on the die include columnar and row, corner, diagonal, cross, and periphery arrangements.

摘要翻译： 集成电路封装，其将焊料球焊接在管芯的焊球焊盘和印刷电路板（PCB）的衬底焊盘之间。 焊料球与模具的任何电路（即“虚拟”）焊球电气断开，并且用于临时将模具保持在相对于PCB的位置，直到电路被引线接合，并且底部填充材料在 模具和PCB更加永久地连接在一起。 选择底部填充材料具有基本上等于焊球的CTE的热膨胀系数（CTE），以防止热失配问题。 围绕模具和底部填充材料设置包覆成型化合物并且围绕引线键合以完成包装。 模具上的焊球垫的各种布置包括柱状和行，角，对角，交叉和外围布置。

公开(公告)号：US07468559B2

公开(公告)日：2008-12-23

申请号：US11428620

申请日：2006-07-05

申请人： Frank L. Hall ,  Cary J. Baerlocher

发明人： Frank L. Hall ,  Cary J. Baerlocher

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/73 ,  H01L21/563 ,  H01L23/3121 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/0558 ,  H01L2224/05644 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45164 ,  H01L2224/48644 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/85138 ,  H01L2224/92125 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Integrated circuit packages that connect solder balls between solder ball pads of a die and substrate pads of a printed circuit board (PCB). The solder balls are electrically disconnected from any circuit of the die, i.e., “dummy” solder balls, and are used to temporarily hold the die in position with respect to the PCB until the circuit is wire bonded and an underfill material is cured between the die and the PCB to more permanently connect them together. The underfill material is selected to have a coefficient of thermal expansion (CTE) that is substantially equal to the CTE of the solder balls to prevent thermal mismatch problems. An overmolding compound is disposed about the die and the underfill material and about the wire bonds to complete the package. Various arrangements of the solder ball pads on the die include columnar and row, corner, diagonal, cross, and periphery arrangements.

摘要翻译： 集成电路封装，其将焊料球焊接在管芯的焊球焊盘和印刷电路板（PCB）的衬底焊盘之间。 焊料球与模具的任何电路（即“虚拟”）焊球电气断开，并且用于临时将模具保持在相对于PCB的位置，直到电路被引线接合，并且底部填充材料在 模具和PCB更加永久地连接在一起。 选择底部填充材料具有基本上等于焊球的CTE的热膨胀系数（CTE），以防止热失配问题。 围绕模具和底部填充材料设置包覆成型化合物并且围绕引线键合以完成包装。 模具上的焊球垫的各种布置包括柱状和行，角，对角，交叉和外围布置。

公开(公告)号：US07268067B2

公开(公告)日：2007-09-11

申请号：US10929283

申请日：2004-08-30

申请人： Frank L. Hall ,  Cary J. Baerlocher

发明人： Frank L. Hall ,  Cary J. Baerlocher

IPC分类号： H01L21/4763

CPC分类号： H01L24/73 ,  H01L21/563 ,  H01L23/3121 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/0558 ,  H01L2224/05644 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45164 ,  H01L2224/48644 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/85138 ,  H01L2224/92125 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Integrated circuit packages that connect solder balls between solder ball pads of a die and substrate pads of a printed circuit board (PCB). The solder balls are electrically disconnected from any circuit of the die, i.e., “dummy” solder balls, and are used to temporarily hold the die in position with respect to the PCB until the circuit is wire bonded and an underfill material is cured between the die and the PCB to more permanently connect them together. The underfill material is selected to have a coefficient of thermal expansion (CTE) that is substantially equal to the CTE of the solder balls to prevent thermal mismatch problems. An overmolding compound is disposed about the die and the underfill material and about the wire bonds to complete the package. Various arrangements of the solder ball pads on the die include columnar and row, corner, diagonal, cross, and periphery arrangements.

