Method for operating nonvolatitle memory array
    1.
    发明授权
    Method for operating nonvolatitle memory array 有权
    用于操作非标量存储器阵列的方法

    公开(公告)号:US07852673B2

    公开(公告)日:2010-12-14

    申请号:US12561849

    申请日:2009-09-17

    IPC分类号: G11C11/34

    摘要: A method for programming a mixed nonvolatile memory array having a plurality of mixed memory cells, wherein each mixed memory cell includes a depletion mode memory cell and an enhanced mode memory cell. The method comprises steps of programming the enhanced mode memory cell in a way of channel hot carrier and programming the depletion mode memory cell in a way of band-to-band tunneling hot carrier.

    摘要翻译: 一种用于编程具有多个混合存储器单元的混合非易失性存储器阵列的方法,其中每个混合存储单元包括耗尽型存储单元和增强型存储单元。 该方法包括以通道热载波的方式对增强型存储器单元进行编程的步骤,并以带对带隧道热载波的方式对耗尽型存储单元进行编程。

    NONVOLATITLE MEMORY ARRAY AND METHOD FOR OPERATING THEREOF
    2.
    发明申请
    NONVOLATITLE MEMORY ARRAY AND METHOD FOR OPERATING THEREOF 审中-公开
    非易失性存储器阵列及其操作方法

    公开(公告)号:US20070291551A1

    公开(公告)日:2007-12-20

    申请号:US11530585

    申请日:2006-09-11

    IPC分类号: G11C16/04

    摘要: A mixed nonvolatile memory array. In the mixed nonvolatile memory array, each nonvolatile memory cell has at least one depletion mode memory cell. The depletion mode region is composed of a gate structure and a doped region. Since the thickness of the doped region is relatively thin, a voltage is applied on the gate structure to invert the conductive type of the doped region under the gate structure. Meanwhile, a bias is applied at both terminals of the doped region so as to control the operation of the depletion mode memory cell. In addition, each nonvolatile memory cell of the mixed nonvolatile memory array further comprises an enhanced mode memory cell. Therefore, each nonvolatile memory cell provides at least four carrier storage spaces so that the numbers of bits storing in a unit memory device is increased.

    摘要翻译: 混合非易失性存储器阵列。 在混合非易失性存储器阵列中,每个非易失性存储单元具有至少一个耗尽型存储单元。 耗尽模式区域由栅极结构和掺杂区域组成。 由于掺杂区域的厚度相对较薄,所以在栅极结构上施加电压以反转栅极结构下的掺杂区域的导电类型。 同时,在掺杂区域的两个端子处施加偏压,以便控制耗尽型存储单元的工作。 此外,混合非易失性存储器阵列的每个非易失性存储单元还包括增强型存储单元。 因此,每个非易失性存储单元提供至少四个载波存储空间,使得存储在单元存储器件中的位数增加。

    METHOD FOR OPERATING NONVOLATITLE MEMORY ARRAY
    3.
    发明申请
    METHOD FOR OPERATING NONVOLATITLE MEMORY ARRAY 有权
    操作非易失性存储器阵列的方法

    公开(公告)号:US20100008153A1

    公开(公告)日:2010-01-14

    申请号:US12561849

    申请日:2009-09-17

    IPC分类号: G11C16/04

    摘要: A method for programming a mixed nonvolatile memory array having a plurality of mixed memory cells, wherein each mixed memory cell includes a depletion mode memory cell and an enhanced mode memory cell. The method comprises steps of programming the enhanced mode memory cell in a way of channel hot carrier and programming the depletion mode memory cell in a way of band-to-band tunneling hot carrier.

    摘要翻译: 一种用于编程具有多个混合存储器单元的混合非易失性存储器阵列的方法,其中每个混合存储单元包括耗尽型存储单元和增强型存储单元。 该方法包括以通道热载波的方式对增强型存储器单元进行编程的步骤,并以带对带隧道热载波的方式对耗尽型存储单元进行编程。

    Dielectric charge trapping memory cells with redundancy
    4.
    发明授权
    Dielectric charge trapping memory cells with redundancy 有权
    介质电荷捕获具有冗余的存储单元

