-
公开(公告)号:US20100124813A1
公开(公告)日:2010-05-20
申请号:US12468717
申请日:2009-05-19
申请人: George Matamis , Henry Chien , James K. Kai , Takashi Orimoto , Vinod R Purayath , Er-Xuan Ping , Roy E. Scheuerlein
发明人: George Matamis , Henry Chien , James K. Kai , Takashi Orimoto , Vinod R Purayath , Er-Xuan Ping , Roy E. Scheuerlein
IPC分类号: H01L21/20 , H01L21/3205
CPC分类号: H01L21/20 , G11C13/0004 , G11C17/16 , G11C2213/71 , G11C2213/72 , H01L27/101 , H01L27/1021 , H01L27/2409 , H01L27/2463 , H01L27/2481 , H01L45/04 , H01L45/06 , H01L45/085 , H01L45/1233 , H01L45/144 , H01L45/146 , H01L45/147 , H01L45/1675
摘要: A self-aligned fabrication process for three-dimensional non-volatile memory is disclosed. A double etch process forms conductors at a given level in self-alignment with memory pillars both underlying and overlying the conductors. Forming the conductors in this manner can include etching a first conductor layer using a first repeating pattern in a given direction to form a first portion of the conductors. Etching with the first pattern also defines two opposing sidewalls of an underlying pillar structure, thereby self-aligning the conductors with the pillars. After etching, a second conductor layer is deposited followed by a semiconductor layer stack. Etching with a second pattern that repeats in the same direction as the first pattern is performed, thereby forming a second portion of the conductors that is self-aligned with overlying layer stack lines. These layer stack lines are then etched orthogonally to define a second set of pillars overlying the conductors.
摘要翻译: 公开了一种用于三维非易失性存储器的自对准制造工艺。 双重蚀刻工艺在与导体下面和上面的记忆柱自对准的给定水平处形成导体。 以这种方式形成导体可以包括使用沿给定方向的第一重复图案蚀刻第一导体层以形成导体的第一部分。 具有第一图案的蚀刻还限定了下面的柱结构的两个相对的侧壁,从而使导体与支柱自对准。 蚀刻后,沉积第二导体层,随后沉积半导体层堆叠。 执行以与第一图案相同的方向重复的第二图案的蚀刻,从而形成与上层叠层线自对准的导体的第二部分。 然后将这些层堆叠线正交蚀刻以限定覆盖导体的第二组支柱。
-
公开(公告)号:US08710481B2
公开(公告)日:2014-04-29
申请号:US13356047
申请日:2012-01-23
申请人: James K. Kai , Henry Chien , George Matamis , Vinod R. Purayath
发明人: James K. Kai , Henry Chien , George Matamis , Vinod R. Purayath
IPC分类号: H01L47/00
CPC分类号: H01L29/413 , B82Y10/00 , B82Y40/00 , H01L27/1021 , H01L27/2409 , H01L27/2463 , H01L45/04 , H01L45/06 , H01L45/1233 , H01L45/1273 , H01L45/146 , H01L45/149 , H01L45/1675
摘要: A non-volatile memory device includes a plurality of non-volatile memory cells. Each of the non-volatile memory cells includes a first electrode, a diode steering element, a storage element located in series with the diode steering element, a second electrode, and a nano-rail electrode having a width of 15 nm or less.
摘要翻译: 非易失性存储器件包括多个非易失性存储器单元。 每个非易失性存储单元包括第一电极,二极管操纵元件,与二极管操纵元件串联的存储元件,第二电极和宽度为15nm或更小的纳米轨道电极。
-
公开(公告)号:US20130187114A1
公开(公告)日:2013-07-25
申请号:US13356047
申请日:2012-01-23
申请人: James K. Kai , Henry Chien , George Matamis , Vinod R. Purayath
发明人: James K. Kai , Henry Chien , George Matamis , Vinod R. Purayath
IPC分类号: H01L21/822 , H01L45/00 , B82Y99/00 , B82Y40/00
CPC分类号: H01L29/413 , B82Y10/00 , B82Y40/00 , H01L27/1021 , H01L27/2409 , H01L27/2463 , H01L45/04 , H01L45/06 , H01L45/1233 , H01L45/1273 , H01L45/146 , H01L45/149 , H01L45/1675
摘要: A non-volatile memory device includes a plurality of non-volatile memory cells. Each of the non-volatile memory cells includes a first electrode, a diode steering element, a storage element located in series with the diode steering element, a second electrode, and a nano-rail electrode having a width of 15 nm or less.
摘要翻译: 非易失性存储器件包括多个非易失性存储器单元。 每个非易失性存储单元包括第一电极,二极管操纵元件,与二极管操纵元件串联的存储元件,第二电极和宽度为15nm或更小的纳米轨道电极。
-
4.
