公开(公告)号：US07812442B2

公开(公告)日：2010-10-12

申请号：US11778536

申请日：2007-07-16

申请人： Heung-Kyu Kwon ,  Tae-Je Cho ,  Min-Ha Kim

发明人： Heung-Kyu Kwon ,  Tae-Je Cho ,  Min-Ha Kim

IPC分类号： H05K7/20 ,  H01L23/10

CPC分类号： H01L23/3128 ,  H01L23/24 ,  H01L23/36 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  Y10T29/49156 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2924/00012

摘要： Provided are a high-power ball grid array (BGA) and a method for manufacturing the high-power BGA. The high-power BGA includes a printed circuit board which has a through hole at its center, connection pads which are formed on the bottom of the printed circuit board, matrix solder balls which surround the through hole and are adjacent to the connection pads on the bottom of the printed circuit board, a heat spreader which is formed on the top surface of the printed circuit board and includes an insulating layer of a high thermal conductivity, a semiconductor chip which is mounted downwardly on the bottom surface of the heat spreader, within the through hole, and includes a plurality of pads for bonding via gold wires with the connection pad, and a passive film which fills the through hole and is formed at the bottom of the semiconductor chip. By interposing a ceramic between the semiconductor chip and the heat spreader, for insulating, the generation of charges between the semiconductor chip and the heat spreader can be sharply reduced, and defects such as ESD (electrostatic discharge) can be reduced when testing for the ESD and mounting the package.

摘要翻译： 提供了大功率球栅阵列（BGA）和制造大功率BGA的方法。 大功率BGA包括在其中心具有通孔的印刷电路板，形成在印刷电路板的底部的连接焊盘，围绕通孔并且邻近印刷电路板上的连接焊盘的矩阵焊球 印刷电路板的底部，散热器，其形成在印刷电路板的顶表面上，并且包括高导热性的绝缘层，在散热器的底面上向下安装的半导体芯片， 通孔，并且包括用于通过金线与连接焊盘接合的多个焊盘，以及填充通孔并形成在半导体芯片的底部的钝化膜。 通过在半导体芯片和散热器之间插入陶瓷以进行绝缘，可以大大降低半导体芯片和散热器之间的电荷的产生，并且在测试ESD时可以减少ESD（静电放电）等缺点 并安装包装。

公开(公告)号：US07078800B2

公开(公告)日：2006-07-18

申请号：US10957176

申请日：2004-09-30

申请人： Heung-Kyu Kwon ,  Se-Yong Oh ,  Min-Ha Kim ,  Tae-Je Cho

发明人： Heung-Kyu Kwon ,  Se-Yong Oh ,  Min-Ha Kim ,  Tae-Je Cho

IPC分类号： H01L23/12

CPC分类号： H01L23/433 ,  H01L23/36 ,  H01L23/4334 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/00

摘要： Semiconductor packages are provided to prevent a chip, such as a central processing unit (CPU) chip, from being degraded due to hot spot heat generated during the operation of the chip and absorbs thermomechanical stresses in interfaces between the chip, a thermal interface material (TIM) and a lid. The chip is electrically connected, e.g., flip-chip bonded, to a package substrate. The lid is thermally connected to and disposed over a back surface of the chip with the TIM interposed therebetween. A heat dissipation means adjacent the TIM is also located between the lid and the chip to prevent the hot spot effect.

公开(公告)号：US07258808B2

公开(公告)日：2007-08-21

申请号：US10459400

申请日：2003-06-10

申请人： Heung-Kyu Kwon ,  Tae-Je Cho ,  Min-Ha Kim

发明人： Heung-Kyu Kwon ,  Tae-Je Cho ,  Min-Ha Kim

IPC分类号： H01L21/00 ,  H05K3/02

CPC分类号： H01L23/3128 ,  H01L23/24 ,  H01L23/36 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  Y10T29/49156 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2924/00012

摘要： A high-power BGA includes a printed circuit board with a through hole, connection pads formed on the bottom of the printed circuit board, matrix solder balls surrounding the through hole and adjacent to the connection pads, a heat spreader on the top surface of the printed circuit board that includes an insulating layer of a high thermal conductivity, a semiconductor chip mounted within the through hole on the bottom surface of the heat spreader that includes a number of contact pads for bonding with the connection pads using gold wires, and a passive film filling the through hole and around the semiconductor chip. By interposing a ceramic insulating layer between the semiconductor chip and the heat spreader, charge generation between the semiconductor chip and the heat spreader is sharply reduced, and defects such as ESD (electrostatic discharge) is reduced during testing and mounting of the package.

摘要翻译： 大功率BGA包括具有通孔的印刷电路板，形成在印刷电路板底部的连接焊盘，围绕通孔并与连接焊盘相邻的基体焊球，在该顶部表面上的散热器 印刷电路板，其包括高导热性的绝缘层，安装在散热器底表面上的通孔内的半导体芯片，其包括用于使用金线与连接焊盘接合的多个接触焊盘，以及被动 胶片填充通孔和半导体芯片周围。 通过在半导体芯片和散热器之间插入陶瓷绝缘层，半导体芯片和散热器之间的电荷产生急剧减少，并且在封装的测试和安装期间诸如ESD（静电放电）的缺陷减少。

