Method for selective plating
    2.
    发明授权
    Method for selective plating 失效
    选择性电镀方法

    公开(公告)号:US4033832A

    公开(公告)日:1977-07-05

    申请号:US695736

    申请日:1976-06-14

    IPC分类号: C25D5/02 C25D5/08 C25D17/28

    CPC分类号: C25D5/02

    摘要: An electro-plating method and apparatus therefor in which a discrete area of plating, such as a stripe about an elongated workpiece can be deposited without the use of separate masking. A plating solution having a depth equal to the length of the stripe desired is floated over a denser, inert, immiscible liquid (such as a liquid fluorocarbon). Workpieces are attached to a carrier which is electrically energized as cathodes and which are positioned vertically such that the area to receive the plated stripe is within the layer of plating solution, the workpieces projecting above the plating solution layer and below into the inert liquid as necessary. Pump weir and sump arrangements provide for maintenance of the plating solution and inert liquid levels and an anode is separately provided.

    摘要翻译: 一种电镀方法及其设备,其中可以在不使用单独掩蔽的情况下沉积例如围绕细长工件的条纹的电镀的离散区域。 具有与期望条纹长度相等的深度的电镀溶液漂浮在更致密,惰性,不混溶的液体(如液体碳氟化合物)上。 工件连接到作为阴极电通电并且垂直定位的载体,使得接收电镀条纹的区域在电镀液层内,工件在必要时在电镀液层上方突出到惰性液体中 。 泵堰和水槽布置提供电镀液和惰性液体水平的维护,并且单独提供阳极。

    Plasma deposition of glass or its precursor
    3.
    发明授权
    Plasma deposition of glass or its precursor 失效
    玻璃或其前体的等离子体沉积

    公开(公告)号:US4349373A

    公开(公告)日:1982-09-14

    申请号:US201948

    申请日:1980-10-29

    摘要: The vitreous material, e.g. silica, is deposited on the inner surface of the tube from a hot, intense, inductive plasma, which plasma is formed by utilization of wavelengths substantially longer than the diameter of the plasma. The process may be employed in the production of preform tubes or step or graded index optical fiber manufacture by gradually varying the contents of the vapor introduced into the plasma.

    摘要翻译: 玻璃质材料,例如 二氧化硅从热的,强烈的感应等离子体沉积在管的内表面上,该等离子体通过利用比等离子体的直径更长的波长形成。 该方法可以用于通过逐渐改变引入等离子体的蒸汽的内容物来生产预成型管或步进或渐变折射率光纤制造。

    Semiconductor switch device
    6.
    发明授权
    Semiconductor switch device 失效
    半导体开关器件

    公开(公告)号:US4493996A

    公开(公告)日:1985-01-15

    申请号:US394341

    申请日:1982-07-01

    CPC分类号: H01H1/0036 H01H47/24

    摘要: An electrical contact unit comprises a flexible semiconductor, e.g. silicon, filament carrying contacts and having a shorted pn junction. The filament is mounted in a magnetic field. When light is directed on to the junction, e.g. from an optical fiber, the induced photo current flowing around the short circuit interacts with the magnetic field so as to bend the filament so as to establish connection with one or more adjacent fixed contacts.

    摘要翻译: 电接触单元包括柔性半导体,例如。 硅,灯丝承载接触并具有短路pn结。 灯丝安装在磁场中。 当光被引导到结点时,例如, 来自光纤的流过短路的感应光电流与磁场相互作用,从而弯曲灯丝,从而与一个或多个相邻的固定触点建立连接。

    Line current detector
    7.
    发明授权
    Line current detector 失效
    线路电流检测器

    公开(公告)号:US4158170A

    公开(公告)日:1979-06-12

    申请号:US814608

    申请日:1977-07-11

    CPC分类号: H04M19/026 H04M3/2272

    摘要: A line current detector for use in telecommunications systems to monitor line condition. The detector uses an optical or photo electric device whose input is modulated by line current. A photo transistor, electrically isolated from the line, senses the modulated output of the detector to produce a condition responsive output. The optical device is preferably a liquid crystal device. The output sensor is isolated from the line.

    摘要翻译: 用于电信系统中的线路电流检测器,用于监视线路状况。 检测器使用其输入由线路电流调制的光学或光电器件。 与线路电隔离的光电晶体管感测检测器的调制输出以产生响应输出的条件。 光学装置优选为液晶装置。 输出传感器与线路隔离。

    Selective plating process
    8.
    发明授权
    Selective plating process 失效
    选择电镀工艺

    公开(公告)号:US4199415A

    公开(公告)日:1980-04-22

    申请号:US24583

    申请日:1979-03-28

    IPC分类号: C25D5/02 H05K3/24

    CPC分类号: C25D5/022 H05K3/243

    摘要: A method of selective plating, e.g. of gold on phosphor bronze, includes the steps of printing on the phosphor-bronze a mask which defines the area to be plated, electro-painting the unmasked areas in an electrolytic bath with an epoxy-phenolic paint, stoving the material so that the epoxy coat becomes a strongly adherent and chemically resistant layer, removing the mask produced in the first step in a suitable solvent, leaving the metal to be plated bare, and electro-plating. The epoxy coating may be left in situ or removed.

    摘要翻译: 选择性电镀的方法,例如 在磷青铜上的金包括以下步骤:在磷青铜上印刷限定待镀区域的面罩,用环氧酚醛漆在电解槽中电镀未掩蔽区域,烘烤材料,使环氧树脂 涂层成为强粘附和耐化学腐蚀的层,将合适的溶剂中的第一步产生的掩模除去,使待镀金属裸露和电镀。 环氧涂层可以留在原位或去除。