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    Power light emitting die package with reflecting lens and the method of making the same
    1.
    发明授权
    Power light emitting die package with reflecting lens and the method of making the same 有权

    公开(公告)号：US08446004B2

    公开(公告)日：2013-05-21

    申请号：US12215319

    申请日：2008-06-26

    申请人： Ban P. Loh ,  Gerald H. Negley

    发明人： Ban P. Loh ,  Gerald H. Negley

    IPC分类号： H01L23/34

    CPC分类号： H01L33/644 ,  H01L33/486 ,  H01L33/58 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： A light emitting die package and a method of manufacturing the die package are disclosed. The die package includes a leadframe, at least one light emitting device (LED), a molded body, and a lens. The leadframe includes a plurality of leads and has a top side and a bottom side. A portion of the leadframe defines a mounting pad. The LED device is mounted on the mounting pad. The molded body is integrated with portions of the leadframe and defines an opening on the top side of the leadframe, the opening surrounding the mounting pad. The molded body further includes latches on the bottom side of the leadframe. The lens is coupled to the molded body. A composite lens is used as both reflector and imaging tool to collect and direct light emitted by LED(s) for desired spectral and luminous performance.

    Tile for solid state lighting
    2.
    发明授权
    Tile for solid state lighting 有权
    瓷砖用于固态照明

    公开(公告)号：US08123375B2

    公开(公告)日：2012-02-28

    申请号：US12093698

    申请日：2006-11-17

    申请人： Gerald H. Negley ,  Paul E. Sims ,  Ban P. Loh

    发明人： Gerald H. Negley ,  Paul E. Sims ,  Ban P. Loh

    IPC分类号： F21V23/00

    CPC分类号： H05B33/0803 ,  F21K9/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  G02F1/133603 ,  G02F2001/133613 ,  G09F9/35 ,  H01L2224/49175 ,  H01L2224/8592 ,  H05B33/0821 ,  H05K1/142 ,  H05K1/181 ,  H05K3/0058 ,  Y10S362/80

    摘要： A solid state lighting tile (10) includes a substrate having a planar surface. A first plurality of solid state light emitting devices (LEDs) are on the substrate. The first plurality of LEDs (19) are connected in series to form a first string of LEDs of a first color having an anode contact (22) at a first end of the tile and a cathode contact (24) at a second end of the tile. A second plurality of LEDs are on the substrate. The second plurality of LEDs (21) are connected in series to form a second string of LEDs of the first color having a cathode contact (28) at the first end of the tile and an anode contact (26) at the second end of the tile.

    摘要翻译： 固态照明瓦（10）包括具有平坦表面的基板。 第一多个固态发光器件（LED）在衬底上。 第一组多个LED（19）串联连接以形成第一颜色的第一串LED，在第一端具有阳极触点（22），在第二端的第二端处形成阴极触点（24） 瓦。 第二多个LED在基板上。 所述第二多个LED（21）串联连接以形成所述第一颜色的第二串LED，所述第一颜色的LED在所述瓷砖的第一端具有阴极接触（28），在所述第二颜色的第二端具有阳极接触（26） 瓦。

    Tile for Solid State Lighting
    3.
    发明申请
    Tile for Solid State Lighting 有权
    固态照明瓷砖

    公开(公告)号：US20090219714A1

    公开(公告)日：2009-09-03

    申请号：US12093698

    申请日：2006-11-17

    申请人： Gerald H. Negley ,  Paul E. Sims ,  Ban P. Loh

    发明人： Gerald H. Negley ,  Paul E. Sims ,  Ban P. Loh

    IPC分类号： F21V9/00 ,  F21S4/00

    CPC分类号： H05B33/0803 ,  F21K9/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  G02F1/133603 ,  G02F2001/133613 ,  G09F9/35 ,  H01L2224/49175 ,  H01L2224/8592 ,  H05B33/0821 ,  H05K1/142 ,  H05K1/181 ,  H05K3/0058 ,  Y10S362/80

    摘要： A solid state lighting tile (10) includes a substrate having a planar surface. A first plurality of solid state light emitting devices (LEDs) are on the substrate. The first plurality of LEDs (19) are connected in series to form a first string of LEDs of a first color having an anode contact (22) at a first end of the tile and a cathode contact (24) at a second end of the tile. A second plurality of LEDs are on the substrate. The second plurality of LEDs (21) are connected in series to form a second string of LEDs of the first color having a cathode contact (28) at the first end of the tile and an anode contact (26) at the second end of the tile.

    摘要翻译： 固态照明瓦（10）包括具有平坦表面的基板。 第一多个固态发光器件（LED）在衬底上。 第一组多个LED（19）串联连接以形成第一颜色的第一串LED，在第一端具有阳极触点（22），在第二端的第二端处形成阴极触点（24） 瓦。 第二多个LED在基板上。 所述第二多个LED（21）串联连接以形成所述第一颜色的第二串LED，所述第二颜色的LED在所述瓦片的第一端处具有阴极触点（28），并且在所述第二颜色的第二端处具有阳极触点（26） 瓦。

    Power light emitting die package with reflecting lens and the method of making the same
    4.
    发明授权
    Power light emitting die package with reflecting lens and the method of making the same 有权
    具有反射镜的功率发光管芯封装及其制造方法

    公开(公告)号：US07456499B2

    公开(公告)日：2008-11-25

    申请号：US10861929

    申请日：2004-06-04

    申请人： Ban P. Loh ,  Gerald H. Negley

    发明人： Ban P. Loh ,  Gerald H. Negley

    IPC分类号： H01L23/10

    CPC分类号： H01L33/644 ,  H01L33/486 ,  H01L33/58 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： A light emitting die package and a method of manufacturing the die package are disclosed. The die package includes a leadframe, at least one light emitting device (LED), a molded body, and a lens. The leadframe includes a plurality of leads and has a top side and a bottom side. A portion of the leadframe defines a mounting pad. The LED device is mounted on the mounting pad. The molded body is integrated with portions of the leadframe and defines an opening on the top side of the leadframe, the opening surrounding the mounting pad. The molded body further includes latches on the bottom side of the leadframe. The lens is coupled to the molded body. A composite lens is used as both reflector and imaging tool to collect and direct light emitted by LED(s) for desired spectral and luminous performance.

