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28 条记录 (耗时 0.015 秒)

    Electronic package with integrated clock distribution structure
    1.
    发明授权
    Electronic package with integrated clock distribution structure 有权

    公开(公告)号：US06593793B1

    公开(公告)日：2003-07-15

    申请号：US10042273

    申请日：2002-01-11

    申请人： Henning Braunisch ,  Raj Nair ,  Gilroy Vandentop

    发明人： Henning Braunisch ,  Raj Nair ,  Gilroy Vandentop

    IPC分类号： H03K300

    CPC分类号： G06F1/10

    摘要： An electronic package and method for spatially distributing a clock signal is presented. The electronic package includes a low-loss structure, a semiconductor die, clocking vias, and clock receivers on the die. The low-loss structure is constructed and arranged to be driven by a clock signal and to produce standing waves. The clocking vias are constructed and arranged to connect the low-loss structure to the die and to conduct the standing waves to the die. The clock receivers generate respective synchronous on-chip clock signals based at least in part on the conducted standing waves.

    Electronic package with integrated clock distribution structure
    2.
    发明授权
    Electronic package with integrated clock distribution structure 失效
    具有集成时钟分配结构的电子封装

    公开(公告)号：US06720814B2

    公开(公告)日：2004-04-13

    申请号：US10443326

    申请日：2003-05-22

    申请人： Henning Braunisch ,  Raj Nair ,  Gilroy Vandentop

    发明人： Henning Braunisch ,  Raj Nair ,  Gilroy Vandentop

    IPC分类号： H03K300

    CPC分类号： G06F1/10

    摘要： An electronic package and method for spatially distributing a clock signal is presented. The electronic package includes a low-loss structure, a semiconductor die, clocking vias, and clock receivers on the die. The low-loss structure is constructed and arranged to be driven by a clock signal and to produce standing waves. The clocking vias are constructed and arranged to connect the low-loss structure to the die and to conduct the standing waves to the die. The clock receivers generate respective synchronous on-chip clock signals based at least in part on the conducted standing waves.

    摘要翻译： 提出了一种用于空间分配时钟信号的电子封装和方法。 电子封装包括低损耗结构，半导体管芯，时钟通孔和管芯上的时钟接收器。 低损耗结构被构造和布置成由时钟信号驱动并产生驻波。 时钟通孔被构造和布置成将低损耗结构连接到管芯并将驻波传导到管芯。 时钟接收器至少部分地基于传导的驻波产生相应的同步片上时钟信号。

    Optical package
    3.
    发明申请
    Optical package 失效
    光学包装

    公开(公告)号：US20060067609A1

    公开(公告)日：2006-03-30

    申请号：US10954903

    申请日：2004-09-30

    申请人： Daoqiang Lu ,  Henning Braunisch ,  Gilroy Vandentop

    发明人： Daoqiang Lu ,  Henning Braunisch ,  Gilroy Vandentop

    IPC分类号： G02B6/26 ,  G02B6/12 ,  G02B6/42

    CPC分类号： G02B6/1228 ,  G02B6/24 ,  G02B2006/12147

    摘要： Optical packages are disclosed. In one aspect, an optical package may include a surface, a microelectronic device coupled with the surface, a first waveguide coupled with the microelectronic device, a second waveguide having a first end that is evanescently coupled with the first waveguide and a second end, a first thickness of a cladding material disposed between the second end and the surface, and a second thickness of a cladding material disposed between the first end and the first waveguide. The first thickness may be greater than the second thickness. Methods of making the optical packages are also disclosed. Apparatus and methods of aligning operations on optical packages are also disclosed.

    摘要翻译： 公开了光学封装。 在一个方面，光学封装可以包括表面，与表面耦合的微电子器件，与微电子器件耦合的第一波导，具有与第一波导ev逝地耦合的第一端和第二端的第二波导， 设置在第二端和表面之间的包层材料的第一厚度，以及设置在第一端和第一波导之间的包层材料的第二厚度。 第一厚度可以大于第二厚度。 还公开了制造光学封装件的方法。 还公开了在光学封装上对准操作的装置和方法。

    Optical package
    6.
    发明授权
    Optical package 失效
    光学包装

    公开(公告)号：US07283699B2

    公开(公告)日：2007-10-16

    申请号：US10954903

    申请日：2004-09-30

    申请人： Daoqiang Lu ,  Henning Braunisch ,  Gilroy Vandentop

    发明人： Daoqiang Lu ,  Henning Braunisch ,  Gilroy Vandentop

    IPC分类号： G02B6/26 ,  G02B6/12

    CPC分类号： G02B6/1228 ,  G02B6/24 ,  G02B2006/12147

    摘要： Optical packages are disclosed. In one aspect, an optical package may include a surface, a microelectronic device coupled with the surface, a first waveguide coupled with the microelectronic device, a second waveguide having a first end that is evanescently coupled with the first waveguide and a second end, a first thickness of a cladding material disposed between the second end and the surface, and a second thickness of a cladding material disposed between the first end and the first waveguide. The first thickness may be greater than the second thickness. Methods of making the optical packages are also disclosed. Apparatus and methods of aligning operations on optical packages are also disclosed.

    摘要翻译： 公开了光学封装。 在一个方面，光学封装可以包括表面，与表面耦合的微电子器件，与微电子器件耦合的第一波导，具有与第一波导ev逝地耦合的第一端和第二端的第二波导， 设置在第二端和表面之间的包层材料的第一厚度，以及设置在第一端和第一波导之间的包层材料的第二厚度。 第一厚度可以大于第二厚度。 还公开了制造光学封装件的方法。 还公开了在光学封装上对准操作的装置和方法。

    On-substrate microlens to couple an off-substrate light emitter and/or receiver with an on-substrate optical device
    7.
    发明申请
    On-substrate microlens to couple an off-substrate light emitter and/or receiver with an on-substrate optical device 有权
    将衬底上发光器和/或接收器与衬底上的光学器件耦合的衬底上微透镜

    公开(公告)号：US20060067606A1

    公开(公告)日：2006-03-30

    申请号：US10955553

    申请日：2004-09-30

    申请人： Steven Towle ,  Henning Braunisch ,  Daoqiang Lu ,  Gilroy Vandentop ,  Anna George

    发明人： Steven Towle ,  Henning Braunisch ,  Daoqiang Lu ,  Gilroy Vandentop ,  Anna George

    IPC分类号： G02B6/12

    CPC分类号： G02B6/42 ,  G02B6/4206

    摘要： Optical apparatus, methods of forming the apparatus, and methods of using the apparatus are disclosed herein. In one aspect, an optical apparatus may include a substrate, an on-substrate microlens coupled with the substrate to receive light from an off-substrate light emitter and focus the light toward a focal point, and an on-substrate optical device coupled with the substrate proximate the focal point to receive the focused light. Communication of light in the reverse direction is also disclosed. Systems including the optical apparatus are also disclosed.

    摘要翻译： 本文公开了光学设备，形成设备的方法以及使用该设备的方法。 在一个方面，光学装置可以包括衬底，与衬底耦合的衬底上的微透镜以接收来自离衬底光发射器的光并将光聚焦到焦点，以及与衬底上的光学器件耦合的衬底上的光学器件 靠近焦点的基板以接收聚焦光。 还公开了相反方向的光的通信。 还公开了包括光学装置的系统。