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    COATING DEVICE
    1.
    发明申请
    COATING DEVICE 失效
    涂装装置

    公开(公告)号：US20120079983A1

    公开(公告)日：2012-04-05

    申请号：US13251468

    申请日：2011-12-07

    申请人： Futoshi Shimai ,  Tsutomu Sahoda ,  Akihiko Sato ,  Kenji Maruyama

    发明人： Futoshi Shimai ,  Tsutomu Sahoda ,  Akihiko Sato ,  Kenji Maruyama

    IPC分类号： B05C5/02

    CPC分类号： B05C5/0208 ,  B05B13/02 ,  B05C5/02 ,  H01L21/67011 ,  H01L21/6715

    摘要： Provided is a coating device including: a rotating part which rotatably holds a substrate while the substrate is upright; a cup portion disposed to surround an outer periphery of the substrate held by the rotating part and having an opening which exposes a first surface and a second surface of the substrate; a coating part which includes a nozzle ejecting a liquid material to the first surface and to the second surface of the substrate through the opening; and a cover portion which is provided on the first surface and the second surface sides of the substrate and by which the opening is opened and closed.

    摘要翻译： 提供一种涂布装置，包括：旋转部，其在基板垂直的状态下可旋转地保持基板; 杯部，其设置成包围由所述旋转部保持的所述基板的外周，并具有露出所述基板的第一表面和第二表面的开口; 涂料部分，其包括通过所述开口将液体材料喷射到所述第一表面和所述基板的第二表面的喷嘴; 以及设置在基板的第一表面和第二表面侧上并且开口被打开和关闭的盖部分。

    Coating device
    3.
    发明授权
    Coating device 有权
    涂装装置

    公开(公告)号：US08807072B2

    公开(公告)日：2014-08-19

    申请号：US13251468

    申请日：2011-10-03

    申请人： Futoshi Shimai ,  Tsutomu Sahoda ,  Akihiko Sato ,  Kenji Maruyama

    发明人： Futoshi Shimai ,  Tsutomu Sahoda ,  Akihiko Sato ,  Kenji Maruyama

    IPC分类号： B05C5/02 ,  B05B13/02 ,  B05C5/00 ,  B05B13/00 ,  H01L21/67

    CPC分类号： B05C5/0208 ,  B05B13/02 ,  B05C5/02 ,  H01L21/67011 ,  H01L21/6715

    摘要： Provided is a coating device including: a rotating part which rotatably holds a substrate while the substrate is upright; a cup portion disposed to surround an outer periphery of the substrate held by the rotating part and having an opening which exposes a first surface and a second surface of the substrate; a coating part which includes a nozzle ejecting a liquid material to the first surface and to the second surface of the substrate through the opening; and a cover portion which is provided on the first surface and the second surface sides of the substrate and by which the opening is opened and closed.

    摘要翻译： 提供一种涂布装置，包括：旋转部，其在基板垂直的状态下可旋转地保持基板; 杯部，其设置成包围由所述旋转部保持的所述基板的外周，并具有露出所述基板的第一表面和第二表面的开口; 涂料部分，其包括通过所述开口将液体材料喷射到所述第一表面和所述基板的第二表面的喷嘴; 以及设置在基板的第一表面和第二表面侧上并且开口被打开和关闭的盖部分。

    Substrate processing system, carrying device, and coating device
    4.
    发明授权
    Substrate processing system, carrying device, and coating device 有权
    基板加工系统，承载装置和涂装装置

    公开(公告)号：US08919756B2

    公开(公告)日：2014-12-30

    申请号：US12877881

    申请日：2010-09-08

    申请人： Tsutomu Sahoda ,  Futoshi Shimai ,  Akihiko Sato

    发明人： Tsutomu Sahoda ,  Futoshi Shimai ,  Akihiko Sato

    IPC分类号： B25B11/00 ,  H01L21/67 ,  H01L21/677

    CPC分类号： H01L21/67051 ,  H01L21/67161 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67751 ,  H01L21/67766 ,  H01L21/67778 ,  Y10S269/903

    摘要： A substrate processing system includes a processing unit, a substrate loading unit, a substrate unloading unit, and a carrying unit. A carrying device has a constitution in which a suction portion suctioning and holding a substrate is rotatable about an arm portion provided in a base portion and the substrate is rotated in the state where the substrate is held by a holding portion. A coating device has a constitution in which a liquid material is ejected from a nozzle to both surfaces of the substrate rotating in an upright state.

    摘要翻译： 基板处理系统包括处理单元，基板装载单元，基板卸载单元和承载单元。 携带装置具有这样一种构造，其中吸引和保持基板的吸附部分可以围绕设置在基部中的臂部分旋转，并且基板在通过保持部保持基板的状态下旋转。 涂布装置具有液体材料从喷嘴喷射到以直立状态旋转的基板的两个表面的构造。

    Coating device and nozzle managing method
    5.
    发明授权
    Coating device and nozzle managing method 失效
    涂装装置和喷嘴管理方法

    公开(公告)号：US08667924B2

    公开(公告)日：2014-03-11

    申请号：US12824006

    申请日：2010-06-25

    申请人： Tsutomu Sahoda ,  Futoshi Shimai ,  Akihiko Sato

    发明人： Tsutomu Sahoda ,  Futoshi Shimai ,  Akihiko Sato

    IPC分类号： B05C11/02 ,  B05B15/02 ,  B05B7/06 ,  B05C5/00

    CPC分类号： H01L21/67751 ,  H01L21/6715 ,  H01L21/68764

    摘要： A coating device including a coating mechanism which includes nozzles for ejecting a liquid material onto front and rear surfaces of the substrate while rotating a substrate in an upright state, and a nozzle managing mechanism which manages the state of the nozzles, in which the nozzle managing mechanism includes a soaking portion which dips the front end of the nozzle in a soak solution, and a discharging portion which discharges at least the soak solution, and a nozzle managing method.

