摘要:
A tubing including an overlap portion formed by the first and second circumferential end portions overlapping and joined with each other, and a fluid leakage preventing member for preventing pressurized fluid from leaking from the tubing upon the tubing being subjected to hydrostatic forming. An apparatus and method for hydrostatic forming of a tubing having an overlap portion. The apparatus includes a die and a nozzle having fluid leakage preventing means for preventing the pressurized fluid supplied into the tubing from leaking from a clearance between the first and second circumferential end portions of the overlap portion of the tubing at the longitudinal end portions of the tubing.
摘要:
A tubing including an overlap portion formed by the first and second circumferential end portions overlapping and joined with each other, and a fluid leakage preventing member for preventing pressurized fluid from leaking from the tubing upon the tubing being subjected to hydrostatic forming. An apparatus and method for hydrostatic forming of a tubing having an overlap portion. The apparatus includes a die and a nozzle having fluid leakage preventing means for preventing the pressurized fluid supplied into the tubing from leaking from a clearance between the first and second circumferential end portions of the overlap portion of the tubing at the longitudinal end portions of the tubing.
摘要:
A reinforced member which is made from a steel product having a strain aging characteristic and has a closed section at a cross section perpendicular to an axis of the reinforced member. The reinforced member includes a reinforced area which is produced by press-forming the steel product so as to generate a compression strain in the press-formed steel product due to the application of a compression stress to the steel product along the direction from a surface of the steel product to an inside of the steel product, and by giving a strain aging treatment to the press-formed member.
摘要:
A reinforced member which is made from a steel product having a strain aging characteristic and has a closed section at a cross section perpendicular to an axis of the reinforced member. The reinforced member includes a reinforced area which is produced by press-forming the steel product so as to generate a compression strain in the press-formed steel product due to the application of a compression stress to the steel product along the direction from a surface of the steel product to an inside of the steel product, and by giving a strain aging treatment to the press-formed member.
摘要:
Embodiments of the invention provide a semiconductor device having high reliability as they ease the thermal stress or a heat distortion or strain occurring during the manufacturing process or during operation, and the embodiments function with stability for a long time. A semiconductor device has a semiconductor substrate, an insulating ceramic plate on which the semiconductor substrate is mounted and stress buffer 40 that eases a thermal stress. The stress buffer is provided between the semiconductor substrate and the insulating ceramic plate and can be provided on a surface of the insulating ceramic plate that is opposite to a surface on which the semiconductor substrate is mounted. The stress buffer is formed from a structure including at least Al and a second phase. The second phase is Al4X where X is at least one element of alkaline earth metal elements.
摘要:
Embodiments of the invention provide a semiconductor device having high reliability as they ease the thermal stress or a heat distortion or strain occurring during the manufacturing process or during operation, and the embodiments function with stability for a long time. A semiconductor device has a semiconductor substrate, an insulating ceramic plate on which the semiconductor substrate is mounted and stress buffer 40 that eases a thermal stress. The stress buffer is provided between the semiconductor substrate and the insulating ceramic plate and can be provided on a surface of the insulating ceramic plate that is opposite to a surface on which the semiconductor substrate is mounted. The stress buffer is formed from a structure including at least Al and a second phase. The second phase is Al4X where X is at least one element of alkaline earth metal elements.
摘要:
A titanium alloy contains vanadium, from 10 to 20% by weight; aluminum, from 0.2 to 10% by weight; and a balance essentially titanium, and the alloy has a microstructure including a martensite phase. Alternatively, the titanium alloy contains vanadium, from 10 to 20% by weight; aluminum, from 0.2 to 10% by weight; and a balance essentially titanium, and the alloy has a microstructure including a β phase capable of transforming into a martensite phase by cold working or cooling under a room temperature.
摘要:
Inventors of the present invention have found that, by manufacturing a stress-buffering material with a Ca-containing aluminum alloy including 0.1 to 12 at % of Ca, the stress-buffering material at low cost, capable of expanding its use in various fields, and having low Young's modulus that is beyond a conventional level, can be obtain.
摘要:
Inventors of the present invention have found that, by manufacturing a stress-buffering material with a Ca-containing aluminum alloy including 0.1 to 12 at % of Ca, the stress-buffering material at low cost, capable of expanding its use in various fields, and having low Young's modulus that is beyond a conventional level, can be obtain.
摘要:
A titanium alloy contains vanadium, from 10 to 20% by weight; aluminum, from 0.2 to 10% by weight; and a balance essentially titanium, and the alloy has a microstructure including a martensite phase. Alternatively, the titanium alloy contains vanadium, from 10 to 20% by weight; aluminum, from 0.2 to 10% by weight; and a balance essentially titanium, and the alloy has a microstructure including a β phase capable of transforming into a martensite phase by cold working or cooling under a room temperature.