公开(公告)号：US20070163681A1

公开(公告)日：2007-07-19

申请号：US11653955

申请日：2007-01-17

申请人： Fumihiko Gejima ,  Takuro Yamaguchi ,  Shuji Hanada ,  Hiroaki Matsumoto ,  Sadao Watanabe

发明人： Fumihiko Gejima ,  Takuro Yamaguchi ,  Shuji Hanada ,  Hiroaki Matsumoto ,  Sadao Watanabe

IPC分类号： C22C14/00

CPC分类号： C22C14/00 ,  A63B53/12 ,  C22F1/183

摘要： A titanium alloy contains vanadium, from 10 to 20% by weight; aluminum, from 0.2 to 10% by weight; and a balance essentially titanium, and the alloy has a microstructure including a martensite phase. Alternatively, the titanium alloy contains vanadium, from 10 to 20% by weight; aluminum, from 0.2 to 10% by weight; and a balance essentially titanium, and the alloy has a microstructure including a β phase capable of transforming into a martensite phase by cold working or cooling under a room temperature.

摘要翻译： 钛合金含有10〜20重量％的钒， 铝，为0.2〜10重量％; 并且余量基本上为钛，并且该合金具有包括马氏体相的微结构。 或者，钛合金含有10〜20重量％的钒， 铝，为0.2〜10重量％; 并且余量基本上为钛，并且该合金具有包括β相的微结构，其能够在室温下通过冷加工或冷却而转变为马氏体相。

公开(公告)号：US07670445B2

公开(公告)日：2010-03-02

申请号：US11653955

申请日：2007-01-17

申请人： Fumihiko Gejima ,  Takuro Yamaguchi ,  Shuji Hanada ,  Hiroaki Matsumoto ,  Sadao Watanabe

发明人： Fumihiko Gejima ,  Takuro Yamaguchi ,  Shuji Hanada ,  Hiroaki Matsumoto ,  Sadao Watanabe

IPC分类号： C22C14/00 ,  C22C21/06

CPC分类号： C22C14/00 ,  A63B53/12 ,  C22F1/183

摘要： A titanium alloy contains vanadium, from 10 to 20% by weight; aluminum, from 0.2 to 10% by weight; and a balance essentially titanium, and the alloy has a microstructure including a martensite phase. Alternatively, the titanium alloy contains vanadium, from 10 to 20% by weight; aluminum, from 0.2 to 10% by weight; and a balance essentially titanium, and the alloy has a microstructure including a β phase capable of transforming into a martensite phase by cold working or cooling under a room temperature.

摘要翻译： 钛合金含有10〜20重量％的钒， 铝，为0.2〜10重量％; 并且余量基本上为钛，并且该合金具有包括马氏体相的微结构。 或者，钛合金含有10〜20重量％的钒， 铝，为0.2〜10重量％; 并且余量基本上为钛，并且该合金具有包括“ 相能够在室温下通过冷加工或冷却转化成马氏体相。

公开(公告)号：US20110309512A1

公开(公告)日：2011-12-22

申请号：US12673082

申请日：2008-09-08

申请人： Fumihiko Gejima ,  Hiroki Sakamoto

发明人： Fumihiko Gejima ,  Hiroki Sakamoto

IPC分类号： H01L23/48

CPC分类号： H01L23/3735 ,  H01L23/053 ,  H01L23/147 ,  H01L23/49894 ,  H01L23/562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/32507 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/838 ,  H01L2224/85424 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/16195 ,  H01L2924/19107 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/01013 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： Embodiments of the invention provide a semiconductor device having high reliability as they ease the thermal stress or a heat distortion or strain occurring during the manufacturing process or during operation, and the embodiments function with stability for a long time. A semiconductor device has a semiconductor substrate, an insulating ceramic plate on which the semiconductor substrate is mounted and stress buffer 40 that eases a thermal stress. The stress buffer is provided between the semiconductor substrate and the insulating ceramic plate and can be provided on a surface of the insulating ceramic plate that is opposite to a surface on which the semiconductor substrate is mounted. The stress buffer is formed from a structure including at least Al and a second phase. The second phase is Al4X where X is at least one element of alkaline earth metal elements.

