公开(公告)号：US20050001330A1

公开(公告)日：2005-01-06

申请号：US10611153

申请日：2003-07-01

申请人： Harry Siegel ,  Robert Bond ,  Tom Lao

发明人： Harry Siegel ,  Robert Bond ,  Tom Lao

IPC分类号： H01L21/56 ,  H01L21/58 ,  H01L21/48 ,  H01L29/40

CPC分类号： H01L24/83 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/27013 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/8385 ,  H01L2224/8592 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00

摘要： A system and method is disclosed for controlling a height and a planarity of an integrated circuit die. In one advantageous embodiment of the invention, a plurality of patterned metal stops are fabricated on an integrated circuit substrate and covered with die attach material. An integrated circuit die is inserted into the die attach material and placed into a clamping mechanism of a molding machine. The clamping mechanism (1) compresses the die into the die attach material, (2) rotates the die into parallel alignment with the substrate, and (3) pushes the die into contact with the patterned metal stops. In this manner the die height and the die planarity are precisely controlled.

摘要翻译： 公开了一种用于控制集成电路管芯的高度和平面度的系统和方法。 在本发明的一个有利实施例中，在集成电路基板上制造多个图案化的金属止动件，并用管芯附着材料覆盖。 将集成电路管芯插入管芯附着材料中并放置在成型机的夹持机构中。 夹紧机构（1）将模具压入管芯附着材料，（2）将模具旋转与基板平行对准，（3）推动模具与图案化的金属挡块接触。 以这种方式，模具高度和模具平面度被精确地控制。

公开(公告)号：US06846186B2

公开(公告)日：2005-01-25

申请号：US10135742

申请日：2002-04-30

申请人： Tom Lao ,  Krishnan Kelappan ,  Mike Hundt

发明人： Tom Lao ,  Krishnan Kelappan ,  Mike Hundt

IPC分类号： H01M2/10 ,  H01M2/20 ,  H02J7/00 ,  H01R9/09

CPC分类号： H01M2/1022 ,  H01M2/1044 ,  H01M2/20 ,  H01M2/204 ,  Y10S257/924 ,  Y10S439/948

摘要： A battery pack for two 2032 batteries includes a molded plastic base having an upper surface on which the batteries are received and columnar standoff posts projecting from a bottom surface, as well as a molded plastic housing sized to receive the batteries and an upper portion of the base and having ears through which screws are passed to be received by press-fit threaded inserts mounted on an integrated circuit packaging substrate and tightened to a predetermined torque. Like terminals of the batteries are joined by a welded plate, with conductive pins connected to each plate extending through the base and projecting from a bottom surface of the battery pack. A mounting guide ensures connection of proper pins to corresponding receptacles of an integrated circuit packaged during mounting of the battery pack on the integrated circuit packaging substrate.

摘要翻译： 用于两个2032个电池的电池组包括：模制塑料基座，其具有容纳电池的上表面和从底表面突出的柱形支座，以及模制塑料壳体，其尺寸适于容纳电池和上部 底座并具有通过螺钉通过的耳朵，以通过安装在集成电路封装基板上并被紧固到预定扭矩的压配螺纹插件接收。 类似于电池的端子通过焊接板连接，导电销连接到每个板延伸穿过底座并从电池组的底表面突出。 安装引导件确保将电池组安装在集成电路封装基板上的正确引脚连接到集成电路的封装的相应插座。

公开(公告)号：US20070001286A1

公开(公告)日：2007-01-04

申请号：US11517879

申请日：2006-09-08

申请人： Anthony Chiu ,  Tom Lao

发明人： Anthony Chiu ,  Tom Lao

IPC分类号： H01L23/12

CPC分类号： H01L23/562 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/49816 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/854 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/341 ,  H05K2203/1178 ,  H05K2203/304 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

摘要： A system and method is disclosed for venting pressure from an integrated circuit package that is sealed with a lid. During a surface mount process for mounting a ball grid array integrated circuit package to a circuit board the application of heat (1) weakens the solder that seals a soldered lid, and (2) increases vapor pressure within the integrated circuit package. This may cause the soldered lid to move out of its soldered position. The present invention solves this problem by providing an integrated circuit with a solder mask that has a plurality of solder mask vents that form a plurality of vapor pressure vents through the solder. The vapor pressure vents prevent the occurrence of any increase in vapor pressure that would shift the soldered lid out of its soldered position. An alternate embodiment vents pressure through an epoxy layer that is used to attach a lid by epoxy.

摘要翻译： 公开了一种用于从由盖子密封的集成电路封装件排出压力的系统和方法。 在用于将球栅阵列集成电路封装安装到电路板的表面安装过程中，加热（1）的作用削弱了密封焊接盖的焊料，和（2）增加集成电路封装内的蒸汽压力。 这可能导致焊接的盖子从其焊接位置移出。 本发明通过提供具有焊料掩模的集成电路来解决这个问题，该焊接掩模具有多个通过焊料形成多个蒸汽压力通气口的焊接掩模排出口。 蒸汽压力通风口防止蒸汽压力的任何增加的发生，这将使焊接的盖子从其焊接位置移位。 替代实施例通过用于通过环氧树脂附接盖子的环氧树脂层排出压力。