公开(公告)号：US07262074B2

公开(公告)日：2007-08-28

申请号：US10191655

申请日：2002-07-08

申请人： Frank L. Hall ,  Cary J. Baerlocher

发明人： Frank L. Hall ,  Cary J. Baerlocher

IPC分类号： H01L23/29 ,  H01L21/66 ,  H01L21/00

CPC分类号： H01L23/3114 ,  H01L21/563 ,  H01L23/4951 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73203 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83102 ,  H01L2224/83138 ,  H01L2224/83194 ,  H01L2224/83856 ,  H01L2224/8592 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： An apparatus and method may be used for packaging a semiconductor die and a carrier substrate to substantially prevent trapped moisture therebetween and provide a robust, inflexible cost-effective bond. The semiconductor die is attached to the carrier substrate with a plurality of discrete adhesive elements so as to provide a gap or standoff therebetween. Wire bonds may then be formed between bond pads on the semiconductor die to conductive pads or terminals on the carrier substrate. With this arrangement, a dielectric filler material is disposed in the gap or standoff to form a permanent bonding agent between the semiconductor die and the carrier substrate. By applying the dielectric filler material after forming the wire bonds, the dielectric filler material coats at least a portion of the wire bonds to stabilize the wire bonds and prevent wire sweep in an encapsulation process, such as transfer molding, performed thereafter.

摘要翻译： 可以使用一种装置和方法来包装半导体管芯和载体基板，以基本上防止其间的被捕获的湿气并且提供鲁棒，无弹性的成本有效的粘结。 半导体管芯通过多个分立的粘合剂元件附接到载体衬底上，以便在它们之间提供间隙或间隔。 然后可以在半导体管芯上的接合焊盘之间形成导线焊盘或载体衬底上的端子。 利用这种布置，介电填充材料设置在间隙或支座中以在半导体管芯和载体衬底之间形成永久性粘接剂。 通过在形成引线接合之后施加介质填充材料，介电填料材料涂覆至少一部分引线键合，以稳定引线键合，并防止在其后执行的封装过程（例如传递模塑）中的电线扫掠。

公开(公告)号：US07116000B2

公开(公告)日：2006-10-03

申请号：US10785122

申请日：2004-02-24

申请人： Frank L. Hall ,  Cary J. Baerlocher

发明人： Frank L. Hall ,  Cary J. Baerlocher

IPC分类号： H01L23/48

CPC分类号： H01L23/3114 ,  H01L21/563 ,  H01L23/4951 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73203 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83102 ,  H01L2224/83138 ,  H01L2224/83194 ,  H01L2224/83856 ,  H01L2224/8592 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： An apparatus and method for packaging a semiconductor die and a carrier substrate to substantially prevent trapped moisture therebetween and provide a robust, inflexible cost-effective bond. The semiconductor die is attached to the carrier substrate with a plurality of discrete adhesive elements so as to provide a gap or standoff therebetween. Wire bonds may then be formed between bond pads on the semiconductor die to conductive pads or terminals on the carrier substrate. With this arrangement, a dielectric filler material is disposed in the gap or standoff to form a permanent bonding agent between the semiconductor die and the carrier substrate. By applying the dielectric filler material after forming the wire bonds, the dielectric filler material coats at least a portion of the wire bonds to stabilize the wire bonds and prevent wire sweep in an encapsulation process, such as transfer molding, performed thereafter.

摘要翻译： 一种用于封装半导体管芯和载体衬底以用于基本上防止其间被捕获的湿气并提供鲁棒且不灵活的成本有效的结合的装置和方法。 半导体管芯通过多个分立的粘合剂元件附接到载体衬底上，以便在它们之间提供间隙或间隔。 然后可以在半导体管芯上的接合焊盘之间形成导线焊盘或载体衬底上的端子。 利用这种布置，介电填充材料设置在间隙或支座中以在半导体管芯和载体衬底之间形成永久性粘接剂。 通过在形成引线接合之后施加介质填充材料，介电填料材料涂覆至少一部分引线键合，以稳定引线键合，并防止在其后执行的封装过程（例如传递模塑）中的电线扫掠。