摘要翻译： 本发明的实施例提供了一种具有高可靠性的半导体器件，因为它们易于在制造过程中或在操作期间发生热应力或热变形或应变，并且该实施例长时间稳定地起作用。 半导体器件具有半导体衬底，其上安装有半导体衬底的绝缘陶瓷板和缓解热应力的应力缓冲器40。 应力缓冲器设置在半导体衬底和绝缘陶瓷板之间，并且可以设置在与安装半导体衬底的表面相对的绝缘陶瓷板的表面上。 应力缓冲器由至少包括Al和第二相的结构形成。 第二相是Al4X，其中X是至少一种碱土金属元素元素。

公开(公告)号：US08125088B2

公开(公告)日：2012-02-28

申请号：US12673082

申请日：2008-09-08

申请人： Fumihiko Gejima ,  Hiroki Sakamoto

发明人： Fumihiko Gejima ,  Hiroki Sakamoto

IPC分类号： H01L23/48

CPC分类号： H01L23/3735 ,  H01L23/053 ,  H01L23/147 ,  H01L23/49894 ,  H01L23/562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/32507 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/838 ,  H01L2224/85424 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/16195 ,  H01L2924/19107 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/01013 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： Embodiments of the invention provide a semiconductor device having high reliability as they ease the thermal stress or a heat distortion or strain occurring during the manufacturing process or during operation, and the embodiments function with stability for a long time. A semiconductor device has a semiconductor substrate, an insulating ceramic plate on which the semiconductor substrate is mounted and stress buffer 40 that eases a thermal stress. The stress buffer is provided between the semiconductor substrate and the insulating ceramic plate and can be provided on a surface of the insulating ceramic plate that is opposite to a surface on which the semiconductor substrate is mounted. The stress buffer is formed from a structure including at least Al and a second phase. The second phase is Al4X where X is at least one element of alkaline earth metal elements.

摘要翻译： 本发明的实施例提供了一种具有高可靠性的半导体器件，因为它们易于在制造过程中或在操作期间发生热应力或热变形或应变，并且该实施例长时间稳定地起作用。 半导体器件具有半导体衬底，其上安装有半导体衬底的绝缘陶瓷板和缓解热应力的应力缓冲器40。 应力缓冲器设置在半导体衬底和绝缘陶瓷板之间，并且可以设置在与安装半导体衬底的表面相对的绝缘陶瓷板的表面上。 应力缓冲器由至少包括Al和第二相的结构形成。 第二相是Al4X，其中X是至少一种碱土金属元素元素。

公开(公告)号：US20050121096A1

公开(公告)日：2005-06-09

申请号：US11001093

申请日：2004-12-02

申请人： Fumihiko Gejima ,  Hiroshi Sakurai ,  Kenji Kanamori ,  Tetsuji Morita ,  Sadao Yanagida ,  Masayuki Inoue

发明人： Fumihiko Gejima ,  Hiroshi Sakurai ,  Kenji Kanamori ,  Tetsuji Morita ,  Sadao Yanagida ,  Masayuki Inoue

IPC分类号： B21D26/02 ,  F16L9/17 ,  F16L9/00

CPC分类号： B21D26/045 ,  F16L9/17 ,  Y10T29/18

摘要： A tubing including an overlap portion formed by the first and second circumferential end portions overlapping and joined with each other, and a fluid leakage preventing member for preventing pressurized fluid from leaking from the tubing upon the tubing being subjected to hydrostatic forming. An apparatus and method for hydrostatic forming of a tubing having an overlap portion. The apparatus includes a die and a nozzle having fluid leakage preventing means for preventing the pressurized fluid supplied into the tubing from leaking from a clearance between the first and second circumferential end portions of the overlap portion of the tubing at the longitudinal end portions of the tubing.

