摘要:
An integrated circuit includes: a resistive memory having an array of resistive memory cells; a memory controller that controls operation of the resistive memory in accordance with external commands from an external device; and a memory scheduler coupled to the resistive memory and to the memory controller. The memory scheduler schedules internal maintenance operations within the resistive memory in response to trigger conditions indicated by at least one sensor signal or external command. The operation of the memory scheduler and performance of the internal maintenance operations are transparent to the external device and, optionally, transparent to the memory controller.
摘要:
The present invention relates to a memory circuit and method of operating the same. In at least one embodiment, the memory circuit includes a resistive memory element coupled to a plate potential by a first terminal; a bit line which is connectable to a second terminal of the resistive memory element; a programming circuit operable to change the resistance of the resistive memory element; a bleeder circuit operable to provide a bleeding current to or from the bit line due to a change of the resistance of the resistive memory element caused by the programming circuit.
摘要:
A reference circuit (132) for an MRAM array, including logic “1” reference MRAM cells (MR1a) and (MR1b) coupled in parallel with logic “0” reference MRAM cells (MR0a) and (MR0b) The reference current (Iref)is coupled to a measurement resistor (Rm4) of a sense amplifier (130) which is adapted to determine the logic state of an unknown memory cell MCu.
摘要:
A dynamic random access memory array having an array of memory cells. Individual cells of the array are addressable by a plurality of word lines and a plurality of bit lines. The memory cells are disposed in active areas of the array. The array of memory cells includes a first strip of memory cells. The dynamic random access memory array includes a lower metal layer and an upper metal layer disposed above the lower metal layer. The dynamic random access memory array further includes a dielectric layer disposed between the lower metal layer and the upper metal layer. There is further included a first bit line of the plurality of bit lines which includes a lower metal first bit line portion implemented in the lower metal layer. The lower metal first bit line portion is coupled to a first plurality of memory cells of the first strip of memory cells. The first bit line also includes an upper metal first bit line portion implemented in the upper metal layer. The upper metal first bit line portion is coupled to the lower first metal bit line portion by a first contact through the dielectric layer. The first contact is disposed above one of the active areas.
摘要:
A method of determining the memory state of a resistive memory cell including a first electrode, a second electrode and an active material being arranged between the first electrode and the second electrode, comprises generating a read capacity by applying a voltage between the first electrode and the second electrode, discharging the read capacity over the active material of the memory cell, and determining the memory state of the memory cell in dependence on a change of the voltage during the discharge of the read capacity.
摘要:
A memory chip with a plurality of FB DRAM cells, having a word line coupled to a first FB DRAM cell and a second FB DRAM cell is disclosed. The memory chip further has a first bit line coupled to the first FB DRAM cell, and a first state memory circuit coupled to the first bit line. The memory chip further includes a second bit line coupled to the second FB DRAM cell, and a second state memory circuit coupled to the second bit line. The memory chip further includes a sense amplifier, which can be coupled to the first FB DRAM cell, the second FB DRAM cell, the first state memory circuit or the second state memory circuit.
摘要:
The present invention relates to a memory circuit and method of operating the same. In at least one embodiment, the memory circuit includes a resistive memory element coupled to a plate potential by a first terminal; a bit line which is connectable to a second terminal of the resistive memory element; a programming circuit operable to change the resistance of the resistive memory element; a bleeder circuit operable to provide a bleeding current to or from the bit line due to a change of the resistance of the resistive memory element caused by the programming circuit.
摘要:
The invention relates to a memory device comprising numerous memory cells, each cell comprising at least one selection transistor and one stacked capacitor and driven via word and bit lines. This memory device comprises two metallized sheets through which the bit line is led and between which the memory cell stacked capacitor is arranged.
摘要:
An MRAM device (200) and method of manufacturing thereof having second conductive lines (228) with a narrow width. The second conductive lines (228) partially contact the resistive memory elements (214), reducing leakage currents in neighboring cells (214).
摘要:
An arrangement of enhanced drivability transistors is disclosed herein which includes a plurality of conductor patterns, wherein the conductor patterns include ring-shaped portions which enclose device diffusion contacts and the ring-shaped portions form the gate conductors of insulated gate field effect transistors (IGFETs).