公开(公告)号：US20050147624A1

公开(公告)日：2005-07-07

申请号：US10505276

申请日：2003-02-24

申请人： Harold Jennings ,  Malgorzata Mieszala ,  Grigorij Kogan ,  Wei Zou ,  James Richards ,  Andrew Cox

发明人： Harold Jennings ,  Malgorzata Mieszala ,  Grigorij Kogan ,  Wei Zou ,  James Richards ,  Andrew Cox

IPC分类号： A61K39/02 ,  A61K47/48 ,  C07K14/195

CPC分类号： A61K47/646

摘要： This invention relates to lipopolysaccharide-protein conjugate vaccines with appropriate presentation of conserved inner core oligosaccharide epitopes having improved immunogenic properties. These are based upon antigenic, detoxified bacterial lipopolysaccharides which optimally present an inner core oligosaccharide epitope following removal of at least a glycosidic phosphate of the lipid A region. These partially or completely dephosphorylated antigenic, detoxified bacterial lipopolysaccharides are linkable to an immunologically acceptable carrier and can be used in polyvalent or multivalent vaccines.

摘要翻译： 本发明涉及具有改善的免疫原性的保守的内核寡糖表位的适当呈递的脂多糖 - 蛋白质结合疫苗。 这些是基于抗原性，解毒的细菌脂多糖，其在去除脂质A区域的至少糖苷磷酸酯之后最佳地呈现内核寡糖表位。 这些部分或完全去磷酸化的抗原性，解毒的细菌脂多糖可与免疫学上可接受的载体连接，可用于多价或多价疫苗。

公开(公告)号：US08638675B2

公开(公告)日：2014-01-28

申请号：US12863256

申请日：2008-01-17

申请人： Dongyao Wang ,  Wei Zou ,  Shan Jin

发明人： Dongyao Wang ,  Wei Zou ,  Shan Jin

IPC分类号： H04J1/16 ,  H04B3/36

CPC分类号： H04B7/155 ,  H04L47/6215

摘要： A method and a device for data relay transmission in a wireless relay communication network are provided, in which, the relay station directly obtains corresponding egress CID related information based on input MAC PDUs, then generates output MAC PDUs including the egress CID related information, and at last, according to the egress CID related information, performs QoS scheduling for the output MAC PDUs, so as to output them in an sequence of QoS. The invention omits the steps of de-cascading, de-segmenting or de-capsulating the MAC PDUs in order to obtain MAC SDUs, and the steps of scheduling by category, cascading, segmenting, and encapsulating the MAC SDUs in order to re-generate the MAC PDUs in the prior art, and the invention simplifies the data processing procedure and achieves the goal of decreasing the relay latency.

摘要翻译： 提供了一种在无线中继通信网络中进行数据中继传输的方法和装置，其中中继站基于输入的MAC PDU直接获得对应的出口CID相关信息，然后生成包括出口CID相关信息的输出MAC PDU，以及 最后，根据出口CID相关信息，对输出的MAC PDU进行QoS调度，以便以QoS的顺序输出。 本发明省略了为了获得MAC SDU而对MAC PDU进行解压，去分段或解封装的步骤，以及按类别进行调度，级联，分段和封装MAC SDU的步骤，以便重新生成 现有技术中的MAC PDU，并且本发明简化了数据处理过程并实现了降低中继等待时间的目标。

公开(公告)号：US20130012221A1

公开(公告)日：2013-01-10

申请号：US13521349

申请日：2010-01-19

申请人： Wei Zou ,  Zhenhong Li ,  Haifeng Wang ,  Gang Wu ,  Tao Chen

发明人： Wei Zou ,  Zhenhong Li ,  Haifeng Wang ,  Gang Wu ,  Tao Chen

IPC分类号： H04W72/10

CPC分类号： H04W72/10 ,  H04W72/0406 ,  H04W72/082 ,  H04W72/087 ,  H04W76/14

摘要： Device-to-device (D2D) communication is one alternative to communication between devices through a radio access network. One interesting D2D communication method is reuse-mode D2D, where D2D nodes communicate with each other using the same uplink (UL) radio resource that is being used by some other cellular user equipment(s) (UEs). In other words, the UL cellular resources occupied by cellular UEs are reused by D2D nodes in their short-range communications. Centralized control of D2D communication can be performed by appropriate signaling between a D2D-capable UE and an evolved Node B (eNB).

