公开(公告)号：US06909183B2

公开(公告)日：2005-06-21

申请号：US10470117

申请日：2002-01-21

申请人： Gregor Feiertag ,  Alois Stelzl ,  Hans Krüger

发明人： Gregor Feiertag ,  Alois Stelzl ,  Hans Krüger

IPC分类号： H01L23/12 ,  H01L21/60 ,  H01L23/498 ,  H03H3/08 ,  H03H9/10 ,  H03H9/145 ,  H03H9/25 ,  H05K1/03 ,  H05K1/11 ,  H01L23/48

CPC分类号： H03H9/059 ,  H01L23/49816 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/09701 ,  H03H9/1078 ,  H03H9/1092 ,  H05K1/0306 ,  H05K1/114 ,  H05K2201/10674 ,  H01L2224/0401

摘要： For a component mounted with the flip-chip technique, in particular surface wave elements, it is proposed to use a low-shrinkage ceramic substrate over which (as needed) multi-layer metallizations are produced by metal deposition. The bumps can also be produced by self-aligning metal deposition.

摘要翻译： 对于使用倒装芯片技术安装的部件，特别是表面波元件，建议使用低收缩陶瓷基板，通过金属沉积在其上产生（根据需要）多层金属化。 也可以通过自对准金属沉积来生产凸块。

公开(公告)号：US20090224851A1

公开(公告)日：2009-09-10

申请号：US11916720

申请日：2006-05-24

申请人： Gregor Feiertag ,  Hans Krüger ,  Wolfgang Pahl ,  Alois Stelzl

发明人： Gregor Feiertag ,  Hans Krüger ,  Wolfgang Pahl ,  Alois Stelzl

IPC分类号： H03H9/205 ,  H03H3/02 ,  H05K7/02

CPC分类号： H03H9/105 ,  H01L2224/94 ,  H03H9/059 ,  H03H9/1092 ,  Y10T29/42

摘要： What is proposed is a preferably surface mounted electrical component with sensitive component structures which are arranged on the front side of two substrates. The substrates are joined with their front sides facing each other in such a manner that a cavity will remain for the component structures. The outer electrical connections for all component structures are located on the surface of one of the two substrates, in particular on the back side of the upper, or on the front side of the lower substrate. Between the two substrates there is a suitably structured intermediate layer which is used both as a spacer and also for sealing of the housing of the cavity.

摘要翻译： 提出的是具有敏感部件结构的优选表面安装的电气部件，其布置在两个基板的正面上。 衬底以其前侧相互面对的方式接合，使得腔体将保留用于构件结构。 所有部件结构的外部电气连接位于两个基板中的一个的表面上，特别是位于下部基板的上部的背面或前侧上。 在两个基板之间，存在适当地构造的中间层，它们既用作间隔物也用于密封腔体的壳体。

公开(公告)号：US07518201B2

公开(公告)日：2009-04-14

申请号：US11485049

申请日：2006-07-12

申请人： Alois Stelzl ,  Hans Krüger ,  Gregor Feiertag

发明人： Alois Stelzl ,  Hans Krüger ,  Gregor Feiertag

IPC分类号： H01L29/84

CPC分类号： H03H9/1085 ,  H01L2224/16225 ,  H01L2924/15192 ,  H01L2924/16152 ,  H03H9/059 ,  H03H9/1078

摘要： An arrangement having a component mounted on a carrier in a flip chip construction which is encapsulated by a film, in particular a plastic film, laminated over the entire surface of the component. For additional sealing and mechanical stabilization, a plastic compound in liquid form is subsequently applied and hardened so as to surround the chip.

摘要翻译： 具有以倒装芯片结构安装在载体上的部件的装置，其由膜，特别是塑料膜封装，层压在部件的整个表面上。 为了进一步的密封和机械稳定化，随后施加液体形式的塑料化合物并硬化以包围芯片。

公开(公告)号：US08294535B2

公开(公告)日：2012-10-23

申请号：US11916720

申请日：2006-05-24

申请人： Gregor Feiertag ,  Hans Krüger ,  Wolfgang Pahl ,  Alois Stelzl

发明人： Gregor Feiertag ,  Hans Krüger ,  Wolfgang Pahl ,  Alois Stelzl

IPC分类号： H03H9/64

CPC分类号： H03H9/105 ,  H01L2224/94 ,  H03H9/059 ,  H03H9/1092 ,  Y10T29/42

摘要： A component includes a first substrate having a first front side for holding first component structures, and a second substrate having a second front side for holding second component structures. The first and second substrates are connected together electrically and mechanically. The first and second front sides face each other. The first and second component structures include SAW structures, FBAR structures, MEMS sensors or switches, or MEOPS components, or combinations thereof.

