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公开(公告)号：US20230304879A1
公开(公告)日：2023-09-28
申请号：US17702596
申请日：2022-03-23
Applicant: General Electric Company
Inventor： Robert James MacDonald , Yizhen Lin , Nicholas G. Yost , David Richard Esler
CPC classification number: G01L5/173 , B81B7/0019 , B81C1/00817 , B81B2201/0292 , B81C2203/033
Abstract: A sensing element having improved temperature and pressure characteristics including at least one acoustic sensing device formed mainly from a silicon substrate and having a microelectromechanical system without the use of quartz or polymer, wherein the at least one acoustic sensing device detects a torque associated with a metal object subject to said torque, and a high temperature bonding surface for directly connecting the sensing element to the metal object via a high temperature connecting processes comprising at least one of soldering, metalizing and/or brazing, without the need for a polymer adhesive. Related sensors using such sensing elements and methods are also disclosed herein.
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公开(公告)号：US11482449B2
公开(公告)日：2022-10-25
申请号：US16983380
申请日：2020-08-03
Applicant: General Electric Company
Inventor： Cheng-Po Chen , Reza Ghandi , David Richard Esler , David Mulford Shaddock , Emad Andarawis Andarawis , Liang Yin
IPC: H01L23/48 , H01L21/768 , H01L21/02 , H01L23/31 , H01L23/00 , H01L23/532
Abstract: An electrical component and method for manufacturing the electrical component with a substrate a conductor stack having multiple layers and including at least one electrically conductive path. The conductor stack mounted to the substrate with a dielectric passivation stack encasing at least a portion of the conductor stack.
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公开(公告)号：US10605785B2
公开(公告)日：2020-03-31
申请号：US15616105
申请日：2017-06-07
Applicant: General Electric Company
Inventor： Joseph Iannotti , Christopher James Kapusta , David Richard Esler
Abstract: A system includes a structure configured to have a structure bonding layer disposed on a surface of the structure. The structure bonding layer is a metallic alloy. The system includes a sensor configured to have a sensor bonding layer disposed on a surface of the sensor. The sensor bonding layer is a metallic alloy. The sensor bonding layer is configured to be coupled to the structure bonding layer via a metallic joint in order for the sensor to sense data of the structure through the metallic joint, the structure bonding layer, and the sensor bonding layer.
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公开(公告)号：US20140270650A1
公开(公告)日：2014-09-18
申请号：US13844246
申请日：2013-03-15
Applicant: GENERAL ELECTRIC COMPANY
Inventor： Ansas Matthias Kasten , Sora Kim , David Richard Esler , Jim Grecco
IPC: G02B6/42
CPC classification number: G02B6/4292 , G02B6/423 , Y10T29/49826
Abstract: An optical subassembly and method of manufacturing an optical subassembly are provided. One subassembly includes a base, an optical emitter attached to the base and one or more spacers attached to the base surrounding at least a portion of the optical emitter. The optical subassembly further includes a ferrule sleeve attached to the base with the optical emitter and one or more spacers within the ferrule sleeve, wherein the ferrule sleeve is configured to receive an optical fiber therein. The optical subassembly also includes one or more reinforcement members attached to the base adjacent the ferrule sleeve and configured to provide support to the ferrule sleeve.
Abstract translation: 提供了一种光学组件及其制造方法。 一个子组件包括底座，连接到基座的光发射器和连接到围绕光发射器的至少一部分的基座的一个或多个间隔件。 所述光学组件还包括套筒套筒，所述套圈套筒与所述光发射器和所述套圈套筒内的一个或多个间隔件连接到所述基座，其中所述套圈套筒构造成在其中容纳光纤。 光学子组件还包括一个或多个加强构件，其附接到邻近套圈套筒的基座并且被配置为向套圈套筒提供支撑。
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公开(公告)号：US12125745B2
公开(公告)日：2024-10-22
申请号：US17949325
申请日：2022-09-21
Applicant: General Electric Company
Inventor： Cheng-Po Chen , Reza Ghandi , David Richard Esler , David Mulford Shaddock , Emad Andarawis Andarawis , Liang Yin
IPC: H01L21/768 , H01L21/02 , H01L23/00 , H01L23/31 , H01L23/532
CPC classification number: H01L21/76832 , H01L21/02172 , H01L23/3192 , H01L23/53252 , H01L24/05 , H01L2224/05599 , H01L2924/1904
Abstract: An electrical component and method for manufacturing the electrical component with a substrate a conductor stack having multiple layers and including at least one electrically conductive path. The conductor stack mounted to the substrate with a dielectric passivation stack encasing at least a portion of the conductor stack.