公开(公告)号:US08207036B2
公开(公告)日:2012-06-26
申请号:US12242857
申请日:2008-09-30
IPC分类号: H01L21/336 , H01L21/8238 , H01L21/3205 , H01L21/4763 , H01L29/788
CPC分类号: H01L21/28273 , H01L27/11519 , H01L27/11521 , H01L29/513 , H01L29/7881
摘要: A method for fabricating a non-volatile storage element. The method comprises forming a layer of polysilicon floating gate material over a substrate and forming a layer of nitride at the surface of the polysilicon floating gate material. Floating gates are formed from the polysilicon floating gate material. Individual dielectric caps are formed from the nitride such that each individual nitride dielectric cap is self-aligned with one of the plurality of floating gates. An inter-gate dielectric layer is formed over the surface of the dielectric caps and the sides of the floating gates. Control gates are then formed with the inter-gate dielectric layer separating the control gates from the floating gates. The layer of nitride may be formed using SPA (slot plane antenna) nitridation. The layer of nitride may be formed prior to or after etching of the polysilicon floating gate material to form floating gates.
摘要翻译: 一种用于制造非易失性存储元件的方法。 该方法包括在衬底上形成多晶硅浮栅材料层,并在多晶硅浮栅材料的表面形成一层氮化物。 浮栅由多晶硅浮栅材料形成。 各个绝缘盖由氮化物形成,使得每个单独的氮化物介电帽与多个浮动栅之一自对准。 在电介质盖的表面和浮动栅极的侧面上形成栅极间介电层。 然后,栅极介电层与控制栅极与浮动栅极分离形成控制栅极。 可以使用SPA(槽平面天线)氮化形成氮化物层。 可以在蚀刻多晶硅浮栅材料之前或之后形成氮化物层以形成浮栅。
-
公开(公告)号:US08383479B2
公开(公告)日:2013-02-26
申请号:US12840081
申请日:2010-07-20
申请人: Vinod Robert Purayath , James K. Kai , Masaaki Higashitani , Takashi Orimoto , George Matamis , Henry Chien
发明人: Vinod Robert Purayath , James K. Kai , Masaaki Higashitani , Takashi Orimoto , George Matamis , Henry Chien
IPC分类号: H01L21/8247
CPC分类号: H01L21/76224 , B82Y10/00 , H01L21/28273 , H01L21/28282 , H01L27/11526 , H01L27/11529 , H01L27/11536 , H01L27/11546 , H01L27/11573 , H01L29/788 , Y10S438/962 , Y10S977/774 , Y10S977/936
摘要: Nanostructure-based charge storage regions are included in non-volatile memory devices and integrated with the fabrication of select gates and peripheral circuitry. One or more nanostructure coatings are applied over a substrate at a memory array area and a peripheral circuitry area. Various processes for removing the nanostructure coating from undesired areas of the substrate, such as target areas for select gates and peripheral transistors, are provided. One or more nanostructure coatings are formed using self-assembly based processes to selectively form nanostructures over active areas of the substrate in one example. Self-assembly permits the formation of discrete lines of nanostructures that are electrically isolated from one another without requiring patterning or etching of the nanostructure coating.
-
6.
公开(公告)号:US20100081267A1
公开(公告)日:2010-04-01
申请号:US12242857
申请日:2008-09-30
IPC分类号: H01L21/3205
CPC分类号: H01L21/28273 , H01L27/11519 , H01L27/11521 , H01L29/513 , H01L29/7881
摘要: A method for fabricating a non-volatile storage element. The method comprises forming a layer of polysilicon floating gate material over a substrate and forming a layer of nitride at the surface of the polysilicon floating gate material. Floating gates are formed from the polysilicon floating gate material. Individual dielectric caps are formed from the nitride such that each individual nitride dielectric cap is self-aligned with one of the plurality of floating gates. An inter-gate dielectric layer is formed over the surface of the dielectric caps and the sides of the floating gates. Control gates are then formed with the inter-gate dielectric layer separating the control gates from the floating gates. The layer of nitride may be formed using SPA (slot plane antenna) nitridation. The layer of nitride may be formed prior to or after etching of the polysilicon floating gate material to form floating gates.
摘要翻译: 一种用于制造非易失性存储元件的方法。 该方法包括在衬底上形成多晶硅浮栅材料层,并在多晶硅浮栅材料的表面形成一层氮化物。 浮栅由多晶硅浮栅材料形成。 各个绝缘盖由氮化物形成,使得每个单独的氮化物介电帽与多个浮动栅之一自对准。 在电介质盖的表面和浮动栅极的侧面上形成栅极间介电层。 然后,栅极介电层与控制栅极与浮动栅极分离形成控制栅极。 可以使用SPA(槽平面天线)氮化形成氮化物层。 可以在蚀刻多晶硅浮栅材料之前或之后形成氮化物层以形成浮栅。
-
公开(公告)号:US20110020992A1
公开(公告)日:2011-01-27
申请号:US12840081
申请日:2010-07-20
申请人: Vinod Robert Purayath , James K. Kai , Masaaki Higashitani , Takashi Orimoto , George Matamis , Henry Chien
发明人: Vinod Robert Purayath , James K. Kai , Masaaki Higashitani , Takashi Orimoto , George Matamis , Henry Chien
IPC分类号: H01L21/336 , H01L21/76 , H01L21/3205
CPC分类号: H01L21/76224 , B82Y10/00 , H01L21/28273 , H01L21/28282 , H01L27/11526 , H01L27/11529 , H01L27/11536 , H01L27/11546 , H01L27/11573 , H01L29/788 , Y10S438/962 , Y10S977/774 , Y10S977/936
摘要: Nanostructure-based charge storage regions are included in non-volatile memory devices and integrated with the fabrication of select gates and peripheral circuitry. One or more nanostructure coatings are applied over a substrate at a memory array area and a peripheral circuitry area. Various processes for removing the nanostructure coating from undesired areas of the substrate, such as target areas for select gates and peripheral transistors, are provided. One or more nanostructure coatings are formed using self-assembly based processes to selectively form nanostructures over active areas of the substrate in one example. Self-assembly permits the formation of discrete lines of nanostructures that are electrically isolated from one another without requiring patterning or etching of the nanostructure coating.