    摘要翻译： 公开了一种发光管芯封装及其制造方法。 模具封装包括引线框架，至少一个发光器件（LED），成型体和透镜。 引线框架包括多个引线并且具有顶侧和底侧。 引线框架的一部分限定了安装垫。 LED装置安装在安装垫上。 成型体与引线框架的一部分一体化并且在引线框架的顶侧上限定开口，围绕安装垫的开口。 成型体还包括在引线框的底侧上的闩锁。 透镜与成型体相连。 复合透镜用作反射器和成像工具，用于收集和引导由LED发射的光以获得期望的光谱和发光性能。

    Composite optical lens with an integrated reflector
    5.
    发明授权
    Composite optical lens with an integrated reflector 有权
    具有集成反射镜的复合光学透镜

    公开(公告)号：US07280288B2

    公开(公告)日：2007-10-09

    申请号：US10861639

    申请日：2004-06-04

    申请人： Ban P. Loh ,  Gerald H. Negley

    发明人： Ban P. Loh ,  Gerald H. Negley

    IPC分类号： G02B17/00 ,  F21V5/04

    CPC分类号： G02B3/00 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    摘要： A composite optical lens is disclosed. The composite optical lens includes a concave bottom surface adapted to receive light, reflective surface adapted to reflect the received light, and optical surface through which the reflected light leaves the optical lens. The concave bottom surface defines a concave cavity allowing placement of at least a portion of a light emitting device within the concave cavity. The concave bottom surface, the optical surface, or both may have predetermined optical finish to operate on the light such as diffusing or focusing the light. The reflective surface can be coated, designed, or both for total internal reflection effect.

    摘要翻译： 公开了一种复合光学透镜。 复合光学透镜包括适于接收光的凹底表面，适于反射接收的光的反射表面以及反射光通过该表面离开光学透镜的光学表面。 凹形底表面限定了凹腔，其允许在凹腔内放置发光器件的至少一部分。 凹底面，光学表面或两者可以具有预定的光学光洁度以在光上操作，例如漫射或聚焦光。 反射表面可以被涂覆，设计或两者用于全内反射效果。

    Semiconductor light emitting device mounting substrates including a conductive lead extending therein
    7.
    发明授权
    Semiconductor light emitting device mounting substrates including a conductive lead extending therein 有权
    半导体发光器件的安装基板包括在其中延伸的导电引线

    公开(公告)号：US07777247B2

    公开(公告)日：2010-08-17

    申请号：US11035716

    申请日：2005-01-14

    申请人： Ban P. Loh ,  Gerald H. Negley ,  Yankun Fu

    发明人： Ban P. Loh ,  Gerald H. Negley ,  Yankun Fu

    IPC分类号： H01L29/24 ,  H01L23/34

    CPC分类号： H01L33/486 ,  H01L25/0753 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/12041 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A mounting substrate for a semiconductor light emitting device includes a thermally conductive mounting block. The mounting block has, in a first face thereof, a cavity that is configured to mount a semiconductor light emitting device therein and to reflect light that is emitted by the semiconductor light emitting device that is mounted therein away from the cavity. A conductive lead inserted into the mounting block extends into the cavity. The conductive lead is electrically isolated from the mounting block and has an exposed contact portion in the cavity. The conductive lead may be a plurality of conductive leads each having an exposed contact portion at different locations in the cavity. Related packaging methods also may be provided.

    摘要翻译： 用于半导体发光器件的安装衬底包括导热安装块。 安装块在其第一面中具有被构造成在其中安装半导体发光器件并且将由其中安装的半导体发光器件发射的光反射离开空腔的空腔。 插入安装块的导电引线延伸到空腔中。 导电引线与安装块电隔离，并且在空腔中具有暴露的接触部分。 导电引线可以是多个导电引线，每个导电引线在空腔中的不同位置具有暴露的接触部分。 也可以提供相关的包装方法。

    Power light emitting die package with reflecting lens and the method of making the same
    8.
    发明申请
    Power light emitting die package with reflecting lens and the method of making the same 有权

    公开(公告)号：US20080283861A1

    公开(公告)日：2008-11-20

    申请号：US12215319

    申请日：2008-06-26

    申请人： Ban P. Loh ,  Gerald H. Negley

    发明人： Ban P. Loh ,  Gerald H. Negley

    IPC分类号： H01L33/00

    CPC分类号： H01L33/644 ,  H01L33/486 ,  H01L33/58 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： A light emitting die package and a method of manufacturing the die package are disclosed. The die package includes a leadframe, at least one light emitting device (LED), a molded body, and a lens. The leadframe includes a plurality of leads and has a top side and a bottom side. A portion of the leadframe defines a mounting pad. The LED device is mounted on the mounting pad. The molded body is integrated with portions of the leadframe and defines an opening on the top side of the leadframe, the opening surrounding the mounting pad. The molded body further includes latches on the bottom side of the leadframe. The lens is coupled to the molded body. A composite lens is used as both reflector and imaging tool to collect and direct light emitted by LED(s) for desired spectral and luminous performance.