Laser fuse with efficient heat dissipation
    4.
    发明申请
    Laser fuse with efficient heat dissipation 有权
    激光熔丝具有高效散热

    公开(公告)号:US20070132059A1

    公开(公告)日:2007-06-14

    申请号:US11299999

    申请日:2005-12-12

    IPC分类号: H01L29/00

    摘要: A semiconductor structure having an efficient thermal path and a method for forming the same are provided. The semiconductor structure includes a protection ring over a semiconductor substrate and substantially encloses a laser fuse structure. The laser fuse structure includes a laser fuse and a connection structure connecting the fuse to integrated circuits. The protection ring is thermally coupled to the semiconductor substrate by contacts. The semiconductor structure further includes a metal plate conducting heat generated by a laser beam to the protection ring.

    摘要翻译: 提供了具有有效的热路径的半导体结构及其形成方法。 半导体结构包括半导体衬底上的保护环,并且基本上包围激光熔丝结构。 激光熔丝结构包括激光熔丝和将熔丝连接到集成电路的连接结构。 保护环通过触点热耦合到半导体衬底。 半导体结构还包括将由激光束产生的热量传导到保护环的金属板。