摘要翻译: 基于纳米结构的电荷存储区域包括在非易失性存储器件中,并与制造选择栅极和外围电路集成。 在存储器阵列区域和外围电路区域上的衬底上施加一个或多个纳米结构涂层。 提供了用于从衬底的不需要的区域(例如选择栅极和外围晶体管的目标区域)去除纳米结构涂层的各种工艺。 在一个实例中,使用基于自组装的工艺来形成一个或多个纳米结构涂层,以选择性地在衬底的有源区上形成纳米结构。 自组装允许形成彼此电隔离的纳米结构的离散线,而不需要对纳米结构涂层进行图案化或蚀刻。
-
8.
公开(公告)号:US08575000B2
公开(公告)日:2013-11-05
申请号:US13186094
申请日:2011-07-19
IPC分类号: H01L21/76
CPC分类号: H01L23/53238 , H01L21/7682 , H01L21/76834 , H01L21/76849 , H01L21/76882 , H01L21/76885 , H01L23/53295 , H01L2924/0002 , H01L2924/00
摘要: A semiconductor device including a plurality of copper interconnects. At least a first portion of the plurality of copper interconnects has a meniscus in a top surface. The semiconductor device also includes a plurality of air gaps, wherein each air gap of the plurality of air gaps is located between an adjacent pair of at least the first portion of the plurality of bit lines.
摘要翻译: 一种包括多个铜互连的半导体器件。 多个铜互连的至少第一部分在顶面具有弯液面。 半导体器件还包括多个气隙,其中多个气隙中的每个气隙位于多个位线的至少第一部分的相邻对之间。
-
公开(公告)号:US07919809B2
公开(公告)日:2011-04-05
申请号:US12170327
申请日:2008-07-09
申请人: Dana Lee , Henry Chin , James K. Kai , Takashi Whitney Orimoto , Vinod R. Purayath , George Matamis
发明人: Dana Lee , Henry Chin , James K. Kai , Takashi Whitney Orimoto , Vinod R. Purayath , George Matamis
IPC分类号: H01L29/788
CPC分类号: H01L27/11521 , G11C16/0483 , H01L21/84 , H01L27/1203
摘要: A memory system is disclosed that includes a set of non-volatile storage elements. A given memory cell has a dielectric cap above the floating gate. In one embodiment, the dielectric cap resides between the floating gate and a conformal IPD layer. The dielectric cap reduces the leakage current between the floating gate and a control gate. The dielectric cap achieves this reduction by reducing the strength of the electric field at the top of the floating gate, which is where the electric field would be strongest without the dielectric cap for a floating gate having a narrow stem.
摘要翻译: 公开了一种包括一组非易失性存储元件的存储器系统。 给定的存储单元在浮动栅极上方具有电介质盖。 在一个实施例中,电介质帽位于浮动栅极和共形IPD层之间。 电介质盖减少了浮动栅极和控制栅极之间的漏电流。 电介质盖通过降低浮动栅极顶部的电场的强度来实现这种减小,这是电场将是最强的,而没有用于具有窄的杆的浮动栅极的电介质盖。
-
10.
公开(公告)号:US20130020708A1
公开(公告)日:2013-01-24
申请号:US13186094
申请日:2011-07-19
IPC分类号: H01L23/48 , H01L21/283
CPC分类号: H01L23/53238 , H01L21/7682 , H01L21/76834 , H01L21/76849 , H01L21/76882 , H01L21/76885 , H01L23/53295 , H01L2924/0002 , H01L2924/00
摘要: A semiconductor device including a plurality of copper interconnects. At least a first portion of the plurality of copper interconnects has a meniscus in a top surface. The semiconductor device also includes a plurality of air gaps, wherein each air gap of the plurality of air gaps is located between an adjacent pair of at least the first portion of the plurality of bit lines.
摘要翻译: 一种包括多个铜互连的半导体器件。 多个铜互连的至少第一部分在顶面具有弯液面。 半导体器件还包括多个气隙,其中多个气隙中的每个气隙位于多个位线的至少第一部分的相邻对之间。
-
-
-
-
-
-
-
-
-