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公开(公告)号：US09733470B2
公开(公告)日：2017-08-15
申请号：US14280487
申请日：2014-05-16
CPC分类号： G02B26/0833 , B81B3/0045 , B81B2201/042 , B81B2203/0109 , B81B2203/0163 , B81B2203/019
摘要： The underlying invention presents a device which connects a vibratably suspended optical element to at least two actuators mounted fixedly on one side via curved spring elements, wherein the actuators are implemented to cause the vibratably suspended optical element to vibrate via the curved spring elements. Both the actuators and the entire system may be implemented to be more robust and be operated more reliably due to the curved shaping of the spring elements.
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2.发明授权Device comprising a spring and an element suspended thereon, and method for manufacturing same 有权包括弹簧和悬挂在其上的元件的装置及其制造方法公开(公告)号：US09399573B2
公开(公告)日：2016-07-26
申请号：US14280154
申请日：2014-05-16
CPC分类号： B81B3/0027 , B81B3/0029 , B81B2201/042 , B81B2203/0109 , B81B2203/0163 , B81C1/00357 , B81C1/00626 , B81C2201/014 , H01L29/84
摘要： The invention relates to an MEMS structure with a stack made of different layers and a spring-and-mass system varying in its thickness which is formed of the stack, and wherein, starting from a back side of the stack and the substrate, at laterally different positions, the substrate while leaving the first semiconductor layer, or the substrate, the first etch-stop layer and the first semiconductor layer are removed, and to a method for manufacturing such a structure.
摘要翻译： 本发明涉及一种具有由不同层组成的叠层的MEMS结构，以及由堆叠形成的其厚度变化的弹簧和质量系统，并且其中，从堆叠和衬底的背侧开始，在侧向 不同的位置，离开第一半导体层的衬底，或衬底，第一蚀刻停止层和第一半导体层被去除，以及制造这种结构的方法。
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公开(公告)号：US09912115B2
公开(公告)日：2018-03-06
申请号：US15173110
申请日：2016-06-03
IPC分类号： H01L21/00 , H01L21/30 , H01L23/52 , H01S5/022 , H01L33/58 , H01S5/40 , C03B23/02 , C03B23/20 , H01L23/00 , H01S5/028 , H01L33/00 , H01L33/56
CPC分类号： H01S5/02208 , C03B23/02 , C03B23/20 , H01L24/32 , H01L33/0095 , H01L33/56 , H01L33/58 , H01L2224/32145 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2924/12043 , H01L2924/16152 , H01L2933/0033 , H01L2933/0058 , H01S5/022 , H01S5/0222 , H01S5/02276 , H01S5/02288 , H01S5/02296 , H01S5/028 , H01S5/40 , H01S5/4025 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to methods of producing a cap substrate, to methods of producing a packaged radiation-emitting device at the wafer level, and to a radiation-emitting device. By producing a cap substrate, providing a device substrate in the form of a wafer including a multitude of radiation-emitting devices, arranging the substrates one above the other such that the substrates are bonded along an intermediate bonding frame, and dicing the packaged radiation-emitting devices, improved packaged radiation-emitting devices are provided which are advantageously arranged within a cavity free from organics and can be examined, still at the wafer level, in terms of their functionalities in a simplified manner prior to being diced.
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公开(公告)号：US20150040368A1
公开(公告)日：2015-02-12
申请号：US14361392
申请日：2012-09-28
CPC分类号： G02B27/0006 , B81B2201/042 , B81C1/00317 , B81C1/00793 , G02B1/118 , G02B5/0242 , G02B5/0278 , G02B26/0833 , G02B26/0841 , Y10T29/49826
摘要： The method according to the invention is used for producing optical components, in particular covers for encapsulating micro-systems, wherein at least one reinforcing element, which is produced before being arranged, is arranged on a first substrate, as a result of which a stack is produced. This stack is heated after being connected to a second substrate, as a result of which the first substrate is deformed such that at least one region, covered by the reinforcing element, of the first substrate is moved and/or is inclined or the first substrate is brought into contact with the reinforcing element. In an alternative method according to the invention, the reinforcing element is arranged on the second substrate, wherein this stack is then connected to the first substrate. The first substrate is subsequently heated and deformed such that a region of the first substrate is brought into contact with the reinforcing element.
摘要翻译： 根据本发明的方法用于制造光学部件，特别是用于封装微系统的盖，其中在布置之前产生的至少一个加强元件布置在第一基板上，结果是堆叠 生产。 该叠层在与第二基板连接之后被加热，其结果是第一基板变形使得第一基板的被增强元件覆盖的至少一个区域移动和/或倾斜，或者第一基板 与增强元件接触。 在根据本发明的替代方法中，加强元件布置在第二基板上，其中该堆叠然后连接到第一基板。 随后第一衬底被加热和变形，使得第一衬底的区域与增强元件接触。
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公开(公告)号：US10283930B2
公开(公告)日：2019-05-07
申请号：US15660909
申请日：2017-07-26
IPC分类号： H01L33/56 , H01L33/58 , H01S5/022 , H01S5/40 , C03B23/02 , C03B23/20 , H01L23/00 , H01S5/028 , H01L33/00
摘要： The invention relates to methods of producing a cap substrate, to methods of producing a packaged radiation-emitting device at the wafer level, and to a radiation-emitting device. By producing a cap substrate, providing a device substrate in the form of a wafer including a multitude of radiation-emitting devices, arranging the substrates one above the other such that the substrates are bonded along an intermediate bonding frame, and dicing the packaged radiation-emitting devices, improved packaged radiation-emitting devices are provided which are advantageously arranged within a cavity free from organics and can be examined, still at the wafer level, in terms of their functionalities in a simplified manner prior to being diced.
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公开(公告)号：US09910273B2
公开(公告)日：2018-03-06
申请号：US14361392
申请日：2012-09-28
CPC分类号： G02B27/0006 , B81B2201/042 , B81C1/00317 , B81C1/00793 , G02B1/118 , G02B5/0242 , G02B5/0278 , G02B26/0833 , G02B26/0841 , Y10T29/49826
摘要： The method according to the invention is used for producing optical components, in particular covers for encapsulating micro-systems, wherein at least one reinforcing element, which is produced before being arranged, is arranged on a first substrate, as a result of which a stack is produced. This stack is heated after being connected to a second substrate, as a result of which the first substrate is deformed such that at least one region, covered by the reinforcing element, of the first substrate is moved and/or is inclined or the first substrate is brought into contact with the reinforcing element. In an alternative method according to the invention, the reinforcing element is arranged on the second substrate, wherein this stack is then connected to the first substrate. The first substrate is subsequently heated and deformed such that a region of the first substrate is brought into contact with the reinforcing element.
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