摘要翻译： 设备到设备（D2D）通信是通过无线电接入网络在设备之间进行通信的替代方案。 一种有趣的D2D通信方法是复用模式D2D，其中D2D节点使用正被一些其他蜂窝用户设备（UE）使用的相同上行链路（UL）无线电资源彼此通信。 换句话说，蜂窝UE占用的UL蜂窝资源在其短距离通信中被D2D节点重用。 D2D通信的集中控制可以通过D2D能力的UE和演进节点B（eNB）之间的适当的信令来执行。

公开(公告)号：US08345587B2

公开(公告)日：2013-01-01

申请号：US12298975

申请日：2007-04-17

申请人： Gang Shen ,  Wei Ni ,  Wei Zou ,  Jimin Liu ,  Shan Jin

发明人： Gang Shen ,  Wei Ni ,  Wei Zou ,  Jimin Liu ,  Shan Jin

IPC分类号： H04B7/14 ,  H04B7/15 ,  H04W4/00

CPC分类号： H04B7/2606 ,  H04W16/26 ,  H04W76/20 ,  H04W84/047

摘要： A method for extending a coverage of a base station in a wireless communication network is disclosed, characterized in that a relay station transfers control information and communication related information between the base station and the mobile station according to an indication of the base station.

摘要翻译： 公开了一种在无线通信网络中扩展基站覆盖的方法，其特征在于，中继站根据基站的指示，在基站与移动站之间传送控制信息和通信相关信息。

公开(公告)号：US08156998B2

公开(公告)日：2012-04-17

申请号：US12710951

申请日：2010-02-23

申请人： Bruce K. Furman ,  Sushumna Iruvanti ,  Paul A. Lauro ,  Yves C. Martin ,  Da Yuan Shih ,  Theodore G. Van Kessel ,  Wei Zou

发明人： Bruce K. Furman ,  Sushumna Iruvanti ,  Paul A. Lauro ,  Yves C. Martin ,  Da Yuan Shih ,  Theodore G. Van Kessel ,  Wei Zou

IPC分类号： F28F7/00

CPC分类号： H01L23/433 ,  F28F13/00 ,  F28F2013/005 ,  H01L2224/73253 ,  Y10T29/4935 ,  Y10T29/53113

摘要： The present invention is a patterned metal thermal interface. In one embodiment a system for dissipating heat from a heat-generating device includes a heat sink having a first surface adapted for thermal coupling to a first surface of the heat generating device and a thermal interface having at least one patterned surface, the thermal interface being adapted to thermally couple the first surface of the heat sink to the first surface of the heat generating device. The patterned surface of the thermal interface allows the thermal interface to deform under compression between the heat sink and the heat generating device, leading to better conformity of the thermal interface to the surfaces of the heat sink and the heat generating device.

摘要翻译： 本发明是图案化的金属热界面。 在一个实施例中，用于从发热装置散热的系统包括具有适于热耦合到发热装置的第一表面的第一表面的散热器和具有至少一个图案化表面的热界面，所述热界面是 适于将散热器的第一表面热耦合到发热装置的第一表面。 热界面的图案化表面允许热界面在散热器和发热装置之间的压缩下变形，导致热界面与散热器和发热装置的表面更好地一致。

公开(公告)号：US08021925B2

公开(公告)日：2011-09-20

申请号：US11955598

申请日：2007-12-13

申请人： David L. Edwards ,  Sushumna Iruvanti ,  Hilton T. Toy ,  Wei Zou

发明人： David L. Edwards ,  Sushumna Iruvanti ,  Hilton T. Toy ,  Wei Zou

IPC分类号： H01L23/02

CPC分类号： H01L23/04 ,  H01L23/10 ,  H01L23/3675 ,  H01L23/42 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/16152 ,  H01L2924/16153 ,  H01L2924/1616 ,  Y10S257/924

摘要： A semiconductor module structure and a method of forming the semiconductor module structure are disclosed. The structure incorporates a die mounted on a substrate and covered by a lid. A thermal compound is disposed within a thermal gap between the die and the lid. A barrier around the periphery of the die extends between the lid and the substrate, contains the thermal compound, and flexes in response to expansion and contraction of both the substrate and the lid during cycling of the semiconductor module. More particularly, either the barrier is formed of a flexible material or has a flexible connection to the substrate and/or to the lid. The barrier effectively contains the thermal compound between the die and the lid and, thereby, provides acceptable and controlled coverage of the thermal compound over the die for heat removal.

