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1.发明授权公开(公告)号：US09565759B2
公开(公告)日：2017-02-07
申请号：US14700850
申请日：2015-04-30
Applicant: GLOBALFOUNDRIES INC.
Inventor： Gareth Hougham , Gerard McVicker , Xiaoxiong Gu , Sung K. Kang , Frank R. Libsch , Xiao H. Liu
CPC classification number: H05K1/11 , H01R12/7082 , H01R12/714 , H01R13/2414 , H01R13/2421 , H01R43/16 , H05K3/326 , H05K3/4092 , H05K2201/0311 , H05K2201/10265 , H05K2201/10378 , Y10T29/49224 , Y10T29/49226
Abstract: A contact structure and assembly for a microelectronics device includes first and second electrically conductive contacts being helically shaped. A carrier element is attached to and positioned between the first and second contacts. The first and second contacts are in electrical communication with each other, and the first and second contacts are in a mirror image relationship with each other. A pair of insulating substrates each include electrically conductive members. A contact point on each of the first and second contacts is attached and electrically communicating to respective electrically conductive members such that the first and second electrically conductive contacts between the pair of insulating substrates form an electrically conductive package. A metal layer on the carrier element provides electrical conductivity through a first opening defined by the carrier element between the first and second portions of the helix shaped contact.
Abstract translation: 用于微电子器件的接触结构和组件包括螺旋形的第一和第二导电触头。 载体元件附接到并定位在第一和第二触点之间。 第一和第二触点彼此电连通，并且第一和第二触点彼此成镜像关系。 一对绝缘基板各自包括导电构件。 每个第一和第二触点上的接触点被附接并与相应的导电构件电连通，使得该对绝缘基板之间的第一和第二导电触点形成导电封装。 载体元件上的金属层通过由载体元件在螺旋形接触件的第一和第二部分之间限定的第一开口提供导电性。
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2.发明授权公开(公告)号：US09410261B2
公开(公告)日：2016-08-09
申请号：US14528028
申请日：2014-10-30
Applicant: GLOBALFOUNDRIES INC.
Inventor： Gareth G. Hougham , Gerard McVicker , Anna Pratt
CPC classification number: C25D17/12 , C25D1/003 , C25D5/022 , C25D13/00 , G03F7/0037 , G03F7/2022 , G03F7/203 , Y10T428/24562
Abstract: A negative electrophoretic photoresist is applied over a plurality of protruding disposable template portions on a substrate. A silo structure is placed on planar portions of the negative electrophoretic photoresist that laterally surround the plurality of protruding disposable template portions. The negative electrophoretic photoresist is lithographically exposed employing the silo structure and a first lithographic mask, which includes a transparent substrate with isolated opaque patterns thereupon. After removal of the silo structure, the negative electrophoretic photoresist is lithographically exposed employing a second lithographic mask, which includes a pattern of transparent areas overlying the planar portions of the negative electrophoretic photoresist less the areas for bases of metal structure to be subsequently formed by electroplating. The negative electrophoretic photoresist is developed to form cavities therein, and metal structures are formed by electroplating within the cavities. The negative electrophoretic photoresist and the plurality of protruding disposable template portions can be subsequently removed.
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