公开(公告)号：US4689583A

公开(公告)日：1987-08-25

申请号：US579732

申请日：1984-02-13

申请人： George Jerinic ,  Robert Steele ,  James R. Fines

发明人： George Jerinic ,  Robert Steele ,  James R. Fines

IPC分类号： H03B9/14 ,  H03B27/00 ,  H01L23/12

CPC分类号： H03B9/143

摘要： A composite diode module is provided having an impedance matching member integrally formed within the module. The module includes a base member, a heat sink holder member having an aperture, a gold plated diamond heat sink which is disposed in the aforementioned aperture, and an encapsulant holder member having a second aperture. IMPATT diodes are disposed in dielectric spacers bonded to one end of the heat sink in alignment with the second aperture. A bias pin member is then bonded on the second end of the IMPATT and an encapsulant having selected electrical properties is provided in the second pair of apertures to secure the diode and to provide the diode module with a predetermined impedance characteristic. In a preferred embodiment, the module includes a pair of IMPATT diodes. With this arrangement, the module may be used in power combiners.

摘要翻译： 提供一种复合二极管模块，其具有一体地形成在模块内的阻抗匹配构件。 模块包括基座构件，具有开口的散热器保持构件，设置在上述孔中的镀金金刚石散热器和具有第二孔的密封剂保持构件。 IMPATT二极管设置在与第二孔对准的散热器的一端结合的电介质间隔件中。 然后将偏置销构件接合在IMPATT的第二端上，并且在第二对孔中提供具有选择的电性能的密封剂，以固定二极管并为二极管模块提供预定的阻抗特性。 在优选实施例中，该模块包括一对IMPATT二极管。 通过这种布置，模块可以用在功率组合器中。

公开(公告)号：US08314566B2

公开(公告)日：2012-11-20

申请号：US13032502

申请日：2011-02-22

申请人： Robert Steele ,  Louis Lerman ,  Allan Brent York ,  Wilson Dau ,  Jacqueline Teng ,  George Lerman

发明人： Robert Steele ,  Louis Lerman ,  Allan Brent York ,  Wilson Dau ,  Jacqueline Teng ,  George Lerman

IPC分类号： H05B37/00

CPC分类号： F21K9/237 ,  F21K9/23 ,  F21K9/232 ,  F21K9/233 ,  F21K9/235 ,  F21K9/238 ,  F21K9/60 ,  F21K9/64 ,  F21K9/65 ,  F21S4/20 ,  F21V3/00 ,  F21V3/02 ,  F21V7/00 ,  F21V7/06 ,  F21V9/00 ,  F21V9/30 ,  F21V17/12 ,  F21V17/14 ,  F21V19/0025 ,  F21V21/00 ,  F21V23/02 ,  F21V23/06 ,  F21V29/10 ,  F21V29/505 ,  F21V29/83 ,  F21Y2101/00 ,  F21Y2103/10 ,  F21Y2105/00 ,  F21Y2107/00 ,  F21Y2107/20 ,  F21Y2107/30 ,  F21Y2107/90 ,  F21Y2115/10 ,  F21Y2115/15 ,  H01L25/0753 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

摘要： In one embodiment, an LED lamp has a generally bulb shape. The LEDs are low power types and are encapsulated in thin, narrow, flexible strips. The LEDs are connected in series in the strips to drop a desired voltage. The strips are affixed to the outer surface of a bulb form to provide structure to the lamp. The strips are connected in parallel to a power supply, which may be housed in the lamp. Since many low power LEDs are used and are spread out over a large surface area, there is no need for a large metal heat sink. Further, the light emission is similar to that of an incandescent bulb. In other embodiment, there is no bulb form and the strips are bendable to have a variety of shapes. In another embodiment, a light sheet is bent to provide 360 degrees of light emission. Many other embodiments are described.