公开(公告)号：US08093730B2

公开(公告)日：2012-01-10

申请号：US11586071

申请日：2006-10-25

申请人： Frank L. Hall ,  Cary J. Baerlocher

发明人： Frank L. Hall ,  Cary J. Baerlocher

IPC分类号： H01L23/29 ,  H01L23/28 ,  H01L21/44

CPC分类号： H01L23/3114 ,  H01L21/563 ,  H01L23/4951 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73203 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83102 ,  H01L2224/83138 ,  H01L2224/83194 ,  H01L2224/83856 ,  H01L2224/8592 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： An apparatus and method may be used for packaging a semiconductor die and a carrier substrate to substantially prevent trapped moisture therebetween and provide a robust, inflexible cost-effective bond. The semiconductor die is attached to the carrier substrate with a plurality of discrete adhesive elements so as to provide a gap or standoff therebetween. Wire bonds may then be formed between bond pads on the semiconductor die to conductive pads or terminals on the carrier substrate. With this arrangement, a dielectric filler material is disposed in the gap or standoff to form a permanent bonding agent between the semiconductor die and the carrier substrate. By applying the dielectric filler material after forming the wire bonds, the dielectric filler material coats at least a portion of the wire bonds to stabilize the wire bonds and prevent wire sweep in an encapsulation process, such as transfer molding, performed thereafter.

摘要翻译： 可以使用一种装置和方法来包装半导体管芯和载体基板，以基本上防止其间的被捕获的湿气并且提供鲁棒，无弹性的成本有效的粘合。 半导体管芯通过多个分立的粘合剂元件附接到载体衬底上，以便在它们之间提供间隙或间隔。 然后可以在半导体管芯上的接合焊盘之间形成导线焊盘或载体衬底上的端子。 利用这种布置，介电填充材料设置在间隙或支座中以在半导体管芯和载体衬底之间形成永久性粘接剂。 通过在形成引线接合之后施加介质填充材料，介电填料材料涂覆至少一部分引线键合，以稳定引线键合，并防止在其后执行的封装过程（例如传递模塑）中的电线扫掠。

公开(公告)号：US07851907B2

公开(公告)日：2010-12-14

申请号：US12022211

申请日：2008-01-30

申请人： Frank L. Hall ,  Cary J. Baerlocher

发明人： Frank L. Hall ,  Cary J. Baerlocher

IPC分类号： H01L23/34

CPC分类号： H01L24/73 ,  H01L21/563 ,  H01L23/3121 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/0558 ,  H01L2224/05644 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45164 ,  H01L2224/48644 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/85138 ,  H01L2224/92125 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Integrated circuit packages that connect solder balls between solder ball pads of a die and substrate pads of a printed circuit board (PCB). The solder balls are electrically disconnected from any circuit of the die, i.e., “dummy” solder balls, and are used to temporarily hold the die in position with respect to the PCB until the circuit is wire bonded and an underfill material is cured between the die and the PCB to more permanently connect them together. The underfill material is selected to have a coefficient of thermal expansion (CTE) that is substantially equal to the CTE of the solder balls to prevent thermal mismatch problems. An overmolding compound is disposed about the die and the underfill material and about the wire bonds to complete the package. Various arrangements of the solder ball pads on the die include columnar and row, corner, diagonal, cross, and periphery arrangements.

摘要翻译： 集成电路封装，其将焊料球焊接在管芯的焊球焊盘和印刷电路板（PCB）的衬底焊盘之间。 焊料球与模具的任何电路（即“虚拟”）焊球电气断开，并且用于临时将模具保持在相对于PCB的位置，直到电路被引线接合，并且底部填充材料在 模具和PCB更加永久地连接在一起。 选择底部填充材料具有基本上等于焊球的CTE的热膨胀系数（CTE），以防止热失配问题。 围绕模具和底部填充材料设置包覆成型化合物并且围绕引线键合以完成包装。 模具上的焊球垫的各种布置包括柱状和行，角，对角，交叉和外围布置。

