摘要:
An apparatus for illuminating a target surface, the apparatus having a plurality of LED arrays, where each of the arrays has a plurality of individually addressable LEDs, and where at least one of the arrays is disposed at an angle of between about forty-five degrees and about ninety degrees relative to the target surface, where all of the arrays supply light into a light pipe, the light pipe having interior walls made of a reflective material, where light exiting the light pipe illuminates the target surface, and a controller for adjusting an intensity of the individually addressable light sources.
摘要:
An apparatus for illuminating a target surface, the apparatus having a plurality of LED arrays, where each of the arrays has a plurality of individually addressable LEDs, and where at least one of the arrays is disposed at an angle of between about forty-five degrees and about ninety degrees relative to the target surface, where all of the arrays supply light into a light pipe, the light pipe having interior walls made of a reflective material, where light exiting the light pipe illuminates the target surface, and a controller for adjusting an intensity of the individually addressable light sources.
摘要:
To increase inspection throughput, the field of view (FOV) of an IR camera can be moved over the sample at a constant velocity. Throughout this moving, a modulation (e.g. optical or electrical) can be provided to the sample and IR images can be captured using the IR camera. Moving the FOV, providing the modulation, and capturing the IR images can be synchronized. The IR images can be filtered to generate the time delay LIT, thereby providing defect identification. In one embodiment, this filtering accounts for the number of pixels of the IR camera in a scanning direction. For the case of optical modulation, a dark field region can be provided for the FOV throughout the moving, thereby providing an improved signal-to-noise ratio (SNR) during filtering.
摘要:
To increase inspection throughput, the field of view (FOV) of an IR camera can be moved over the sample at a constant velocity. Throughout this moving, a modulation (e.g. optical or electrical) can be provided to the sample and IR images can be captured using the IR camera. Moving the FOV, providing the modulation, and capturing the IR images can be synchronized. The IR images can be filtered to generate the time delay LIT, thereby providing defect identification. In one embodiment, this filtering accounts for the number of pixels of the IR camera in a scanning direction. For the case of optical modulation, a dark field region can be provided for the FOV throughout the moving, thereby providing an improved signal-to-noise ratio (SNR) during filtering.
摘要:
An apparatus for both detecting and repairing a shunt defect in a solar cell substrate. A shunt detection module detects the shunt defect in the substrate, using at least one of lock-in thermography and current-voltage testing. A process diagnostic module determines whether the substrate should be passed without further processing by the apparatus, rejected without further processing by the apparatus, or repaired by the apparatus. A shunt repair module electrically isolates the shunt defect in the substrate. In this manner, a single apparatus can quickly check for shunts and make a determination as to whether the substrate is worth repairing. If it is worth repairing, then the apparatus can make the repairs to the substrate.
摘要:
An apparatus for inducing a current in a solar cell substrate. A substrate receiving surface receives the substrate, and an array of a plurality of individually addressable light sources illuminates the substrate in a sequenced manner. A sequencer controls the sequenced manner of illumination of the substrate by the array. A front side electrical contact makes electrical contact to a front side of the substrate, and a back side electrical contact makes electrical contact to a back side of the substrate. A meter is electrically connected to the front side electrical contact and the back side electrical contact, and senses the current induced in the substrate during the sequenced illumination of the substrate.
摘要:
A cylindrical mirror or lens is used to focus an input collimated beam of light onto a line on the surface to be inspected, where the line is substantially in the plane of incidence of the focused beam. An image of the beam is projected onto an array of charge-coupled devices parallel to the line for detecting anomalies and/or features of the surface, where the array is outside the plane of incidence of the focused beam.
摘要:
Substrate processing method and apparatus are disclosed. The substrate processing apparatus includes a non-contact air bearing chuck with a vacuum preload.
摘要:
Substrate processing method and apparatus are disclosed. The substrate processing apparatus includes a non-contact air bearing chuck with a vacuum preload.
摘要:
Fourier filters and wafer inspection systems are provided. One embodiment relates to a one-dimensional Fourier filter configured to be included in a bright field inspection system such that the bright field inspection system can be used for broadband dark field inspection of a wafer. The Fourier filter includes an asymmetric illumination aperture configured to be positioned in an illumination path of the inspection system. The Fourier filter also includes an asymmetric imaging aperture complementary to the illumination aperture. The imaging aperture is configured to be positioned in a light collection path of the inspection system such that the imaging aperture blocks light reflected and diffracted from structures on the wafer and allows light scattered from defects on the wafer to pass through the imaging aperture.