摘要:
Process for making a device comprising at least the following steps: produce a getter structure comprising at least one portion of getter material permeable to gas covered by at least one protective layer hermetic to gas; hermetic encapsulation of the getter structure in a cavity; production of at least one local opening passing through the protective layer and forming an access to the portion of getter material permeable to gas.
摘要:
A microcavity structure including: a first substrate, a cover attached to the first substrate such that a space formed between the cover and the first substrate forms the microcavity, at least one hole passing through the cover, and at least one closing flap of the hole placed inside the microcavity and including at least two portions of materials with different thermal expansion coefficients placed one against the other, at least one first end of the two portions being mechanically linked to the cover, at least a second end of the two portions being free, and at least a part of the closing flap being placed opposite the hole, the two portions being capable of closing or not the hole under the effect of a temperature variation.
摘要:
Getter structure comprising at least one getter portion arranged on a support and including at least two adjacent getter material parts arranged on the support one beside the other, with different thicknesses and of which the surface grain densities are different from one another.
摘要:
A method for producing a structure includes bonding two substrates facing one another by crushing a closed peripheral sealing strip located between the two substrates, the closed peripheral sealing strip delineating a closed cavity between the substrates. A microsystem is disposed on one of the substrates within the closed cavity. Before crushing, the sealing strip includes perforated patterns delineating a plurality of voids inside the strip.
摘要:
A packaging structure including at least one cavity wherein at least one micro-device is provided, the cavity being bounded by at least a first substrate and at least a second substrate integral with the first substrate through at least one bonding interface consisting of at least one metal or dielectric material, wherein at least one main face of the second substrate provided facing the first substrate is covered with at least one layer of at least one getter material, the bonding interface being provided between the first substrate and the layer of getter material.
摘要:
Device for connecting nano-objects to external electrical systems, and method for producing the device.According to the invention, which applies in particular to molecular characterization, a device including the following is produced: an upper layer equipped with upper contact pads to be connected to a nano-object; a lower layer, equipped with lower contact pads to be connected to an external electrical system; above the lower layer, a bonding layer including electrical through-vias in contact with the lower pads; and, between the bonding layer and the upper layer, at least two layers equipped with conductive lines and electrical vias, for connecting the upper pads to the lower pads.
摘要:
The structure comprises at least a device, for example a microelectronic chip, and at least a getter arranged in a cavity under a controlled atmosphere delineated by a substrate and a sealing cover. The getter comprises at least one preferably metallic getter layer, and an adjustment sub-layer made from pure metal, situated between the getter layer and the substrate, on which it is formed. The adjustment sub-layer is designed to modulate the activation temperature of the getter layer. The getter layer comprises two elementary getter layers.
摘要:
A method of encapsulating a microelectronic device arranged on a substrate, comprising at least the following steps: a) formation of a portion of sacrificial material covering at least one part of the microelectronic device, the volume of which occupies a space intended to form at least one part of a cavity in which the device is intended to be encapsulated; b) deposition of a layer based on at least one getter material, covering at least one part of the portion of sacrificial material; c) formation of at least one orifice through at least the layer of getter material, forming an access to the portion of sacrificial material; d) elimination of the portion of sacrificial material via the orifice, forming the cavity in which the microelectronic device is encapsulated; and e) sealing of the cavity.
摘要:
A method for producing a substrate with buried layers of getter material, including: making a first stack including one layer of a first getter material, arranged on a first support; making a second stack including one layer of a second getter material, arranged on a second support; and bringing the first stack into contact with the second stack and performing thermocompression, the layers of the first and of the second getter material being arranged between the first and the second support, at a temperature greater than or equal to a lowest temperature among thermal activation temperatures of the first and of the second getter material, to bond the layers of the first and second getter materials together.
摘要:
A method for producing a substrate with buried layers of getter material, including: making a first stack including one layer of a first getter material, arranged on a first support; making a second stack including one layer of a second getter material, arranged on a second support; and bringing the first stack into contact with the second stack and performing thermocompression, the layers of the first and of the second getter material being arranged between the first and the second support, at a temperature greater than or equal to a lowest temperature among thermal activation temperatures of the first and of the second getter material, to bond the layers of the first and second getter materials together.