摘要翻译： 包括由第一和第二周向端部形成的重叠部分的管道彼此重叠和接合，以及防止流体泄漏的构件，用于防止加压流体在管道被流体静力成形之后从管道泄漏。 具有重叠部分的管道的静液压成型的装置和方法。 该设备包括一个模具和一个具有流体泄漏防止装置的喷嘴，该喷嘴具有防止供应到管道中的加压流体在管道的纵向端部处的管道的重叠部分的第一和第二周向端部之间的间隙泄漏 。

公开(公告)号：US20050087271A1

公开(公告)日：2005-04-28

申请号：US10931256

申请日：2004-09-01

申请人： Fumihiko Gejima ,  Hiroshi Sakurai ,  Masaki Kuno

发明人： Fumihiko Gejima ,  Hiroshi Sakurai ,  Masaki Kuno

IPC分类号： B62D25/04 ,  B21D22/02 ,  B21D53/88 ,  B62D21/02 ,  B62D25/00 ,  B62D25/06 ,  B62D25/20 ,  C21D8/10 ,  C21D8/00

CPC分类号： B62D25/00 ,  B21D53/88 ,  C21D7/10 ,  C21D7/12 ,  C21D8/105 ,  C21D9/08 ,  C21D10/00 ,  Y10T29/49616 ,  Y10T29/49622 ,  Y10T428/12229 ,  Y10T428/12292 ,  Y10T428/12972

摘要： A reinforced member which is made from a steel product having a strain aging characteristic and has a closed section at a cross section perpendicular to an axis of the reinforced member. The reinforced member includes a reinforced area which is produced by press-forming the steel product so as to generate a compression strain in the press-formed steel product due to the application of a compression stress to the steel product along the direction from a surface of the steel product to an inside of the steel product, and by giving a strain aging treatment to the press-formed member.

摘要翻译： 一种加强构件，其由具有应变老化特性的钢制品制成，并且在与增强构件的轴线垂直的截面处具有封闭截面。 加强构件包括加强区域，该加强区域是通过对钢制品进行冲压成形而产生的，以便在压制成形的钢制品中产生压缩应变，这是由于对钢材产生的压缩应力沿着从 钢制品到钢制品的内部，并且通过对冲压成形构件施加应变时效处理。

公开(公告)号：US08241561B2

公开(公告)日：2012-08-14

申请号：US12676271

申请日：2010-03-03

申请人： Fumihiko Gejima ,  Hiroki Sakamoto ,  Mamoru Sayashi

发明人： Fumihiko Gejima ,  Hiroki Sakamoto ,  Mamoru Sayashi

IPC分类号： C22C21/00

CPC分类号： C22C21/00 ,  B22F2998/10 ,  C22C1/0416 ,  C22C1/0491 ,  C22F1/04 ,  C22F1/053 ,  B22F9/082 ,  B22F3/20

摘要： Inventors of the present invention have found that, by manufacturing a stress-buffering material with a Ca-containing aluminum alloy including 0.1 to 12 at % of Ca, the stress-buffering material at low cost, capable of expanding its use in various fields, and having low Young's modulus that is beyond a conventional level, can be obtain.

摘要翻译： 本发明的发明人已经发现，通过使用包含0.1〜12at％的Ca的含Ca的铝合金制造应力缓冲材料，能够以各种领域扩大其应用的低成本的应力缓冲材料， 并且可以获得超过常规水平的低杨氏模量。

公开(公告)号：US20100172792A1

公开(公告)日：2010-07-08

申请号：US12676271

申请日：2008-09-11

申请人： Fumihiko Gejima ,  Hiroki Sakamoto ,  Mamoru Sayashi

发明人： Fumihiko Gejima ,  Hiroki Sakamoto ,  Mamoru Sayashi

IPC分类号： C22C21/00 ,  C22C21/10

CPC分类号： C22C21/00 ,  B22F2998/10 ,  C22C1/0416 ,  C22C1/0491 ,  C22F1/04 ,  C22F1/053 ,  B22F9/082 ,  B22F3/20

摘要： Inventors of the present invention have found that, by manufacturing a stress-buffering material with a Ca-containing aluminum alloy including 0.1 to 12 at % of Ca, the stress-buffering material at low cost, capable of expanding its use in various fields, and having low Young's modulus that is beyond a conventional level, can be obtain.

