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    Substrate plating apparatus
    1.
    发明授权
    Substrate plating apparatus 有权
    基板电镀装置

    公开(公告)号：US06929722B2

    公开(公告)日：2005-08-16

    申请号：US09945711

    申请日：2001-09-05

    申请人： Akihisa Hongo ,  Naoaki Ogure ,  Hiroaki Inoue ,  Norio Kimura ,  Fumio Kuriyama ,  Manabu Tsujimura ,  Kenichi Suzuki ,  Atsushi Chono

    发明人： Akihisa Hongo ,  Naoaki Ogure ,  Hiroaki Inoue ,  Norio Kimura ,  Fumio Kuriyama ,  Manabu Tsujimura ,  Kenichi Suzuki ,  Atsushi Chono

    IPC分类号： C25D7/12 ,  H01L21/00 ,  H01L21/288 ,  H01L21/768 ,  C25D17/00 ,  H01M4/29 ,  C23B3/00

    CPC分类号： H01L21/67167 ,  C25D17/001 ,  H01L21/2885 ,  H01L21/67051 ,  H01L21/67126 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67219 ,  H01L21/6723 ,  H01L21/76849 ,  H01L21/76877 ,  Y10S134/902

    摘要： A substrate plating apparatus forms an interconnection layer on an interconnection region composed of a fine groove and/or a fine hole defined in a substrate. The substrate plating apparatus includes a plating unit for forming a plated layer on a surface of the substrate including the interconnection region, a chemical mechanical polishing unit for chemically mechanically polishing the substrate to remove the plated layer from the surface of the substrate leaving a portion of the plated layer in the interconnection region, a cleaning unit for cleaning the substrate after the plated layer is formed or the substrate is chemically mechanically polished, a drying unit for drying the substrate after the substrate is cleaned, and a substrate transfer unit for transferring the substrate to and from each of the first plating unit, the first chemical mechanical polishing unit, the cleaning unit, and the drying unit. The first plating unit, the first chemical mechanical polishing unit, the cleaning unit, the drying unit, and the substrate transfer unit are combined into a unitary arrangement.

    摘要翻译： 基板电镀装置在由微细凹槽和/或限定在基板中的细孔构成的互连区域上形成布线层。 基板电镀装置包括用于在包括互连区域的基板的表面上形成镀层的电镀单元，用于对基板进行化学机械抛光以从基板的表面移除镀层的化学机械抛光单元， 互连区域中的镀层，用于在形成镀层之后对基板进行清洗或基板进行化学机械抛光的清洁单元，用于在清洁基板之后使基板干燥的干燥单元，以及用于将基板转印 第一电镀单元，第一化学机械抛光单元，清洁单元和干燥单元中的每一个的基板。 第一电镀单元，第一化学机械抛光单元，清洁单元，干燥单元和基板转移单元组合成一体的布置。

    Substrate plating apparatus
    2.
    发明授权
    Substrate plating apparatus 有权
    基板电镀装置

    公开(公告)号：US06495004B1

    公开(公告)日：2002-12-17

    申请号：US09555650

    申请日：2000-06-29

    申请人： Fumio Kuriyama ,  Naoaki Ogure ,  Akihisa Hongo

    发明人： Fumio Kuriyama ,  Naoaki Ogure ,  Akihisa Hongo

    IPC分类号： C25D1700

    CPC分类号： H01L21/67161 ,  C23C18/1632 ,  C25D7/123 ,  C25D17/001 ,  H01L21/67173 ,  H01L21/6723

    摘要： A substrate plating apparatus forms a plating layer on the surface of a substrate and stores the substrate until the next process in a way that the substrate is not exposed to the atmosphere. The substrate plating apparatus is not only capable of introducing semiconductor wafers continuously one by one into the plating apparatus without loading the wafers into cassettes, but is also capable of preventing particle contamination and the formation of oxidized film on the surface of the wafers, thus reducing the number of process and reducing the installation area required for the apparatus. The substrate plating apparatus includes a plating process section (20) for plating a substrate, a washing process section (10) for washing the substrate after the plating process, and a storage vessel (16) containing a storing solution in which the substrate is immersed after having been plated and washed. A substrate conveyor is provided in the substrate plating apparatus for loading substrates into the substrate plating apparatus and discharging substrates out of the substrate plating apparatus, or for performing at least one of the loading or discharging operations, such that the substrates are loaded into the substrate plating apparatus one at a time, plated in the plating process section, washed in the washing process section, and subsequently discharged one at a time from the substrate plating apparatus.