摘要翻译： 公开了半导体模块结构和形成半导体模块结构的方法。 该结构包括安装在基板上并被盖子覆盖的模具。 热化合物设置在模具和盖子之间的热间隙内。 围绕模具周边的屏障在盖和基板之间延伸，包含热化合物，并且在半导体模块循环期间响应于基板和盖的膨胀和收缩而弯曲。 更具体地，屏障由柔性材料形成或具有与基底和/或盖的柔性连接。 屏障有效地包含了模具和盖子之间的热化合物，从而提供可靠和可控的覆盖模具上的热化合物以进行散热。

公开(公告)号：US07727447B2

公开(公告)日：2010-06-01

申请号：US11143364

申请日：2005-06-02

申请人： Hai-Min Song ,  Shih-Ming Liu ,  Wei Zou ,  Wen-Che Chen ,  Hsin-Pei Chang

发明人： Hai-Min Song ,  Shih-Ming Liu ,  Wei Zou ,  Wen-Che Chen ,  Hsin-Pei Chang

IPC分类号： B29C45/14 ,  B29C70/76

CPC分类号： B29C63/04 ,  B29K2313/00 ,  B29K2711/08 ,  B32B3/04 ,  B32B3/266 ,  B32B7/08 ,  B32B9/025 ,  B32B9/041 ,  B32B15/04 ,  B32B15/043 ,  B32B15/08 ,  B32B15/14 ,  B32B2274/00 ,  B32B2451/00 ,  Y10T428/31678

摘要： A method to produce a product includes the steps of: providing a mold including an upper mold (40) and a lower mold (30), the upper mold defining a plurality of through holes (43); providing a metal piece (10), a hot melt adhesive, and a nonmetal cover layer (50) between the upper and lower molds, the hot melt adhesive arranged between the hot melt adhesive and the cover layer; closing the mold; heating the mold to melt the hot melt adhesive; conducting high-pressure gas into the mold via the through holes to press the cover layer toward the metal piece; opening the mold to pick up an intermediary product having the metal piece and the cover layer attached thereto by means of the adhesive; and applying a sealing layer (60) which joins corresponding free edges of the metal piece and the cover layer to the intermediary product through injection molding technology.

摘要翻译： 一种制造产品的方法包括以下步骤：提供包括上模具（40）和下模具（30）的模具，所述上模具限定多个通孔（43）; 在所述上模和下模之间提供金属片（10），热熔粘合剂和非金属覆盖层（50），所述热熔粘合剂布置在所述热熔粘合剂和所述覆盖层之间; 关闭模具; 加热模具以熔化热熔胶; 通过所述通孔将高压气体导入所述模具中，以朝向所述金属片推压所述覆盖层; 打开模具以通过粘合剂拿起具有金属片和覆盖层的中间产品; 以及通过注射成型技术施加将金属片和覆盖层的相应的自由边缘连接到中间产品的密封层（60）。

公开(公告)号：US07694719B2

公开(公告)日：2010-04-13

申请号：US11619928

申请日：2007-01-04

申请人： Bruce K. Furman ,  Sushumna Iruvanti ,  Paul A. Lauro ,  Yves C. Martin ,  Da Yuan Shih ,  Theodore G. Van Kessel ,  Wei Zou

发明人： Bruce K. Furman ,  Sushumna Iruvanti ,  Paul A. Lauro ,  Yves C. Martin ,  Da Yuan Shih ,  Theodore G. Van Kessel ,  Wei Zou

IPC分类号： F28F7/00

CPC分类号： H01L23/433 ,  F28F13/00 ,  F28F2013/005 ,  H01L2224/73253 ,  Y10T29/4935 ,  Y10T29/53113

摘要： The present invention is a patterned metal thermal interface. In one embodiment a system for dissipating heat from a heat-generating device includes a heat sink having a first surface adapted for thermal coupling to a first surface of the heat generating device and a thermal interface having at least one patterned surface, the thermal interface being adapted to thermally couple the first surface of the heat sink to the first surface of the heat generating device. The patterned surface of the thermal interface allows the thermal interface to deform under compression between the heat sink and the heat generating device, leading to better conformity of the thermal interface to the surfaces of the heat sink and the heat generating device.

