公开(公告)号：US4810277A

公开(公告)日：1989-03-07

申请号：US159626

申请日：1988-02-23

申请人： Guenther Waitl ,  Karl Geim ,  Hans-Ludwig Althaus ,  Waltraud Klos

发明人： Guenther Waitl ,  Karl Geim ,  Hans-Ludwig Althaus ,  Waltraud Klos

IPC分类号： G02B6/24 ,  G02B6/255 ,  G02B6/36 ,  G02B6/38 ,  G02B6/42 ,  C03B37/025

CPC分类号： G02B6/2558 ,  G02B6/2551 ,  G02B6/4248 ,  G02B6/3644

摘要： A method for hermetically fastening a glass fiber within a tube, wherein the tube can be used with light wave guide components, the tube serving as a connecting part at the component. The method provides for a tube consisting of quartz, quartz glass or glass. The glass fiber is connected to the tube at a predetermined fastening location by means of heating the tube and collapsing the tube to hermetically connect the glass fiber to the tube through melting.

摘要翻译： 一种用于将玻璃纤维气密地紧固在管内的方法，其中所述管可以与光波导部件一起使用，所述管用作所述部件处的连接部分。 该方法提供由石英，石英玻璃或玻璃组成的管。 玻璃纤维通过加热管并使管塌缩而在预定的紧固位置处连接到管，以通过熔化将玻璃纤维气密地连接到管。

公开(公告)号：US4875750A

公开(公告)日：1989-10-24

申请号：US151372

申请日：1988-02-02

申请人： Werner Spaeth ,  Guenther Waitl ,  Werner Kuhlmann ,  Hans-Ludwig Althaus ,  Rolf Birkmann ,  Waltraud Klos ,  Axel Schubert

发明人： Werner Spaeth ,  Guenther Waitl ,  Werner Kuhlmann ,  Hans-Ludwig Althaus ,  Rolf Birkmann ,  Waltraud Klos ,  Axel Schubert

IPC分类号： G02B6/32 ,  G02B6/36 ,  G02B6/42

CPC分类号： G02B6/4249 ,  G02B6/4204

摘要： An optoelectronic coupling element and method for manufacturing the coupling element. The coupling element includes a light wave guide, a microlens, a first carrier chip and a light emitting and/or light detecting semiconductor element. The microlens is preferably spherical in shape and is adapted for optically coupling the light wave guide and the semiconductor element. The semiconductor element can be part of the first carrier chip or, according to another embodiment, can be part of a second carrier chip. The purpose of this coupling element is to facilitate the precise mounting of the microlens in a position between the light wave guide and the semiconductor element and also facilitate the adjustment of the microlens to optimally perform its light coupling function. The method for manufacturing the coupling element provides for the formation of a receptacle having trapezoidal shape sides in the carrier chip. The microlens is mounted within the receptacle with a connecting medium such as glass. The size of the receptacle is determined by the size of the microlens and the point of contact between the microlens and carrier. Applications of the optoelectronic coupling element according to the invention are, in particular, in LED transmitter structural elements, receiver structural elements and laser modules. This method of production substantially avoids impairment of the carrier chip due to effects such as mechanical deformation. Additionally, this type of coupling element can be mass-produced cost-effectively in spite of the miniature size of these components.

摘要翻译： 一种用于制造耦合元件的光电耦合元件和方法。 耦合元件包括光波导，微透镜，第一载体芯片和发光和/或光检测半导体元件。 微透镜的形状优选为球形，并且适于光学耦合光波导和半导体元件。 半导体元件可以是第一载体芯片的一部分，或者根据另一实施例，半导体元件可以是第二载体芯片的一部分。 该耦合元件的目的是便于将微透镜精确地安装在光波导和半导体元件之间的位置，并且还便于微透镜的调节以最佳地执行其光耦合功能。 用于制造耦合元件的方法提供了在载体芯片中形成具有梯形形状侧面的插座。 微透镜用诸如玻璃的连接介质安装在容器内。 容器的尺寸由微透镜的尺寸和微透镜与载体之间的接触点决定。 根据本发明的光电耦合元件的应用尤其在LED发射机结构元件，接收器结构元件和激光模块中。 这种生产方法基本上避免了由于诸如机械变形的影响而导致的载体芯片的损伤。 另外，尽管这些部件的尺寸很小，但是这种类型的联接元件可以经济高效地批量生产。

公开(公告)号：US07102212B2

公开(公告)日：2006-09-05

申请号：US11215763

申请日：2005-08-30

申请人： Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

发明人： Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

IPC分类号： H01L23/495 ,  H01L31/203

CPC分类号： H01L33/486 ,  H01L31/0203 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K3/3426 ,  H05K2201/10454 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/613 ,  H01L2924/00014

摘要： In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted projecting laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.