    摘要翻译： 一种涂布装置，包括涂布机构，其包括用于在直立状态下旋转基板的同时将液体材料喷射到基板的前表面和后表面上的喷嘴;以及喷嘴管理机构，其管理喷嘴的状态，其中喷嘴管理 机构包括在浸泡溶液中浸渍喷嘴的前端的浸泡部分和至少排出浸泡溶液的排出部分和喷嘴管理方法。

    Coating device and coating method
    6.
    发明授权
    Coating device and coating method 失效
    涂布装置和涂布方法

    公开(公告)号：US08567342B2

    公开(公告)日：2013-10-29

    申请号：US12847912

    申请日：2010-07-30

    申请人： Tsutomu Sahoda ,  Futoshi Shimai ,  Akihiko Sato

    发明人： Tsutomu Sahoda ,  Futoshi Shimai ,  Akihiko Sato

    IPC分类号： B05C11/02 ,  B05C5/00 ,  B05B7/06

    CPC分类号： H01L21/67751 ,  H01L21/67051 ,  H01L21/67086 ,  H01L21/6715

    摘要： A coating device includes a coating mechanism which includes nozzles for ejecting a liquid material onto front and rear surfaces of a substrate while rotating the substrate; and an adjusting mechanism which adjusts the coating state of the liquid material at the outer periphery of the substrate; wherein the adjusting mechanism includes a dip portion which dips the outer periphery of the substrate in a solution while rotating the substrate and dissolves and removes a thin film formed on the outer periphery of the substrate; and a suction portion which suctions the vicinity of the outer periphery of the substrate after dipping in the solution.

    摘要翻译： 涂覆装置包括涂覆机构，其包括用于在旋转衬底的同时将液体材料喷射到衬底的前表面和后表面上的喷嘴; 以及调节机构，其调节在所述基板的外周的液体材料的涂布状态; 其中所述调节机构包括在旋转所述基板的同时在溶液中浸渍所述基板的外周的浸渍部，并且溶解并除去形成在所述基板的外周上的薄膜; 以及在浸渍在溶液中后吸附基板外周附近的抽吸部分。

    Substrate processing system
    7.
    发明授权
    Substrate processing system 有权
    基板加工系统

    公开(公告)号：US08387556B2

    公开(公告)日：2013-03-05

    申请号：US12824025

    申请日：2010-06-25

    申请人： Tsutomu Sahoda ,  Futoshi Shimai ,  Akihiko Sato

    发明人： Tsutomu Sahoda ,  Futoshi Shimai ,  Akihiko Sato

    IPC分类号： B05C11/02 ,  B05C5/00 ,  B05B7/06

    CPC分类号： H01L21/6715 ,  H01L21/67751

    摘要： A coating device includes a coating mechanism which includes nozzles for ejecting a liquid material onto front and rear surfaces of the substrate while rotating a substrate in an upright state at a predetermined coating position, a carrying mechanism which carries the substrate between a substrate loading position, the coating position, and a substrate unloading position, and a dummy substrate holding mechanism which holds a dummy substrate at a holding position which is a position different from the substrate loading position, the coating position, and the substrate unloading position, and at which the carrying mechanism is allowed to connect with the dummy substrate.

    摘要翻译： 涂覆装置包括涂覆机构，其包括用于将液体材料喷射到基板的前表面和后表面上的喷嘴，同时在预定涂覆位置处以直立状态旋转基板;承载机构，其将基板承载在基板装载位置， 涂布位置和基板卸载位置，以及虚设基板保持机构，其将虚设基板保持在与基板装载位置，涂布位置和基板卸载位置不同的保持位置的保持位置， 允许携带机构与虚拟基板连接。

    Coating device and coating method
    10.
    发明授权
    Coating device and coating method 失效
    涂布装置和涂布方法

    公开(公告)号：US08617655B2

    公开(公告)日：2013-12-31

    申请号：US12777081

    申请日：2010-05-10

    申请人： Tsutomu Sahoda ,  Futoshi Shimai ,  Akihiko Sato

    发明人： Tsutomu Sahoda ,  Futoshi Shimai ,  Akihiko Sato

    IPC分类号： B05D3/10 ,  B05D1/18

    CPC分类号： H01L21/67751 ,  H01L21/67086 ,  H01L21/6715

    摘要： A coating device includes a coating mechanism which includes nozzles for ejecting a liquid material onto front and rear surfaces of a substrate while rotating the substrate; and an adjusting mechanism which adjusts the coating state of the liquid material at the outer periphery of the substrate; wherein the adjusting mechanism includes a dip portion which dips the outer periphery of the substrate in a solution while rotating the substrate and dissolves; and a suction portion which suctions the vicinity of the outer periphery of the substrate after dipping in the solution.

    摘要翻译： 涂覆装置包括涂覆机构，其包括用于在旋转衬底的同时将液体材料喷射到衬底的前表面和后表面上的喷嘴; 以及调节机构，其调节在所述基板的外周的液体材料的涂布状态; 其中所述调节机构包括在旋转所述基板并溶解时在溶液中浸渍所述基板的外周的浸渍部; 以及在浸渍在溶液中后吸附基板外周附近的抽吸部分。