摘要翻译： 在一个实施例中，LED灯具有大致的灯泡形状。 LED是低功率类型，并且封装在薄而窄的柔性条中。 LED串连在一起，以降低所需的电压。 条带固定到灯泡形式的外表面以提供灯的结构。 这些条带与可以容纳在灯中的电源并联连接。 由于许多低功率LED被使用并且在大的表面积上扩展，所以不需要大的金属散热器。 此外，发光类似于白炽灯泡的发光。 在另一实施例中，不存在灯泡形状，并且条带可弯曲成具有各种形状。 在另一个实施例中，光片被弯曲以提供360度的发光。 描述了许多其它实施例。

公开(公告)号：US20120268932A1

公开(公告)日：2012-10-25

申请号：US13538093

申请日：2012-06-29

申请人： Louis Lerman ,  Allan Brent York ,  Michael David Henry ,  Robert Steele ,  Brian D. Ogonowsky

发明人： Louis Lerman ,  Allan Brent York ,  Michael David Henry ,  Robert Steele ,  Brian D. Ogonowsky

IPC分类号： F21V21/00 ,  F21V7/00

CPC分类号： F21V29/70 ,  F21K9/00 ,  F21K9/27 ,  F21K9/60 ,  F21K9/90 ,  F21S8/06 ,  F21V19/005 ,  F21V23/00 ,  F21V29/89 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/50 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/0206 ,  H05K1/183 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00

摘要： A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate having conductors is then laminated over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. The light sheets may be formed to emit light from opposite surfaces of the light sheet, enabling it to be used in a hanging fixture to illuminate the ceiling as well as the floor. The light sheet provides a practical substitute for a standard 2×4 foot fluorescent ceiling fixture.

摘要翻译： 公开了一种固态光片及其制造方法。 在一个实施例中，裸LED芯片具有顶部和底部电极，其中底部电极是大的反射电极。 LED阵列的底部电极（例如，500个LED）被结合到形成在柔性底部基底上的电极阵列。 在与电极连接的底部基板上形成导电迹线。 然后将具有导体的透明顶部衬底层压在底部衬底上。 多个实施例一起描述了串联连接LED的各种方式。 光片可以形成为从光片的相对表面发光，使其能够用于悬挂固定装置中以照亮天花板以及地板。 照明板为标准的2×4脚荧光天花板灯具提供了实用的替代品。

公开(公告)号：US20110193114A1

公开(公告)日：2011-08-11

申请号：US13044456

申请日：2011-03-09

申请人： Louis Lerman ,  Allan Brent York ,  Michael David Henry ,  Robert Steele ,  Brian D. Ogonowsky

发明人： Louis Lerman ,  Allan Brent York ,  Michael David Henry ,  Robert Steele ,  Brian D. Ogonowsky

IPC分类号： H01L33/08 ,  H01L33/62

CPC分类号： F21K9/30 ,  F21K9/20 ,  F21K9/64 ,  F21S8/06 ,  F21Y2107/90 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/08 ,  H01L33/507 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2933/0075 ,  H01S5/4025 ,  H01L2924/00

摘要： A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate. In another embodiment, a conductor layer is formed on the outer surface of the top substrate and makes contact with the LED electrodes and conductors on the bottom substrate via openings formed in the top substrate.

摘要翻译： 公开了一种固态光片及其制造方法。 在一个实施例中，裸LED芯片具有顶部和底部电极，其中底部电极是大的反射电极。 LED阵列的底部电极（例如，500个LED）被结合到形成在柔性底部基底上的电极阵列。 在与电极连接的底部基板上形成导电迹线。 然后在底部衬底上形成透明的顶部衬底。 多个实施例一起描述了串联连接LED的各种方式。 在一种方法中，顶部衬底包含连接到LED电极和底部衬底上的导体的导体图案。 在另一个实施例中，导体层形成在顶部基板的外表面上，并通过形成在顶部基板中的开口与底部基板上的LED电极和导体接触。

公开(公告)号：US20110163683A1

公开(公告)日：2011-07-07

申请号：US13032502

申请日：2011-02-22

申请人： Robert Steele ,  Louis Lerman ,  Allan Brent York ,  Wilson Dau ,  Jacqueline Teng ,  George Lerman

发明人： Robert Steele ,  Louis Lerman ,  Allan Brent York ,  Wilson Dau ,  Jacqueline Teng ,  George Lerman

IPC分类号： H05B37/02

CPC分类号： F21K9/237 ,  F21K9/23 ,  F21K9/232 ,  F21K9/233 ,  F21K9/235 ,  F21K9/238 ,  F21K9/60 ,  F21K9/64 ,  F21K9/65 ,  F21S4/20 ,  F21V3/00 ,  F21V3/02 ,  F21V7/00 ,  F21V7/06 ,  F21V9/00 ,  F21V9/30 ,  F21V17/12 ,  F21V17/14 ,  F21V19/0025 ,  F21V21/00 ,  F21V23/02 ,  F21V23/06 ,  F21V29/10 ,  F21V29/505 ,  F21V29/83 ,  F21Y2101/00 ,  F21Y2103/10 ,  F21Y2105/00 ,  F21Y2107/00 ,  F21Y2107/20 ,  F21Y2107/30 ,  F21Y2107/90 ,  F21Y2115/10 ,  F21Y2115/15 ,  H01L25/0753 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