公开(公告)号：US5040868A

公开(公告)日：1991-08-20

申请号：US531459

申请日：1990-05-31

申请人： Guenther Waitl ,  Franz Schellhorn

发明人： Guenther Waitl ,  Franz Schellhorn

IPC分类号： G02B6/42 ,  G09F9/33 ,  H01L31/02 ,  H01L33/48 ,  H01L33/60 ,  H01L33/62

CPC分类号： H01L33/486 ,  G02B6/4202 ,  G02B6/4204 ,  G02B6/4214 ,  G02B6/4249 ,  G09F9/33 ,  H01L31/0203 ,  H01L31/0232 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002

摘要： A surface-mountable opto-component capable of flexible use is disclosed. The opto-component has at least one base member that can be automatically assembled with the assistance of an assembly means and contains at least one optical transmitter and/or receiver. The opto-component also has at least one optical means for shaping the light to be emitted and/or to be received. Adjustment aids serve for the adjusted fastening of the at least one optical means.

摘要翻译： 公开了一种能够灵活使用的可表面安装的光电组件。 光学部件具有至少一个基座部件，其能够在组装装置的帮助下自动组装，并且包含至少一个光学发射器和/或接收器。 光分量还具有至少一个用于使待发射和/或被接收的光成形的光学装置。 调节辅助件用于调节紧固至少一个光学装置。

公开(公告)号：US20060012015A1

公开(公告)日：2006-01-19

申请号：US11215763

申请日：2005-08-30

申请人： Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

发明人： Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

IPC分类号： H01L23/495

CPC分类号： H01L33/486 ,  H01L31/0203 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K3/3426 ,  H05K2201/10454 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/613 ,  H01L2924/00014

摘要： In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted projecting laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.

公开(公告)号：US5027995A

公开(公告)日：1991-07-02

申请号：US657292

申请日：1991-02-19

申请人： Alois Karl ,  Karl Osojnik ,  Werner Spaeth ,  Guenther Waitl

发明人： Alois Karl ,  Karl Osojnik ,  Werner Spaeth ,  Guenther Waitl

IPC分类号： H01L21/60 ,  H01L21/607 ,  H01L23/485 ,  H01L31/0203 ,  H01L33/40

CPC分类号： H01L33/40 ,  H01L24/10 ,  H01L24/13 ,  H01L24/81 ,  H01L31/0203 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/81207 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107

摘要： A semiconductor chip (1) is bonded to a substrate (2) serving as a component housing, a contact part, an insulative part or a connecting part without the use of a high-temperature process or any additional bonding medium such as solder or flux. The backside of the semiconductor chip (1) or substrate (2) is structured to include specially formed bumps (3) for the necessary connections. A ductile metal is used for these bumps (3). The bond to the substrate (2) is formed by using pressure and/or ultrasonic energy. The process according to this invention is particularly suitable for bonding components in data link receivers, optoelectronic couplers, transmitters (LEDs, IREDs) and ISDN modules.

摘要翻译： 半导体芯片（1）在不使用高温工艺的情况下与用作部件壳体，接触部件，绝缘部件或连接部件的基板（2）接合，或者粘合剂 。 半导体芯片（1）或基板（2）的背面被构造成包括用于所需连接的专门形成的凸块（3）。 这些凸块（3）使用延展性金属。 通过使用压力和/或超声能量来形成与基板（2）的结合。 根据本发明的方法特别适用于连接数据链路接收机，光电耦合器，发射器（LED，IRED）和ISDN模块中的组件。

公开(公告)号：US4095116A

公开(公告)日：1978-06-13

申请号：US805992

申请日：1977-06-13

申请人： Gerfried Felkel ,  Gerhard Maier ,  Wolfgang Guenzel ,  Guenther Waitl

发明人： Gerfried Felkel ,  Gerhard Maier ,  Wolfgang Guenzel ,  Guenther Waitl

IPC分类号： G02B6/00 ,  G02B27/00 ,  H01L31/12 ,  H01L31/16

CPC分类号： H01L31/16

摘要： A useful current component of an electro-optical coupling element is increased by providing a synthetic resin coupling medium having an adhered unitary encapsuling mass composed of the identical synthetic resin forming the coupling medium and containing therein a radiation reflecting material, such as titanium dioxide and a radiation impermeable material, such as aluminum bronze.