摘要翻译： 本发明的发明人已经发现，通过使用包含0.1〜12at％的Ca的含Ca的铝合金制造应力缓冲材料，能够以各种领域扩大其应用的低成本的应力缓冲材料， 并且可以获得超过常规水平的低杨氏模量。

公开(公告)号：US08852364B2

公开(公告)日：2014-10-07

申请号：US13393783

申请日：2010-12-14

申请人： Fumihiko Gejima

发明人： Fumihiko Gejima

IPC分类号： C22C21/08

CPC分类号： C22C21/02 ,  C22C21/06 ,  C22C21/08 ,  C22F1/043 ,  C22F1/047 ,  C22F1/05 ,  F16B35/00

摘要： Provided is material for an aluminum alloy exhibiting a sufficient heat resistance, tensile strength as well as stress corrosion cracking resistance necessary for use as automobile parts. Also, provided are a forged part forged from such aluminum alloy and an aluminum alloy high strength bolt made thereof. The aluminum alloy (by mass) is consisted of (by mass) 1.0 to 1.7% of Si, 0.05 to 0.5% of Fe, 0.8 to 1.5% of Cu, 0.6 to 1.2% of Mn, 0.9 to 1.5% of Mg, 0.05 to 0.5% of Zn, 0.05 to 0.3% of Zr, 0.01 to 0.2% of V, and when needed, Ti exceeding 0% and not more than 0.05%, and, when further needed, Ni exceeding 0% and not more than 0.7%, the remainder being Al and unavoidable impurities.

摘要翻译： 本发明提供铝合金材料，其具有足够的耐热性，拉伸强度以及用作汽车部件所需的应力腐蚀开裂性。 此外，提供了由这种铝合金锻造的锻造部件和由其制成的铝合金高强度螺栓。 铝合金（质量比）由（质量比）1.0〜1.7％的Si，0.05〜0.5％的Fe，0.8〜1.5％的Cu，0.6〜1.2％的Mn，0.9〜1.5％的Mg，0.05 至0.5％的Zn，0.05〜0.3％的Zr，0.01〜0.2％的V，如果需要，Ti超过0％且不大于0.05％，进一步需要时，Ni超过0％且不大于0.7 ％，其余为Al和不可避免的杂质。

公开(公告)号：US20120156089A1

公开(公告)日：2012-06-21

申请号：US13393783

申请日：2010-12-14

申请人： Fumihiko Gejima

发明人： Fumihiko Gejima

IPC分类号： C22C21/02 ,  C22C21/08 ,  C22C21/18 ,  C22C21/14 ,  C22C21/16

CPC分类号： C22C21/02 ,  C22C21/06 ,  C22C21/08 ,  C22F1/043 ,  C22F1/047 ,  C22F1/05 ,  F16B35/00

摘要： Provided is material for an aluminum alloy exhibiting a sufficient heat resistance, tensile strength as well as stress corrosion cracking resistance necessary for use as automobile parts. Also, provided are a forged part forged from such aluminum alloy and an aluminum alloy high strength bolt made thereof. The aluminum alloy (by mass) is consisted of (by mass) 1.0 to 1.7% of Si, 0.05 to 0.5% of Fe, 0.8 to 1.5% of Cu, 0.6 to 1.2% of Mn, 0.9 to 1.5% of Mg, 0.05 to 0.5% of Zn, 0.05 to 0.3% of Zr, 0.01 to 0.2% of V, and when needed, Ti exceeding 0% and not more than 0.05%, and, when further needed, Ni exceeding 0% and not more than 0.7%, the remainder being Al and unavoidable impurities.

摘要翻译： 本发明提供铝合金材料，其具有足够的耐热性，拉伸强度以及用作汽车部件所需的应力腐蚀开裂性。 此外，提供了由这种铝合金锻造的锻造部件和由其制成的铝合金高强度螺栓。 铝合金（质量比）由（质量比）1.0〜1.7％的Si，0.05〜0.5％的Fe，0.8〜1.5％的Cu，0.6〜1.2％的Mn，0.9〜1.5％的Mg，0.05 至0.5％的Zn，0.05〜0.3％的Zr，0.01〜0.2％的V，如果需要，Ti超过0％且不大于0.05％，进一步需要时，Ni超过0％且不大于0.7 ％，其余为Al和不可避免的杂质。