摘要： In one embodiment, an LED lamp has a generally bulb shape. The LEDs are low power types and are encapsulated in thin, narrow, flexible strips. The LEDs are connected in series in the strips to drop a desired voltage. The strips are affixed to the outer surface of a bulb form to provide structure to the lamp. The strips are connected in parallel to a power supply, which may be housed in the lamp. Since many low power LEDs are used and are spread out over a large surface area, there is no need for a large metal heat sink. Further, the light emission is similar to that of an incandescent bulb. In other embodiment, there is no bulb form and the strips are bendable to have a variety of shapes. In another embodiment, a light sheet is bent to provide 360 degrees of light emission. Many other embodiments are described.

摘要翻译： 在一个实施例中，LED灯具有大致的灯泡形状。 LED是低功率类型，并且封装在薄而窄的柔性条中。 LED串连在一起，以降低所需的电压。 条带固定到灯泡形式的外表面以提供灯的结构。 这些条带与可以容纳在灯中的电源并联连接。 由于许多低功率LED被使用并且在大的表面积上扩展，所以不需要大的金属散热器。 此外，发光类似于白炽灯泡的发光。 在另一实施例中，不存在灯泡形状，并且条带可弯曲成具有各种形状。 在另一个实施例中，光片被弯曲以提供360度的发光。 描述了许多其它实施例。

公开(公告)号：US20120268931A1

公开(公告)日：2012-10-25

申请号：US13537936

申请日：2012-06-29

申请人： Louis Lerman ,  Allan Brent York ,  Michael David Henry ,  Robert Steele ,  Brian D. Ogonowsky

发明人： Louis Lerman ,  Allan Brent York ,  Michael David Henry ,  Robert Steele ,  Brian D. Ogonowsky

IPC分类号： F21S4/00 ,  F21V7/00

CPC分类号： F21V29/70 ,  F21K9/00 ,  F21K9/27 ,  F21K9/60 ,  F21K9/90 ,  F21S8/06 ,  F21V19/005 ,  F21V23/00 ,  F21V29/89 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/50 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/0206 ,  H05K1/183 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00

摘要： A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate having conductors is then laminated over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. The light sheets may be formed to emit light from opposite surfaces of the light sheet, enabling it to be used in a hanging fixture to illuminate the ceiling as well as the floor. The light sheet provides a practical substitute for a standard 2×4 foot fluorescent ceiling fixture.

公开(公告)号：US08198109B2

公开(公告)日：2012-06-12

申请号：US13044456

申请日：2011-03-09

申请人： Louis Lerman ,  Allan Brent York ,  Michael David Henry ,  Robert Steele ,  Brian D. Ogonowsky

发明人： Louis Lerman ,  Allan Brent York ,  Michael David Henry ,  Robert Steele ,  Brian D. Ogonowsky

IPC分类号： H01L21/00

CPC分类号： F21K9/30 ,  F21K9/20 ,  F21K9/64 ,  F21S8/06 ,  F21Y2107/90 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/08 ,  H01L33/507 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2933/0075 ,  H01S5/4025 ,  H01L2924/00

摘要： A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate. In another embodiment, a conductor layer is formed on the outer surface of the top substrate and makes contact with the LED electrodes and conductors on the bottom substrate via openings formed in the top substrate.

摘要翻译： 公开了一种固态光片及其制造方法。 在一个实施例中，裸LED芯片具有顶部和底部电极，其中底部电极是大的反射电极。 LED阵列的底部电极（例如，500个LED）被结合到形成在柔性底部基底上的电极阵列。 在与电极连接的底部基板上形成导电迹线。 然后在底部衬底上形成透明的顶部衬底。 多个实施例一起描述了串联连接LED的各种方式。 在一种方法中，顶部衬底包含连接到LED电极和底部衬底上的导体的导体图案。 在另一个实施例中，导体层形成在顶部基板的外表面上，并通过形成在顶部基板中的开口与底部基板上的LED电极和导体接触。

公开(公告)号：US20110193106A1

公开(公告)日：2011-08-11

申请号：US13079717

申请日：2011-04-04

申请人： Louis Lerman ,  Allan Brent York ,  Michael David Henry ,  Robert Steele ,  Brian D. Ogonowsky

发明人： Louis Lerman ,  Allan Brent York ,  Michael David Henry ,  Robert Steele ,  Brian D. Ogonowsky

IPC分类号： H01L33/08

CPC分类号： F21K9/30 ,  F21K9/20 ,  F21K9/64 ,  F21S8/06 ,  F21Y2107/90 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/08 ,  H01L33/507 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2933/0075 ,  H01S5/4025 ,  H01L2924/00

摘要： A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate.