公开(公告)号：US20080142950A1

公开(公告)日：2008-06-19

申请号：US12022211

申请日：2008-01-30

申请人： Frank L. Hall ,  Cary J. Baerlocher

发明人： Frank L. Hall ,  Cary J. Baerlocher

IPC分类号： H01L23/48

CPC分类号： H01L24/73 ,  H01L21/563 ,  H01L23/3121 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/0558 ,  H01L2224/05644 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45164 ,  H01L2224/48644 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/85138 ,  H01L2224/92125 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Integrated circuit packages that connect solder balls between solder ball pads of a die and substrate pads of a printed circuit board (PCB). The solder balls are electrically disconnected from any circuit of the die, i.e., “dummy” solder balls, and are used to temporarily hold the die in position with respect to the PCB until the circuit is wire bonded and an underfill material is cured between the die and the PCB to more permanently connect them together. The underfill material is selected to have a coefficient of thermal expansion (CTE) that is substantially equal to the CTE of the solder balls to prevent thermal mismatch problems. An overmolding compound is disposed about the die and the underfill material and about the wire bonds to complete the package. Various arrangements of the solder ball pads on the die include columnar and row, corner, diagonal, cross, and periphery arrangements.

摘要翻译： 集成电路封装，其将焊料球焊接在管芯的焊球焊盘和印刷电路板（PCB）的衬底焊盘之间。 焊料球与模具的任何电路（即“虚拟”）焊球电气断开，并且用于临时将模具保持在相对于PCB的位置，直到电路被引线接合，并且底部填充材料在 模具和PCB更加永久地连接在一起。 选择底部填充材料具有基本上等于焊球的CTE的热膨胀系数（CTE），以防止热失配问题。 围绕模具和底部填充材料设置包覆成型化合物并且围绕引线键合以完成包装。 模具上的焊球垫的各种布置包括柱状和行，角，对角，交叉和外围布置。

公开(公告)号：US07342319B2

公开(公告)日：2008-03-11

申请号：US11428625

申请日：2006-07-05

申请人： Frank L. Hall ,  Cary J. Baerlocher

发明人： Frank L. Hall ,  Cary J. Baerlocher

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/73 ,  H01L21/563 ,  H01L23/3121 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/0558 ,  H01L2224/05644 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45164 ,  H01L2224/48644 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/85138 ,  H01L2224/92125 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Integrated circuit packages that connect solder balls between solder ball pads of a die and substrate pads of a printed circuit board (PCB). The solder balls are electrically disconnected from any circuit of the die, i.e., “dummy” solder balls, and are used to temporarily hold the die in position with respect to the PCB until the circuit is wire bonded and an underfill material is cured between the die and the PCB to more permanently connect them together. The underfill material is selected to have a coefficient of thermal expansion (CTE) that is substantially equal to the CTE of the solder balls to prevent thermal mismatch problems. An overmolding compound is disposed about the die and the underfill material and about the wire bonds to complete the package. Various arrangements of the solder ball pads on the die include columnar and row, corner, diagonal, cross, and periphery arrangements.

公开(公告)号：US06987058B2

公开(公告)日：2006-01-17

申请号：US10391109

申请日：2003-03-18

申请人： Frank L. Hall

发明人： Frank L. Hall

IPC分类号： H01L21/44

CPC分类号： H01L21/56 ,  H01L23/13 ,  H01L23/24 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor assembly includes at least one semiconductor die and a carrier substrate adhered and maintained in spaced-apart relation to one another by at least one adhesive element. Through an opening in the carrier substrate, the assembly has intermediate conductive elements extending between bond pads of the semiconductor die and contact pads of the carrier substrate. The carrier substrate has a dam formed around the contact pads. A dielectric filler material disposed between the semiconductor die and the carrier substrate at least partially fills the opening, is laterally contained by the dam, and encapsulates the intermediate conductive elements, as well as at least filling the space between the semiconductor die and carrier substrate and forming a fillet about the periphery of the semiconductor die.

摘要翻译： 半导体组件包括至少一个半导体管芯和载体衬底，所述至少一个半导体管芯和载体衬底通过至少一个粘合剂元件彼此间隔开地相互粘合并保持。 通过载体衬底中的开口，组件具有在半导体管芯的接合焊盘和载体衬底的接触焊盘之间延伸的中间导电元件。 载体衬底具有围绕接触垫形成的坝。 设置在半导体管芯和载体衬底之间的介电填充材料至少部分地填充开口，由坝横向容纳，并封装中间导电元件，并且至少填充半导体管芯和载体衬底之间的空间，以及 围绕半导体管芯的周围形成圆角。