公开(公告)号：US20050145868A1

公开(公告)日：2005-07-07

申请号：US11066671

申请日：2005-02-25

申请人： Franz Kummer ,  Franz Zwaschka ,  Andries Ellens ,  Alexandra Debray ,  Guenther Waitl

发明人： Franz Kummer ,  Franz Zwaschka ,  Andries Ellens ,  Alexandra Debray ,  Guenther Waitl

IPC分类号： C09K11/08 ,  C09K11/62 ,  C09K11/77 ,  C09K11/80 ,  H01L33/50 ,  H05B33/14 ,  H01L29/22

CPC分类号： H01L33/502 ,  C09K11/7715 ,  C09K11/7769 ,  C09K11/7774 ,  H01L33/504 ,  H05B33/14

摘要： A phosphor for light sources, the emission from which lies in the short-wave optical spectral region, as a garnet structure A3B5O12. It is activated with Ce, the second component B representing at least one of the elements Al and Ga, and the first component A is terbium or terbium together with at least one of the elements Y, Gd, La and/or Lu. In a preferred embodiment, a phosphor having a garnet of structure (Tb1-x-yRExCey)3(Al,Ga)5O12, where RE=Y, Gd, La and/or Lu; 0≦x≦0.5-y; 0

摘要翻译： 用于光源的磷光体，其发射位于短波光谱区域中，作为石榴石结构A 3 B 5 O 12 >。 它被Ce活化，第二组分B代表元素Al和Ga中的至少一种，第一组分A与元素Y，Gd，La和/或Lu中的至少一种一起是铽或铽。 在一个优选的实施方案中，具有结构石榴石（Tb 1-xy）的石榴石的磷光体（3） （Al，Ga）5 O 12，其中RE = Y，Gd，La和/或Lu; 0 <= x <= 0.5-y; 使用0

公开(公告)号：US06669866B1

公开(公告)日：2003-12-30

申请号：US09787208

申请日：2001-03-15

申请人： Franz Kummer ,  Franz Zwaschka ,  Andries Ellens ,  Alexandra Debray ,  Guenther Waitl

发明人： Franz Kummer ,  Franz Zwaschka ,  Andries Ellens ,  Alexandra Debray ,  Guenther Waitl

IPC分类号： H05B3314

CPC分类号： H01L33/502 ,  C09K11/7715 ,  C09K11/7769 ,  C09K11/7774 ,  H01L33/504 ,  H05B33/14

摘要： A phosphor for light sources, the emission from which lies in the short-wave optical spectral region, as a garnet structure A3B5O12. It is activated with Ce, the second component B representing at least one of the elements Al and Ga, and the first component A is terbium or terbium together with at least one of the elements Y, Gd, La and/or Lu. In a preferred embodiment, a phosphor having a garnet of structure (Tb1−x−yRExCey)3(Al,Ga)5O12, where RE=Y, Gd, La and/or Lu; 0≦x≦0.5−y; 0

摘要翻译： 作为石榴石结构A3B5O12的用于光源的磷光体，其发射位于短波光谱区域中。 它被Ce活化，第二组分B代表元素Al和Ga中的至少一种，第一组分A与元素Y，Gd，La和/或Lu中的至少一种一起是铽或铽。在 优选实施方案中，具有结构石榴石（Tb1-x-yRExCey）3（Al，Ga）5O12，其中RE = Y，Gd，La和/或Lu的荧光体; 0 <= x <= 0.5-Y; 0

公开(公告)号：US06432745B1

公开(公告)日：2002-08-13

申请号：US08866064

申请日：1997-05-30

申请人： Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

发明人： Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

IPC分类号： H01L2144

CPC分类号： H01L33/486 ,  H01L31/0203 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K3/3426 ,  H05K2201/10454 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/613 ,  H01L2924/00014

摘要： In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted projecting laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.

摘要翻译： 在用于半导体部件的引线框架技术的两极SMT微型外壳中，半导体芯片安装在一个引线框架部分上并与另外的引线框部分接触。 另外的引线框架部分被从芯片封装的壳体中导出，作为焊接端子。 不需要修整或成形工艺，并且外壳紧凑并且能够进一步小型化。 作为引线框架的冲压部分的焊接端子从彼此相对的壳体侧壁横向突出，至少直到形成部件安装表面的壳体底板。 芯片安装表面和部件的安装表面彼此成直角。