摘要翻译： 公开了一种固态光片及其制造方法。 在一个实施例中，裸LED芯片具有顶部和底部电极，其中底部电极是大的反射电极。 LED阵列的底部电极（例如，500个LED）被结合到形成在柔性底部基底上的电极阵列。 在与电极连接的底部基板上形成导电迹线。 然后在底部衬底上形成透明的顶部衬底。 多个实施例一起描述了串联连接LED的各种方式。 在一种方法中，顶部衬底包含连接到LED电极和底部衬底上的导体的导体图案。

公开(公告)号：US20110193105A1

公开(公告)日：2011-08-11

申请号：US13079706

申请日：2011-04-04

申请人： Louis Lerman ,  Allan Brent York ,  Michael David Henry ,  Robert Steele ,  Brian D. Ogonowsky

发明人： Louis Lerman ,  Allan Brent York ,  Michael David Henry ,  Robert Steele ,  Brian D. Ogonowsky

IPC分类号： H01L33/08

CPC分类号： F21K9/30 ,  F21K9/20 ,  F21K9/64 ,  F21S8/06 ,  F21Y2107/90 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/08 ,  H01L33/507 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2933/0075 ,  H01S5/4025 ,  H01L2924/00

摘要： A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate.

摘要翻译： 公开了一种固态光片及其制造方法。 在一个实施例中，裸LED芯片具有顶部和底部电极，其中底部电极是大的反射电极。 LED阵列的底部电极（例如，500个LED）被结合到形成在柔性底部基底上的电极阵列。 在与电极连接的底部基板上形成导电迹线。 然后在底部衬底上形成透明的顶部衬底。 多个实施例一起描述了串联连接LED的各种方式。 在一种方法中，顶部衬底包含连接到LED电极和底部衬底上的导体的导体图案。

公开(公告)号：US20060108289A1

公开(公告)日：2006-05-25

申请号：US11254008

申请日：2005-10-19

申请人： Robert Steele ,  David Szykowny

发明人： Robert Steele ,  David Szykowny

IPC分类号： B01D61/00 ,  C02F1/44

CPC分类号： C02F1/444 ,  B01D61/022 ,  B01D61/025 ,  B01D61/027 ,  B01D61/04 ,  B01D61/14 ,  B01D61/145 ,  B01D61/147 ,  B01D61/16 ,  B01D63/084 ,  B01D63/16 ,  B01D2311/04 ,  C02F1/441 ,  B01D2311/103 ,  B01D2311/12 ,  B01D2311/18 ,  B01D2311/2642

摘要： A device for separating metal components from a colloidal suspension or solution uses a vessel for holding the colloidal suspension or solution. A membrane impermeable to the selected metal components of a colloidal suspension or solution is sealed over a support to form a leaf element. The leaf element includes an outlet for the selected components of the colloidal suspension or solution and is extended into the colloidal suspension or solution. The leaf element is controllably vibrated simultaneously with application of a negative or positive pressure which is used to motivate permeation of the membrane by the liquid of the colloidal suspension or solution to purify it. Metals removed by the method include metals with an atomic number greater than 10 including and/or silicon. The colloidal suspension or solution may optionally contain a metal precipitator such as a dithiocarbamate and/or trithiocarbamate to aid in the separation.

摘要翻译： 用于从胶体悬浮液或溶液中分离金属组分的装置使用用于保持胶态悬浮液或溶液的容器。 胶体悬浮液或溶液的所选金属组分不可渗透的膜被密封在载体上以形成叶元件。 叶元件包括用于胶体悬浮液或溶液的所选组分的出口并延伸到胶体悬浮液或溶液中。 叶片元件在施加负压或正压的同时被可控制地振动，所述负压或正压用于通过胶体悬浮液或溶液的液体激发膜的渗透以净化它。 通过该方法去除的金属包括原子序数大于10的金属和/或硅。 胶态悬浮液或溶液可以任选地含有金属沉淀器，例如二硫代氨基甲酸盐和/或三硫代氨基甲酸盐，以有助于分离。