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公开(公告)号：US09750127B2
公开(公告)日：2017-08-29
申请号：US14959553
申请日：2015-12-04
Applicant: General Electric Company
Inventor： Joo Han Kim , Michelle Ann Parziale , Jerry Leon Wright , Hendrik Pieter Jacobus de Bock , Brian Patrick Hoden
CPC classification number: H05K1/0203 , H05K7/20336 , H05K7/20636 , H05K13/04
Abstract: A circuit card assembly includes a first printed circuit board and a first electronic component mounted on the first printed circuit board. A heat transfer assembly is coupled to the first printed circuit board. The heat transfer assembly includes a first plate extending adjacent the first printed circuit board and a second plate extending adjacent the first plate. At least one of the first plate and the second plate includes an accommodation feature to accommodate the first electronic component. The heat transfer assembly further includes a first set of heat pipes between the first plate and the second plate. The first set of heat pipes is configured to remove heat from the first electronic component. At least one heat pipe of the first set of heat pipes extends adjacent the accommodation feature.
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Patent Agency Ranking
公开(公告)号：US20160021788A1
公开(公告)日：2016-01-21
申请号：US14676241
申请日：2015-04-01
Applicant: GENERAL ELECTRIC COMPANY
Inventor： Shakti Singh Chauhan , James Neil Johnson , Brian Patrick Hoden , Graham Charles Kirk
CPC classification number: H05K7/20427 , B23P15/26 , H01L23/3675 , H01L23/3732 , H01L23/42 , H01L2224/16225 , H01L2224/73253 , H01L2924/15311 , H01L2924/16152
Abstract: An electronic device assembly includes a heat sink coupled to an electronic device to dissipate the heat produced by the electronic device. A heat spreader is coupled between the electronic device and the heat sink to transfer heat from the electronic device to the heat sink. Furthermore, at least one of the electronic device, the heat spreader, and the heat sink is disposed with a disordered carbon coating.
Abstract translation: 电子设备组件包括耦合到电子设备的散热器以散发由电子设备产生的热量。 散热器耦合在电子设备和散热器之间，以将热量从电子设备传递到散热器。 此外，电子设备，散热器和散热器中的至少一个设置有无序的碳涂层。
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公开(公告)号：US09333599B2
公开(公告)日：2016-05-10
申请号：US14135678
申请日：2013-12-20
Applicant: General Electric Company
Inventor： Hendrik Pieter Jacobus de Bock , Stanton Earl Weaver, Jr. , Tao Deng , Jay Todd Labhart , Pramod Chamarthy , Shakti Singh Chauhan , Graham Charles Kirk , Brian Patrick Hoden
CPC classification number: B23P15/26 , B23P2700/09 , B23P2700/10 , F28D15/0266 , F28D15/0275 , H05K7/20681 , H05K9/0062 , Y10T29/49826
Abstract: An electronics chassis is provided. The electronics chassis includes a plurality of panels that define an interior space. One panel of the plurality of panels has a composite segment having an internal face and an external face. The electronics chassis further includes a conductive thermal pathway that extends through the panel from the internal face of the composite segment to the external face of the composite segment.
Abstract translation: 提供电子底盘。 电子机箱包括限定内部空间的多个面板。 所述多个面板中的一个面板具有具有内表面和外表面的复合区段。 电子底盘还包括导电热路径，其从复合段的内表面延伸穿过面板到复合段的外表面。
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公开(公告)号：US20150181763A1
公开(公告)日：2015-06-25
申请号：US14135678
申请日：2013-12-20
Applicant: General Electric Company
Inventor： Hendrik Pieter Jacobus de Bock , Stanton Earl Weaver, JR. , Tao Deng , Jay Todd Labhart , Pramod Chamarthy , Shakti Singh Chauhan , Graham Charles Kirk , Brian Patrick Hoden
CPC classification number: B23P15/26 , B23P2700/09 , B23P2700/10 , F28D15/0266 , F28D15/0275 , H05K7/20681 , H05K9/0062 , Y10T29/49826
Abstract: An electronics chassis is provided. The electronics chassis includes a plurality of panels that define an interior space. One panel of the plurality of panels has a composite segment having an internal face and an external face. The electronics chassis further includes a conductive thermal pathway that extends through the panel from the internal face of the composite segment to the external face of the composite segment.
Abstract translation: 提供电子底盘。 电子机箱包括限定内部空间的多个面板。 所述多个面板中的一个面板具有具有内表面和外表面的复合区段。 电子底盘还包括导电热路径，其从复合段的内表面延伸穿过面板到复合段的外表面。
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公开(公告)号：US20170164459A1
公开(公告)日：2017-06-08
申请号：US14959553
申请日：2015-12-04
Applicant: General Electric Company
Inventor： Joo Han Kim , Michelle Ann Parziale , Jerry Leon Wright , Hendrik Pieter Jacobus de Bock , Brian Patrick Hoden
CPC classification number: H05K1/0203 , H05K7/20336 , H05K7/20636 , H05K13/04
Abstract: A circuit card assembly includes a first printed circuit board and a first electronic component mounted on the first printed circuit board. A heat transfer assembly is coupled to the first printed circuit board. The heat transfer assembly includes a first plate extending adjacent the first printed circuit board and a second plate extending adjacent the first plate. At least one of the first plate and the second plate includes an accommodation feature to accommodate the first electronic component. The heat transfer assembly further includes a first set of heat pipes between the first plate and the second plate. The first set of heat pipes is configured to remove heat from the first electronic component. At least one heat pipe of the first set of heat pipes extends adjacent the accommodation feature.
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公开(公告)号：US20170147044A1
公开(公告)日：2017-05-25
申请号：US14949075
申请日：2015-11-23
Applicant: General Electric Company
Inventor： David S. Slaton , Jerry Leon Wright , Brian Patrick Hoden
IPC: G06F1/20
CPC classification number: G06F1/20 , H05K1/0209 , H05K2201/066
Abstract: Disclosed herein are systems and methods for the thermal regulation of on-board electronic components using a mezzanine filler module. The mezzanine filler module connects at a mezzanine site of the circuit board to provide an additional thermal conduction path for thermal energy released, at least, from component located under the mezzanine site.
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