    摘要翻译： 基板电镀装置在基板的表面上形成镀层，并以基板不暴露于大气的方式将基板存储到下一工序。 基板电镀装置不仅可以将半导体晶片连续地引入电镀装置，而且不将晶片装载到盒中，而且还能够防止颗粒污染和在晶片表面上形成氧化膜，从而减少 过程的数量和减少设备所需的安装面积。 基板电镀设备包括用于电镀基板的电镀处理部分（20），用于在电镀工艺之后洗涤基板的洗涤处理部分（10），以及储存容器（16），所述储存容器包含浸没所述基板的储存溶液 经过电镀和洗涤。 基板输送机设置在基板电镀装置中，用于将基板装载到基板电镀装置中，并将基板从基板镀敷装置中排出，或者进行至少一个装载或放电操作，使得基板被装入基板 电镀装置一次，镀在电镀处理部分中，在洗涤工序部分洗涤，然后一次从基板镀敷装置中排出。

    Substrate plating apparatus
    3.
    发明授权
    Substrate plating apparatus 有权
    基板电镀装置

    公开(公告)号：US06294059B1

    公开(公告)日：2001-09-25

    申请号：US09154895

    申请日：1998-09-17

    申请人： Akihisa Hongo ,  Naoaki Ogure ,  Hiroaki Inoue ,  Norio Kimura ,  Fumio Kuriyama ,  Manabu Tsujimura ,  Kenichi Suzuki ,  Atsushi Chono

    发明人： Akihisa Hongo ,  Naoaki Ogure ,  Hiroaki Inoue ,  Norio Kimura ,  Fumio Kuriyama ,  Manabu Tsujimura ,  Kenichi Suzuki ,  Atsushi Chono

    IPC分类号： C25D1700

    CPC分类号： H01L21/67167 ,  C25D17/001 ,  H01L21/2885 ,  H01L21/67051 ,  H01L21/67126 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67219 ,  H01L21/6723 ,  H01L21/76849 ,  H01L21/76877 ,  Y10S134/902

    摘要： A substrate plating apparatus forms an interconnection layer on an interconnection region composed of a fine groove and/or a fine hole defined in a substrate. The substrate plating apparatus includes a plating unit for forming a plated layer on a surface of the substrate including the interconnection region, a chemical mechanical polishing unit for chemically mechanically polishing the substrate to remove the plated layer from the surface of the substrate leaving a portion of the plated layer in the interconnection region, a cleaning unit for cleaning the substrate after the plated layer is formed or the substrate is chemically mechanically polished, a drying unit for drying the substrate after the substrate is cleaned, and a substrate transfer unit for transferring the substrate to and from each of the first plating unit, the first chemical mechanical polishing unit, the cleaning unit, and the drying unit. The first plating unit, the first chemical mechanical polishing unit, the cleaning unit, the drying unit, and the substrate transfer unit are combined into a unitary arrangement.

    摘要翻译： 基板电镀装置在由微细凹槽和/或限定在基板中的细孔构成的互连区域上形成布线层。 基板电镀装置包括用于在包括互连区域的基板的表面上形成镀层的电镀单元，用于对基板进行化学机械抛光以从基板的表面移除镀层的化学机械抛光单元， 互连区域中的镀层，用于在形成镀层之后对基板进行清洗或基板进行化学机械抛光的清洁单元，用于在清洁基板之后使基板干燥的干燥单元，以及用于将基板转印 第一电镀单元，第一化学机械抛光单元，清洁单元和干燥单元中的每一个的基板。 第一电镀单元，第一化学机械抛光单元，清洁单元，干燥单元和基板转移单元组合成一体的布置。

    Method and apparatus for plating a substrate
    4.
    发明授权
    Method and apparatus for plating a substrate 有权
    电镀基板的方法和装置