    公开(公告)号:US09019771B2

    公开(公告)日:2015-04-28

    申请号:US13661723

    申请日:2012-10-26

    IPC分类号: G11C16/06 G11C16/04 G11C16/10

    CPC分类号: G11C16/0475 G11C16/10

    摘要: A memory cell array of dielectric charge trapping memory cells and method for performing program, read and erase operations on the memory cell array that includes bits stored at charge trapping sites in adjacent memory cells. A bit of information is stored at a first charge trapping site in a first memory cell and a second charge trapping site in a second adjacent memory cell. Storing charge at two trapping sites in adjacent memory cells increases data retention rates of the array of memory cells as each charge trapping site can be read to represent the data that is stored at the data site. Each corresponding charge trapping site can be read independently and in parallel so that the results can be compared to determine the data value that is stored at the data site in an array of dielectric charge trapping memory cells.

    摘要翻译: 介质电荷俘获存储器单元的存储单元阵列和用于对存储在相邻存储器单元中的电荷俘获位置处存储的位的存储单元阵列执行编程,读取和擦除操作的方法。 一些信息存储在第一存储单元中的第一电荷捕获位点和第二相邻存储单元中的第二电荷捕获位点。 在相邻存储器单元中的两个捕获位置处存储电荷增加了存储器单元阵列的数据保留率,因为可以读取每个电荷捕获位点以表示存储在数据站点的数据。 可以独立地并行地读取每个对应的电荷俘获位点,以便比较结果以确定存储在介电电荷俘获存储器单元阵列中的数据位置处的数据值。

    Three-dimensional array structure for memory devices
    6.
    发明授权
    Three-dimensional array structure for memory devices 有权
    用于存储器件的三维阵列结构

    公开(公告)号:US08937291B2

    公开(公告)日:2015-01-20

    申请号:US13528754

    申请日:2012-06-20

    IPC分类号: H01L47/00 H01L29/06

    摘要: A disclosed memory device includes a three-dimension array structure that includes memory layers and transistor structures disposed between the memory layers. Each memory layer is connected to a common electrode, and each transistor structure includes transistors that share common column structures and common base structures. The transistors also each include a connector structure that is spaced apart from a common column structure by a common base structure.

    摘要翻译: 所公开的存储器件包括三维阵列结构,其包括设置在存储层之间的存储层和晶体管结构。 每个存储器层连接到公共电极,并且每个晶体管结构包括共享公共列结构和公共基极结构的晶体管。 晶体管还各自包括通过公共基底结构与公共柱结构间隔开的连接器结构。

    Operating method for memory device and memory array and operating method for the same
    7.
    发明授权
    Operating method for memory device and memory array and operating method for the same 有权
    存储器件和存储器阵列的操作方法和操作方法相同

    公开(公告)号:US08824188B2

    公开(公告)日:2014-09-02

    申请号:US13567750

    申请日:2012-08-06

    IPC分类号: G11C11/00 G11C13/00

    摘要: An operating method for a memory device and a memory array and an operating method for the same are provided. The operating method for the memory device comprises following steps. A memory device is made being in a set state. A method for making the memory device being in the set state comprises applying a first bias voltage to the memory device. The memory device in the set state is read. A method for reading the memory device in the set state comprises applying a second bias voltage to the memory device. A recovering bias voltage is applied to the memory device. The step for applying the recovering bias voltage is performed after the step for applying the first bias voltage or the step for applying the second bias voltage.

    摘要翻译: 提供了一种用于存储器件和存储器阵列的操作方法及其操作方法。 存储器件的操作方法包括以下步骤。 使存储器件处于置位状态。 用于使存储器件处于设置状态的方法包括将第一偏置电压施加到存储器件。 读取设置状态的存储器件。 一种在设定状态下读取存储器件的方法,包括将第二偏置电压施加到存储器件。 将恢复的偏置电压施加到存储器件。 在施加第一偏置电压的步骤或施加第二偏置电压的步骤之后执行用于施加恢复偏压的步骤。

    Phase change memory having stabilized microstructure and manufacturing method
    8.
    发明授权
    Phase change memory having stabilized microstructure and manufacturing method 有权
    具有稳定的微结构和制造方法的相变记忆体

    公开(公告)号:US08809829B2

    公开(公告)日:2014-08-19

    申请号:US12484955

    申请日:2009-06-15

    申请人: Ming-Hsiu Lee

    发明人: Ming-Hsiu Lee

    IPC分类号: H01L47/00

    摘要: A memory device having a phase change material element with a modified stoichiometry in the active region does not exhibit drift in set state resistance. A method for manufacturing the memory device includes first manufacturing an integrated circuit including an array of phase change memory cells with bodies of phase change material having a bulk stoichiometry; and then applying forming current to the phase change memory cells in the array to change the bulk stoichiometry in active regions of the bodies of phase change material to the modified stoichiometry, without disturbing the bulk stoichiometry outside the active regions. The bulk stoichiometry is characterized by stability under the thermodynamic conditions outside the active region, while the modified stoichiometry is characterized by stability under the thermodynamic conditions inside the active region.

