公开(公告)号：US12245396B2

公开(公告)日：2025-03-04

申请号：US18523790

申请日：2023-11-29

Applicant: Frore Systems Inc.

Inventor： Prabhu Sathyamurthy ,  Suryaprakash Ganti ,  Seshagiri Rao Madhavapeddy ,  Nilesh Sudhir Hasabnis ,  Vikram Mukundan ,  William Finn Ninian Paisley

IPC: H05K7/20 ,  G06F1/20

Abstract: A cooling system for a computing device is described. The cooling system includes a heat transfer structure. The heat transfer structure includes a heat spreader, a fin structure, and a differential pressure device. The fin structure transfers heat from the heat spreader to a fluid. The differential pressure device generates a low pressure region that draws the fluid from an ingress in the computing device through the fin structure. The heat transfer structure is enclosed in a chamber of the computing device. The chamber includes the ingress and an egress.

公开(公告)号：US12193192B2

公开(公告)日：2025-01-07

申请号：US18596562

申请日：2024-03-05

Applicant: Frore Systems Inc.

Inventor： Suryaprakash Ganti ,  Sangkyu Kim ,  Vikram Mukundan ,  Prathima Kapa ,  Ji Hoon Kim ,  Wen-Sheng Chan

IPC: H05K7/20

Abstract: A flow chamber having an upper chamber, a lower chamber, and an actuator is described. The upper chamber includes a top wall. The actuator is located distally from the top wall. The lower chamber includes a bottom wall and a sidewall. The lower chamber receives a fluid from the upper chamber when the actuator is activated. The bottom wall has orifices and at least one cavity therein. The orifices are vertically aligned with a portion of the actuator and allow the fluid to exit the lower chamber. The at least one cavity is proximate to the sidewall and distally located from the orifices.

公开(公告)号：US12167574B2

公开(公告)日：2024-12-10

申请号：US18229602

申请日：2023-08-02

Applicant: Frore Systems Inc.

Inventor： Ananth Saran Yalamarthy ,  Prabhu Sathyamurthy ,  Suryaprakash Ganti ,  Seshagiri Rao Madhavapeddy ,  Vikram Mukundan

IPC: H05K7/20 ,  F28F13/10

Abstract: A system including a cooling element and a support structure is described. The cooling element has a first side and a second side opposite to the first side. The cooling element is configured to undergo vibrational motion when actuated to drive a fluid from the first side to the second side. The support structure thermally couples the cooling element to a heat-generating structure via thermal conduction.

公开(公告)号：US20240351862A1

公开(公告)日：2024-10-24

申请号：US18652726

申请日：2024-05-01

Applicant: Frore Systems Inc.

Inventor： Suryaprakash Ganti ,  Vikram Mukundan ,  Seshagiri Rao Madhavapeddy ,  Ananth Saran Yalamarthy ,  Prathima Kapa ,  Brian James Gally

IPC: B81B7/00

CPC classification number: B81B7/0061 ,  B81B2203/0118 ,  B81B2203/0307 ,  B81B2203/0315 ,  B81B2203/04 ,  B81B2203/058

Abstract: A cooling system is described. The cooling system includes a bottom plate, a support structure, and a cooling element. The bottom plate has orifices therein. The cooling element has a central axis and is supported by the support structure at the central axis. A first portion of the cooling element is on a first side of the central axis and a second portion of the cooling element is on a second side of the central axis opposite to the first side. The first and second portions of the cooling element are unpinned. The first portion and the second portion are configured to undergo vibrational motion when actuated to drive a fluid through the orifices. The support structure couples the cooling element to the bottom plate. The support structure is coupled with at least one of the cooling element or the bottom plate by diffusion bond(s).

公开(公告)号：US11802554B2

公开(公告)日：2023-10-31

申请号：US17081890

申请日：2020-10-27

Applicant: Frore Systems Inc.

Inventor： Ananth Saran Yalamarthy ,  Vikram Mukundan ,  Suryaprakash Ganti ,  Narayana Prasad Rayapati ,  Prabhu Sathyamurthy ,  Seshagiri Rao Madhavapeddy ,  Marc Mignard ,  Brian James Gally

IPC: F04B43/04 ,  F04B49/00 ,  F04B45/047

CPC classification number: F04B43/046 ,  F04B45/047 ,  F04B49/00

Abstract: A system including an orifice plate, a fan element and at least one channel is disclosed. The orifice plate has at least one orifice therein. The fan element is configured to undergo vibrational motion to drive a fluid through the orifice(s). The fluid is drawn through the channel(s) in response to the fluid being driven through the at least one orifice.

公开(公告)号：US11765863B2

公开(公告)日：2023-09-19

申请号：US17486747

申请日：2021-09-27

Applicant: Frore Systems Inc.