    公开(公告)号：US06544585B1

    公开(公告)日：2003-04-08

    申请号：US09145500

    申请日：1998-09-02

    申请人： Fumio Kuriyama ,  Akihisa Hongo ,  Hiroaki Inoue ,  Tsuyoshi Tokuoka

    发明人： Fumio Kuriyama ,  Akihisa Hongo ,  Hiroaki Inoue ,  Tsuyoshi Tokuoka

    IPC分类号： B05D512

    CPC分类号： H01L21/6715 ,  H01L21/67144

    摘要： A high quality metallic deposit can be produced inside the micro-cavities formed on a surface of a substrate by the present invention. The method involves immersing the substrate in a liquid held in a processing chamber, evacuating the processing chamber so as to remove residual bubbles from the micro-cavities and to degas the liquid within the micro-cavities, and subjecting the liquid to boiling in at least those regions adjacent to the substrate.

    摘要翻译： 通过本发明，可以在形成在基板的表面上的微孔内产生高质量的金属沉积物。 该方法包括将基底浸入保持在处理室中的液体中，抽空处理室以从微孔中除去残余气泡并使微腔内的液体脱气，并至少使液体沸腾 那些区域与衬底相邻。

    Electroplating method
    5.
    发明授权
    Electroplating method 有权
    电镀法

    公开(公告)号：US09376758B2

    公开(公告)日：2016-06-28

    申请号：US13311020

    申请日：2011-12-05

    申请人： Shingo Yasuda ,  Fumio Kuriyama ,  Masashi Shimoyama ,  Mizuki Nagai ,  Yusuke Tamari

    发明人： Shingo Yasuda ,  Fumio Kuriyama ,  Masashi Shimoyama ,  Mizuki Nagai ,  Yusuke Tamari

    IPC分类号： C25D5/18 ,  C25D7/12

    CPC分类号： C25D5/18 ,  C25D7/123

    摘要： An electroplating method can securely and efficiently fill a plated metal into deep high-aspect ratio vias in a bottom-up manner without producing defects in the plated metal. The electroplating method includes: immersing a substrate, having vias formed in a surface, and an anode in a plating solution in a plating tank, the anode being disposed opposite the surface of the substrate; and intermittently passing a plating current at a constant current value between the substrate and the anode in such a manner that the supply and the stop of the plating current are repeated, and that the proportion of a current supply time during which the plating current is supplied increases with the progress of plating, thereby filling a plated metal into the vias.

    摘要翻译： 电镀方法可以以自下而上的方式可靠且有效地将电镀金属填充到深高纵横比的通孔中，而不会在电镀金属中产生缺陷。 电镀方法包括：在基板的表面上设置阳极，将具有在表面中形成的通孔的基板和阳极浸入电镀槽中的电镀液中; 并以这样的方式间歇地通过基板和阳极之间的恒定电流值的电镀电流，使得电镀电流的供应和停止重复，并且提供电镀电流的电流供应时间的比例 随着电镀的进行而增加，从而将电镀金属填充到通孔中。

    Plating apparatus and plating method for forming magnetic film
    7.
    发明申请
    Plating apparatus and plating method for forming magnetic film 有权
    用于形成磁性膜的电镀装置和电镀方法

    公开(公告)号：US20100006444A1

    公开(公告)日：2010-01-14

    申请号：US12458260

    申请日：2009-07-07

    申请人： Yasuhiko Endo ,  Fumio Kuriyama ,  Masaaki Kimura

    发明人： Yasuhiko Endo ,  Fumio Kuriyama ,  Masaaki Kimura

    IPC分类号： C25D5/00 ,  C25D17/28

    CPC分类号： C25D17/00 ,  C25D5/006 ,  C25D17/001 ,  C25D17/12

    摘要： A magnetic film plating apparatus employs a dip method that allows relatively good escape of bubbles and does not require a wide footprint and, even when a ferromagnetic material is used for an anode, can form a magnetic film on a substrate surface while minimizing the influence of the anode on the uniformity of magnetic anisotropy in the magnetic film. The magnetic film plating apparatus includes a plating tank for holding a plating solution; an anode vertically disposed in the plating tank at a position to be immersed in the plating solution; a substrate holder for holding a substrate W and positioning the substrate W opposite the anode; and a magnetic field generator, disposed outside the plating tank, for generating a magnetic field around the substrate W held by the substrate holder and positioned opposite the anode.