    摘要翻译: 具有在有源区域中具有改变的化学计量的相变材料元件的存储器件在设定状态电阻中不会出现漂移。 一种用于制造存储器件的方法包括:首先制造集成电路,该集成电路包括具有大体积化学计量的相变材料体的相变存储器单元的阵列; 然后将成形电流施加到阵列中的相变存储器单元,以将相变材料的主体的有源区域中的主体化学计量改变为改变的化学计量,而不会干扰有源区域外的主体化学计量。 主要化学计量学的特征在于在活性区域外的热力学条件下的稳定性,而改性的化学计量学的特征在于活性区域内的热力学条件下的稳定性。

    Approach for phase change memory cells targeting different device specifications
    9.
    发明授权
    Approach for phase change memory cells targeting different device specifications 有权
    针对不同设备规格的相变存储单元的方法

    公开(公告)号:US08743599B2

    公开(公告)日:2014-06-03

    申请号:US13421718

    申请日:2012-03-15

    IPC分类号: G11C11/00 G11C13/00

    摘要: A memory chip and methods of fabricating a memory device with different programming performance and retention characteristics on a single wafer. One method includes depositing a first bounded area of phase change material on the wafer and depositing a second bounded area of phase change material on the wafer. The method includes modifying the chemical composition of a switching volume of the first bounded area of phase change material. The method includes forming a first memory cell in the first bounded area of phase change material with a modified switching volume of phase change material and a second memory cell in the second bounded area of phase change material with an unmodified switching volume of phase change material such that the first memory cell has a first retention property and the second memory cell has a second retention property. The first retention property is different from the second retention property.

    摘要翻译: 存储器芯片以及在单个晶片上制造具有不同编程性能和保持特性的存储器件的方法。 一种方法包括在晶片上沉积相变材料的第一界限区域,并在晶片上沉积相变材料的第二有界区域。 该方法包括改变相变材料的第一有界区域的开关体积的化学成分。 该方法包括在相变材料的第一有界区域中形成具有相变材料的修改的开关体积的第一存储单元,以及相变材料的第二有界区域中的第二存储单元,具有未改变的相变材料的开关体积,例如 第一存储单元具有第一保留特性,而第二存储单元具有第二保留特性。 第一保留性与第二保留性不同。

    3D memory array arranged for FN tunneling program and erase
    10.
    发明授权
    3D memory array arranged for FN tunneling program and erase 有权
    3D存储阵列用于FN隧道编程和擦除

    公开(公告)号:US08426294B2

    公开(公告)日:2013-04-23

    申请号:US13476964

    申请日:2012-05-21

    IPC分类号: H01L29/76

    摘要: A 3D memory device includes an array of semiconductor body pillars and bit line pillars, dielectric charge trapping structures, and a plurality of levels of word line structures arranged orthogonally to the array of semiconductor body pillars and bit line pillars. The semiconductor body pillars have corresponding bit line pillars on opposing first and second sides, providing source and drain terminals. The semiconductor body pillars have first and second channel surfaces on opposing third and fourth sides. Dielectric charge trapping structures overlie the first and second channel surfaces, providing data storage sites on two sides of each semiconductor body pillar in each level of the 3D array. The device can be operated as a 3D AND-decoded flash memory.

    摘要翻译: 3D存储器件包括半导体主体柱和位线柱的阵列,介电电荷俘获结构以及与半导体主体柱和位线柱阵列垂直布置的多个字线结构。 半导体主体柱在相对的第一和第二侧上具有对应的位线柱,提供源极和漏极端子。 半导体主体支柱在相对的第三和第四侧上具有第一和第二通道表面。 电介质电荷捕获结构覆盖在第一和第二通道表面上,在3D阵列的每个级别中的每个半导体主体支柱的两侧提供数据存储位置。 该设备可以作为3D和解码的闪存操作。