摘要翻译： 本发明是图案化的金属热界面。 在一个实施例中，用于从发热装置散热的系统包括具有适于热耦合到发热装置的第一表面的第一表面的散热器和具有至少一个图案化表面的热界面，所述热界面是 适于将散热器的第一表面热耦合到发热装置的第一表面。 热界面的图案化表面允许热界面在散热器和发热装置之间的压缩下变形，导致热界面与散热器和发热装置的表面更好地一致。

公开(公告)号：US07494951B2

公开(公告)日：2009-02-24

申请号：US11503184

申请日：2006-08-14

申请人： Zhirong Zhu ,  Dejin Kong ,  Weimin Yang ,  Qingling Chen ,  Wei Zou ,  Wei Li ,  Min Hou ,  Deqin Yang

发明人： Zhirong Zhu ,  Dejin Kong ,  Weimin Yang ,  Qingling Chen ,  Wei Zou ,  Wei Li ,  Min Hou ,  Deqin Yang

IPC分类号： B01J29/06

CPC分类号： B01J29/40 ,  B01J31/0274 ,  B01J37/0209 ,  B01J2229/12 ,  B01J2229/32 ,  B01J2229/42

摘要： The present invention relates to a process for the manufacture of catalysts used for producing para-xylene by toluene shape selective alkylation. The invention is primarily used for solving the problems in the old technology, e.g., high requirements on the environment and great treatment of waste water containing organic amines when synthesizing ZSM-5 molecular sieves by using an organic amine as the template agent; small and non-homogeneous particles of the molecular sieves when synthesizing ZSM-5 molecular sieves by using an alcohol or ether as the template agent, such that the catalyst prepared thereby has low catalytic selectivity and low toluene conversion rate, etc. Said problems are better solved in the present invention by synthesizing ZSM-5 molecular sieves using the combination of organic amines and alcohols or ethers as the template agents (having a weight ratio of organic amines/alcohols=0.05-150, and organic amines/ethers=0.05-150), and modifying with organosilicon so as to obtain the catalysts. Said catalysts can be used in the industrial production of para-xylene manufactured by toluene shape selective alkylation.

摘要翻译： 本发明涉及制备用于通过甲苯选择性烷基化生产对二甲苯的催化剂的方法。 本发明主要用于解决老技术中的问题，例如对于通过使用有机胺作为模板剂合成ZSM-5分子筛时对环境的高要求和含有有机胺的废水的大量处理; 通过使用醇或醚作为模板剂合成ZSM-5分子筛时，分子筛的小而非均匀的颗粒，使得由此制备的催化剂具有低催化选择性和低甲苯转化率等。所述问题更好 通过使用有机胺和醇或醚的组合作为模板剂（具有有机胺/醇的重量比= 0.05-150，有机胺/醚= 0.05-150）合成ZSM-5分子筛来解决本发明 ），并用有机硅改性以获得催化剂。 所述催化剂可用于通过甲苯选择性烷基化制造的对二甲苯的工业生产。

公开(公告)号：US20070222064A1

公开(公告)日：2007-09-27

申请号：US11755019

申请日：2007-05-30

申请人： David Edwards ,  Sushumna Iruvanti ,  Hilton Toy ,  Wei Zou

发明人： David Edwards ,  Sushumna Iruvanti ,  Hilton Toy ,  Wei Zou

IPC分类号： H01L23/12

CPC分类号： H01L23/04 ,  H01L23/10 ,  H01L23/3675 ,  H01L23/42 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/16152 ,  H01L2924/16153 ,  H01L2924/1616 ,  Y10S257/924

摘要： A semiconductor module structure and a method of forming the semiconductor module structure are disclosed. The structure incorporates a die mounted on a substrate and covered by a lid. A thermal compound is disposed within a thermal gap between the die and the lid. A barrier around the periphery of the die extends between the lid and the substrate, contains the thermal compound, and flexes in response to expansion and contraction of both the substrate and the lid during cycling of the semiconductor module. More particularly, either the barrier is formed of a flexible material or has a flexible connection to the substrate and/or to the lid. The barrier effectively contains the thermal compound between the die and the lid and, thereby, provides acceptable and controlled coverage of the thermal compound over the die for heat removal.

摘要翻译： 公开了半导体模块结构和形成半导体模块结构的方法。 该结构包括安装在基板上并被盖子覆盖的模具。 热化合物设置在模具和盖子之间的热间隙内。 围绕模具周边的屏障在盖和基板之间延伸，包含热化合物，并且在半导体模块循环期间响应于基板和盖的膨胀和收缩而弯曲。 更具体地，屏障由柔性材料形成或具有与基底和/或盖的柔性连接。 屏障有效地包含了模具和盖子之间的热化合物，从而提供可靠和可控的覆盖模具上的热化合物以进行散热。