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Patent Agency Ranking
公开(公告)号：US11982645B2
公开(公告)日：2024-05-14
申请号：US18134788
申请日：2023-04-14
Applicant: General Electric Company
CPC classification number: G01N29/223 , G01D11/245 , G01K11/265 , G01N29/2443 , G01N29/2462
Abstract: A system includes a sensor comprising a sensor bonding layer disposed on a surface of the sensor, wherein the sensor bonding layer is a metallic alloy. An inlay includes a planar outer surface, wherein the inlay may be disposed on a curved surface of a structure. A structure bonding layer may be disposed on the planar outer surface of the inlay, wherein the structure bonding layer is a metallic alloy. The sensor bonding layer is coupled to the structure bonding layer via a metallic joint, and the sensor is configured to sense data of the structure through the metallic joint, the structure bonding layer, and the sensor bonding layer. The inlay comprises at least one of a modulus of elasticity, a shape, a thickness, and a size configured to reduce strain transmitted to the sensor.
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公开(公告)号：US11289444B2
公开(公告)日：2022-03-29
申请号：US16713437
申请日：2019-12-13
Applicant: General Electric Company
Inventor： David Richard Esler , Nancy Cecelia Stoffel
IPC: H01L23/00 , H01L41/047 , B81B7/00 , B81C1/00
Abstract: A sensor assembly includes a die substrate and a metalized layer formed on the die substrate. The metalized layer is formed of a first metal material and includes a bonding pad to facilitate electrically coupling the sensor assembly to a sensor system. A remetalized bump is formed on the bonding pad of a second metal material and is electrically coupled to the metalized layer. An adhesive is applied to the remetalized bump and facilitates mechanically coupling the sensor assembly to the sensor system.
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公开(公告)号：US20210183808A1
公开(公告)日：2021-06-17
申请号：US16713437
申请日：2019-12-13
Applicant: General Electric Company
Inventor： David Richard Esler , Nancy Cecelia Stoffel
IPC: H01L23/00 , H01L41/047 , B81B7/00
Abstract: A sensor assembly includes a die substrate and a metalized layer formed on the die substrate. The metalized layer is formed of a first metal material and includes a bonding pad to facilitate electrically coupling the sensor assembly to a sensor system. A re-metalized bump is formed on the bonding pad of a second metal material and is electrically coupled to the metalized layer. An adhesive is applied to the re-metalized bump and facilitates mechanically coupling the sensor assembly to the sensor system.
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9.发明授权公开(公告)号：US10892237B2
公开(公告)日：2021-01-12
申请号：US16221033
申请日：2018-12-14
Applicant: General Electric Company
Inventor： Stephen Daley Arthur , Liangchun Yu , Nancy Cecelia Stoffel , David Richard Esler , Christopher James Kapusta
Abstract: Methods of fabricating a semiconductor device are provided. The method includes providing a plurality of semiconductor devices. The method further includes disposing a dielectric dry film on the plurality of semiconductor devices, wherein the dielectric dry film is patterned such that openings in the patterned dielectric dry film are aligned with conductive pads of each of the plurality of semiconductor devices.
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公开(公告)号：US20180356368A1
公开(公告)日：2018-12-13
申请号：US15616105
申请日：2017-06-07
Applicant: General Electric Company
Inventor： Joseph Iannotti , Christopher James Kapusta , David Richard Esler
CPC classification number: G01N29/223 , B23K1/002 , G01K11/265 , G01L1/165 , G01L3/00 , G01L19/147 , G01N29/2462 , H01L24/28
Abstract: A system includes a structure configured to have a structure bonding layer disposed on a surface of the structure. The structure bonding layer is a metallic alloy. The system includes a sensor configured to have a sensor bonding layer disposed on a surface of the sensor. The sensor bonding layer is a metallic alloy. The sensor bonding layer is configured to be coupled to the structure bonding layer via a metallic joint in order for the sensor to sense data of the structure through the metallic joint, the structure bonding layer, and the sensor bonding layer.
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