摘要翻译： 一种部件包括具有用于保持第一部件结构的第一前侧的第一基板和具有用于保持第二部件结构的第二前侧的第二基板。 第一和第二基板电连接和机械地连接在一起。 第一和第二前面彼此面对。 第一和第二组件结构包括SAW结构，FBAR结构，MEMS传感器或开关，或MEOPS组件，或其组合。

公开(公告)号：US07094626B2

公开(公告)日：2006-08-22

申请号：US10491056

申请日：2002-08-06

申请人： Alois Stelzl ,  Hans Krüger ,  Gregor Feiertag

发明人： Alois Stelzl ,  Hans Krüger ,  Gregor Feiertag

IPC分类号： H01L21/44

CPC分类号： H03H9/1085 ,  H01L2224/16225 ,  H01L2924/15192 ,  H01L2924/16152 ,  H03H9/059 ,  H03H9/1078

摘要： An encapsulation method for sensitive composition is provided in which a film, in particular a plastic film, is laminated over the entire surface of an arrangement having a component mounted on a carrier in a flip chip construction. For additional sealing and mechanical stabilization, a plastic compound in liquid form is subsequently applied and hardened so as to surround the chip. Optionally, before the application of the plastic compound, the film can be removed in the area of structuring lines in such a way that the plastic compound can come into contact both with the carrier and with the chip surface.

摘要翻译： 提供了一种用于敏感组合物的封装方法，其中在具有以倒装芯片结构安装在载体上的部件的布置的整个表面上层压膜，特别是塑料膜。 为了进一步的密封和机械稳定化，随后施加液体形式的塑料化合物并硬化以包围芯片。 任选地，在施加塑料化合物之前，可以在构造线的区域中去除膜，使得塑料化合物可以与载体和芯片表面接触。

公开(公告)号：US08865499B2

公开(公告)日：2014-10-21

申请号：US13805630

申请日：2011-07-07

申请人： Wolfgang Pahl ,  Hans Krueger ,  Gregor Feiertag ,  Alois Stelzl ,  Anton Leidl ,  Stefan Seitz

发明人： Wolfgang Pahl ,  Hans Krueger ,  Gregor Feiertag ,  Alois Stelzl ,  Anton Leidl ,  Stefan Seitz

IPC分类号： H01L21/00

CPC分类号： B81B7/0061 ,  B81B2201/0257 ,  B81B2207/096 ,  B81C1/00309 ,  H01L2224/16225 ,  H01L2924/15151 ,  H01L2924/16151 ,  H04R1/086 ,  H04R1/38 ,  H04R19/005 ,  H04R19/04 ,  H04R29/004 ,  H04R31/006

摘要： The invention relates to a method for producing a microphone, in which a transducer element (WE) is mounted on a carrier (TR); a cover is arranged over the transducer element (WE) and the carrier (TR) such that the transducer element (WE) is enclosed between the cover and the carrier (TR); a first sound inlet opening (S01) is produced in the carrier (TR); a functional test of the microphone is carried out; the first sound inlet opening (S01) is closed; and a second sound inlet opening (S02) is created in the cover. The present invention further relates to a microphone resulting from the method, in which the first sound inlet opening (S01) is prepared but closed.

摘要翻译： 本发明涉及一种用于制造麦克风的方法，其中换能器元件（WE）安装在载体（TR）上; 换能器元件（WE）和载体（TR）之间布置有覆盖物，使得换能器元件（WE）被封闭在盖体和载体（TR）之间; 在载体（TR）中产生第一声音入口（S01）; 进行麦克风的功能测试; 第一声​​音入口（S01）关闭; 并且在盖中产生第二声音入口（S02）。 本发明还涉及由该方法产生的麦克风，其中第一声音入口开口（S01）准备但关闭。

公开(公告)号：US08404516B2

公开(公告)日：2013-03-26

申请号：US12627707

申请日：2009-11-30

申请人： Christian Bauer ,  Gregor Feiertag ,  Hans Krueger ,  Alois Stelzl

发明人： Christian Bauer ,  Gregor Feiertag ,  Hans Krueger ,  Alois Stelzl

IPC分类号： H01L21/00

CPC分类号： B81C1/00269 ,  B81B7/0058 ,  B81C2203/0136 ,  B81C2203/019 ,  H01L24/14 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A carrier substrate has a mounting location with a number of electrical connection pads on a top side and external contacts connected thereto on an underside. A metal frame encloses the connection pads of the mounting location. A MEMS chip has electrical contacts on an underside. The MEMS chip is placed on the mounting location of the carrier substrate in such a way that the MEMS chip is seated with an edge region of its underside on the metal frame. Using a flip-chip process, the electrical contacts of the MEMS chip are connected to the connection pads of the carrier substrate by means of bumps the metal frame is connected to the MEMS chip such that a closed cavity is formed between MEMS chip and carrier substrate.