    摘要翻译： 磁性膜电镀装置采用允许气泡相对较好逸出并且不需要宽的占地面积的浸渍方法，并且即使当铁磁材料用于阳极时，也可以在基板表面上形成磁性膜，同时最小化 阳极对磁性膜中磁各向异性的均匀性。 磁性膜电镀装置包括：用于保持电镀液的电镀槽; 在浸镀在镀液中的位置上垂直设置在镀槽内的阳极; 用于保持衬底W并将衬底W定位在与阳极相对的衬底保持器; 以及设置在镀槽外部的磁场发生器，用于在由衬底保持器保持并且与阳极相对定位的衬底W周围产生磁场。

    Apparatus and method for plating a substrate
    9.
    发明申请
    Apparatus and method for plating a substrate 有权
    电镀基板的装置及方法

    公开(公告)号：US20090045068A1

    公开(公告)日：2009-02-19

    申请号：US12071353

    申请日：2008-02-20

    申请人： Masahiko Sekimoto ,  Fumio Kuriyama ,  Yasuhiko Endo ,  Stephen Strausser

    发明人： Masahiko Sekimoto ,  Fumio Kuriyama ,  Yasuhiko Endo ,  Stephen Strausser

    IPC分类号： C25D5/08 ,  C25D17/00

    CPC分类号： C25D5/08

    摘要： A plating apparatus and method bubbles generated at the plating surfaces easily removed and the uniformity of the thickness of the plated film within the plated surface can be improved. The plating apparatus has a cassette table for loading a cassette in which a substrate having a plating surface is contained. An aligner for aligning the substrate, a rinser-dryer for rinsing and drying the substrate, and a plating unit for plating the substrate are also provided. The plating unit includes a plating vessel containing a plating solution, and a holder holds the substrate to immerse the substrate in the plating solution in the plating vessel. The plating surface is exposed to a nozzle which ejects the plating solution toward the plating surface.

    摘要翻译： 可以容易地去除在电镀面上产生的电镀装置和方法，并且可以提高电镀表面内的镀膜厚度的均匀性。 电镀装置具有用于装载其中包含具有电镀表面的基板的盒的盒台。 还提供了用于对准衬底的校准器，用于冲洗和干燥衬底的洗衣机 - 干燥器，以及用于电镀衬底的电镀单元。 电镀单元包括含有电镀液的电镀槽，保持器保持基板将基板浸入电镀槽中的电镀液中。 电镀表面暴露于喷镀电镀溶液朝向电镀面的喷嘴。

    Plating apparatus
    10.
    再颁专利
    Plating apparatus 有权

    公开(公告)号：USRE39123E1

    公开(公告)日：2006-06-13

    申请号：US10187801

    申请日：1999-11-26

    申请人： Fumio Kuriyama ,  Hiroyuki Ueyama ,  Junitsu Yamakawa ,  Kenichi Suzuki ,  Atsushi Chono

    发明人： Fumio Kuriyama ,  Hiroyuki Ueyama ,  Junitsu Yamakawa ,  Kenichi Suzuki ,  Atsushi Chono

    IPC分类号： C25D21/12 ,  C25B15/00 ,  C25B7/00

    CPC分类号： C25D21/14 ,  C25D17/001 ,  C25D21/16 ,  C25D21/18

    摘要： The plating apparatus has a plating section in which a plating process is performed and a control section for regulating the plating solution. The plating section includes a plating bath containing plating solution, an anode provided in the plating solution, and a plating object serving as a cathode placed in the plating solution opposite the anode. The control section includes a regulating tank for regulating the composition and/or concentration of the plating solution, and a replenishing tank for injecting solution into the plating solution in the regulating tank. The plating apparatus also includes a mechanism for circulating plating solution between the regulating tank in the control section and the plating bath in the plating section. The plating section is installed in a first room, while the control section is installed in a second room, which is separate from the first room Accordingly, contamination in the plating section is prevented.