Inventor： Ananth Saran Yalamarthy ,  Prabhu Sathyamurthy ,  Suryaprakash Ganti ,  Seshagiri Rao Madhavapeddy ,  Vikram Mukundan

IPC: H05K7/20 ,  F28F13/10

CPC classification number: H05K7/2039 ,  F28F13/10

Abstract: A system including a cooling element and a support structure is described. The cooling element has a first side and a second side opposite to the first side. The cooling element is configured to undergo vibrational motion when actuated to drive a fluid from the first side to the second side. The support structure thermally couples the cooling element to a heat-generating structure via thermal conduction.

公开(公告)号：US20210183739A1

公开(公告)日：2021-06-17

申请号：US17121599

申请日：2020-12-14

Applicant: Frore Systems Inc.

Inventor： Prabhu Sathyamurthy ,  Suryaprakash Ganti ,  Seshagiri Rao Madhavapeddy ,  Vikram Mukundan ,  Lumaya Ahmed

IPC: H01L23/46 ,  F28F3/12

Abstract: A system including at least one heat-generating structure and a cooling system is described. The cooling system includes a cooling element and an exhaust system. The cooling element is in communication with a fluid and is configured to direct the fluid toward the heat-generating structure(s) using vibrational motion. The exhaust system is configured to direct fluid away from the heat-generating structure to extract the heat and/or to draw the fluid toward the cooling element.

公开(公告)号：US20250027729A1

公开(公告)日：2025-01-23

申请号：US18818364

申请日：2024-08-28

Applicant: Frore Systems Inc.

Inventor： Prabhu Sathyamurthy ,  Suryaprakash Ganti ,  Vikram Mukundan ,  Sangkyu Kim ,  Prathima Kapa ,  Seshagiri Rao Madhavapeddy ,  Shekhar Halakatti ,  Brian James Gally

IPC: F28F13/10 ,  F04B43/02 ,  H05K7/20

Abstract: A heat transfer system includes fluid transfer cells that vibrationally move a fluid and a thermally conductive cover that conducts heat from the cells while avoiding transfer of mechanical energy between the cells. A fluid transfer module includes outer and inner walls, a support member, and a membrane. The outer wall has an outer opening. The inner wall has an inner opening. The support member is disposed laterally on the inner wall such that a flow chamber is defined between the outer and inner walls. The membrane is supported by the support member along the outer wall. A fluid transfer module includes an inlet port and an actuator. The actuator undergoes vibrational motion and has first and second vibrational modes. The first vibrational mode causes fluid to enter the inlet port. The second vibrational mode expels fluid from the inlet port, which reduces clogging of the inlet port.

公开(公告)号：US20240179868A1

公开(公告)日：2024-05-30

申请号：US18523790

申请日：2023-11-29

Applicant: Frore Systems Inc.

Inventor： Prabhu Sathyamurthy ,  Suryaprakash Ganti ,  Seshagiri Rao Madhavapeddy ,  Nilesh Sudhir Hasabnis ,  Vikram Mukundan ,  William Finn Ninian Paisley

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20172 ,  G06F1/20 ,  H05K7/20145 ,  H05K7/20154 ,  H05K7/20436

Abstract: A cooling system for a computing device is described. The cooling system includes a heat transfer structure. The heat transfer structure includes a heat spreader, a fin structure, and a differential pressure device. The fin structure transfers heat from the heat spreader to a fluid. The differential pressure device generates a low pressure region that draws the fluid from an ingress in the computing device through the fin structure. The heat transfer structure is enclosed in a chamber of the computing device. The chamber includes the ingress and an egress.

公开(公告)号：US11978690B2

公开(公告)日：2024-05-07

申请号：US17860561

申请日：2022-07-08

Applicant: Frore Systems Inc.

Inventor： Vikram Mukundan ,  Suryaprakash Ganti ,  Seshagiri Rao Madhavapeddy ,  Ananth Saran Yalamarthy ,  Prathima Kapa

IPC: H01L23/40 ,  B81B3/00 ,  G06F1/20 ,  H01L23/473

CPC classification number: H01L23/4735 ,  B81B3/0021 ,  G06F1/20 ,  H01L23/40 ,  B81B2201/034 ,  B81B2203/0118 ,  B81B2203/0307 ,  B81B2203/0315 ,  B81B2203/033 ,  B81B2207/99

Abstract: A cooling system is described. The cooling system includes a bottom plate, a support structure, and a cooling element. The bottom plate has orifices therein. The cooling element has a central axis and is supported by the support structure at the central axis. A first portion of the cooling element is on a first side of the central axis and a second portion of the cooling element is on a second side of the central axis opposite to the first side. The first and second portions of the cooling element are unpinned. The first portion and the second portion are configured to undergo vibrational motion when actuated to drive a fluid toward a heat-generating structure. The support structure couples the cooling element to the bottom plate. At least one of the support structure is an adhesive support structure or the support structure undergoes rotational motion in response to the vibrational motion. The adhesive support structure has at least one lateral dimension defined by a trench in the cooling element or the bottom plate.