摘要翻译： 载体基板具有安装位置，在顶侧具有多个电连接焊盘，并且在下侧上与其连接的外部触点。 金属框架包围安装位置的连接垫。 MEMS芯片在下侧具有电触点。 MEMS芯片以这样的方式被放置在载体基板的安装位置上，使得MEMS芯片在金属框架上的下侧的边缘区域被安置。 使用倒装芯片工艺，MEMS芯片的电触点通过凸块连接到载体衬底的连接焊盘，金属框架连接到MEMS芯片，使得在MEMS芯片和载体衬底之间形成闭合腔 。

公开(公告)号：US08580613B2

公开(公告)日：2013-11-12

申请号：US12999421

申请日：2009-06-16

申请人： Gregor Feiertag ,  Hans Krueger ,  Anton Leidl ,  Alois Stelzl

发明人： Gregor Feiertag ,  Hans Krueger ,  Anton Leidl ,  Alois Stelzl

IPC分类号： H01L21/00

CPC分类号： G01L19/141 ,  H01L25/165 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/09701 ,  H01L2924/00

摘要： On a carrier (1) an adhesion layer (4), an ASIC chip (2) and a sensor chip (3) are arranged one above another. An interchip connection (5) is provided for electrically connecting the chips among one another, and an ASIC connection (6) is provided for externally electrically connecting the circuit integrated in the ASIC chip.

摘要翻译： 在载体（1）上，一个粘合层（4），ASIC芯片（2）和传感器芯片（3）彼此排列。 提供了用于将芯片彼此电连接的芯片间连接（5），并且提供ASIC连接（6）用于外部电连接集成在ASIC芯片中的电路。

公开(公告)号：US07552532B2

公开(公告)日：2009-06-30

申请号：US10484942

申请日：2002-06-14

申请人： Alois Stelzl ,  Hans Krueger ,  Gregor Feiertag ,  Ernst Christl

发明人： Alois Stelzl ,  Hans Krueger ,  Gregor Feiertag ,  Ernst Christl

IPC分类号： H05K13/00

CPC分类号： H01L24/97 ,  H01L21/50 ,  H01L23/10 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01061 ,  H01L2924/01072 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/3025 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49171 ,  Y10T29/49176 ,  Y10T29/49789 ,  H01L2224/81 ,  H01L2924/00

摘要： A method is provided to produce a hermetic encapsulation for an electronic component, which may be an optical and at least partially light-permeable component or a surface wave component, comprises attaching and electrically contacting a component based on a chip to a carrier comprising electrical connection surfaces, such that a front of the chip bearing component structures facing the carrier is arranged to clear it, covering a back of the chip with a film made of synthetic material, such that edges of the film overlap the chip; tightly bonding the film and carrier in an entire edge region around the chip; structuring the film such that the film is removed around the edge region in a continuous strip parallel to the edge region; and applying a hermetically sealing layer over the film, such that this layer hermetically terminates with the carrier in a contact region outside of the edge region.

摘要翻译： 提供了一种用于产生电子部件的密封封装的方法，其可以是光学和至少部分透光的部件或表面波部件，包括将基于芯片的部件附接并电接触到包括电连接 表面，使得面向载体的芯片轴承部件结构的前部布置成将其清除，用合成材料制成的膜覆盖芯片的后部，使得膜的边缘与芯片重叠; 在芯片周围的整个边缘区域紧密地结合薄膜和载体; 构造膜，使得膜在与边缘区域平行的连续条带中围绕边缘区域移除; 以及在所述膜上施加气密密封层，使得所述层在所述边缘区域外部的接触区域中与所述载体气密地终止。

公开(公告)号：US20130140656A1

公开(公告)日：2013-06-06

申请号：US13805630

申请日：2011-07-07

申请人： Wolfgang Pahl ,  Hans Krueger ,  Gregor Feiertag ,  Alois Stelzl ,  Anton Leidl ,  Stefan Seitz

发明人： Wolfgang Pahl ,  Hans Krueger ,  Gregor Feiertag ,  Alois Stelzl ,  Anton Leidl ,  Stefan Seitz

IPC分类号： B81B7/00 ,  B81C1/00

CPC分类号： B81B7/0061 ,  B81B2201/0257 ,  B81B2207/096 ,  B81C1/00309 ,  H01L2224/16225 ,  H01L2924/15151 ,  H01L2924/16151 ,  H04R1/086 ,  H04R1/38 ,  H04R19/005 ,  H04R19/04 ,  H04R29/004 ,  H04R31/006

摘要： The invention relates to a method for producing a microphone, in which a transducer element (WE) is mounted on a carrier (TR); a cover is arranged over the transducer element (WE) and the carrier (TR) such that the transducer element (WE) is enclosed between the cover and the carrier (TR); a first sound inlet opening (SO1) is produced in the carrier (TR); a functional test of the microphone is carried out; the first sound inlet opening (SO1) is closed; and a second sound inlet opening (SO2) is created in the cover. The present invention further relates to a microphone resulting from the method, in which the first sound inlet opening (SO1) is prepared but closed.

摘要翻译： 本发明涉及一种用于制造麦克风的方法，其中传感器元件（WE）安装在载体（TR）上; 换能器元件（WE）和载体（TR）之间布置有覆盖物，使得换能器元件（WE）被封闭在盖体和载体（TR）之间; 在载体（TR）中产生第一声音入口（SO1）; 进行麦克风的功能测试; 第一声​​音入口开口（SO1）关闭; 并且在盖中产生第二声音入口开口（SO2）。 本发明还涉及一种由该方法产生的麦克风，其中第一声音入口开口（SO1）准备但关闭。