公开(公告)号：US06952050B2

公开(公告)日：2005-10-04

申请号：US10245228

申请日：2002-09-16

申请人： Heung-Kyu Kwon ,  Se-Yong Oh ,  Min-Ha Kim ,  Tae-Je Cho

发明人： Heung-Kyu Kwon ,  Se-Yong Oh ,  Min-Ha Kim ,  Tae-Je Cho

IPC分类号： H01L23/34 ,  H01L23/36 ,  H01L23/373 ,  H01L23/433 ,  H01L23/12

CPC分类号： H01L23/433 ,  H01L23/36 ,  H01L23/4334 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/00

摘要： Semiconductor packages are provided to prevent a chip, such as a central processing unit (CPU) chip, from being degraded due to hot spot heat generated during the operation of the chip and absorbs thermomechanical stresses in interfaces between the chip, a thermal interface material (TIM) and a lid. The chip is electrically connected, e.g., flip-chip bonded, to a package substrate. The lid is thermally connected to and disposed over a back surface of the chip with the TIM interposed therebetween. A heat dissipation means adjacent the TIM is also located between the lid and the chip to prevent the hot spot effect.

公开(公告)号：US20050056928A1

公开(公告)日：2005-03-17

申请号：US10957176

申请日：2004-09-30

申请人： Heung-Kyu Kwon ,  Se-Yong Oh ,  Min-Ha Kim ,  Tae-Je Cho

发明人： Heung-Kyu Kwon ,  Se-Yong Oh ,  Min-Ha Kim ,  Tae-Je Cho

IPC分类号： H01L23/34 ,  H01L23/36 ,  H01L23/373 ,  H01L23/433 ,  H01L23/12

CPC分类号： H01L23/433 ,  H01L23/36 ,  H01L23/4334 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/00

摘要： Semiconductor packages are provided to prevent a chip, such as a central processing unit (CPU) chip, from being degraded due to hot spot heat generated during the operation of the chip and absorbs thermomechanical stresses in interfaces between the chip, a thermal interface material (TIM) and a lid. The chip is electrically connected, e.g., flip-chip bonded, to a package substrate. The lid is thermally connected to and disposed over a back surface of the chip with the TIM interposed therebetween. A heat dissipation means adjacent the TIM is also located between the lid and the chip to prevent the hot spot effect.

摘要翻译： 提供半导体封装以防止诸如中央处理单元（CPU）芯片的芯片由于在芯片的操作期间产生的热点热而劣化，并且吸收芯片，热界面材料之间的界面中的热机械应力 TIM）和盖子。 该芯片与封装衬底电连接，例如倒装芯片接合。 盖子被热连接到芯片的后表面并且设置在芯片的后表面上，其中TIM插入其间。 靠近TIM的散热装置也位于盖和芯片之间，以防止热点效应。

公开(公告)号：US08728222B2

公开(公告)日：2014-05-20

申请号：US13401954

申请日：2012-02-22

申请人： Min-Ha Kim ,  Joung-Soo Park ,  Heung-Jun Park ,  Sung-Tae Joo ,  Dong-Houn Yang

发明人： Min-Ha Kim ,  Joung-Soo Park ,  Heung-Jun Park ,  Sung-Tae Joo ,  Dong-Houn Yang

IPC分类号： B01D47/02

CPC分类号： A47L9/1683 ,  A47L9/1633 ,  A47L9/1641 ,  A47L9/181 ,  A47L9/182 ,  A47L9/185

摘要： A wet type dust collecting apparatus of a vacuum cleaner is provided. The wet type dust collecting apparatus of a vacuum cleaner includes a first separating unit configured to filter out and discharge dust by rotating air which is inlet via a first air inlet, and a plurality of a second centrifugal separating units configured to filter out dust from the air which is discharged from the first separating unit, and configured to eliminate dust from the inlet air via water which is filled inside of the second centrifugal separating units.

摘要翻译： 提供一种真空吸尘器的湿式集尘装置。 真空吸尘器的湿式集尘装置包括：第一分离单元，其经由第一空气入口旋转进入的空气进行过滤和排出灰尘;多个第二离心分离单元，其被配置为从 空气，其从第一分离单元排出，并且被构造成通过填充在第二离心分离单元内部的水除去来自入口空气的灰尘。

公开(公告)号：US20050009470A1

公开(公告)日：2005-01-13

申请号：US10749743

申请日：2003-12-30

申请人： Min-Ha Kim

发明人： Min-Ha Kim

IPC分类号： H04Q9/00 ,  H04L12/24 ,  H04L12/56 ,  H04M3/00

CPC分类号： H04L41/28 ,  H04W4/12 ,  H04W76/10 ,  H04W84/18 ,  H04W84/20 ,  H04W92/18

摘要： A method for remotely-controlling a mobile communication terminal is disclosed. The method includes the steps of: a) determining whether an address of a remote mobile communication terminal is included in a list of short-range mobile communication address; b) if the address of the remote mobile communication terminal is included in the list, controlling the remote mobile communication terminal according to a remote control signal by establishing a communication link with the remote mobile communication terminal from a short distance using a Bluetooth protocol, authorizing a remote control; and c) if not, controlling the remote mobile communication terminal by establishing a call connection with the remote mobile communication terminal and authorizing a remote control.

摘要翻译： 公开了一种远程控制移动通信终端的方法。 该方法包括以下步骤：a）确定远程移动通信终端的地址是否包括在短程移动通信地址的列表中; b）如果远程移动通信终端的地址包括在列表中，则通过使用蓝牙协议从短距离建立与远程移动通信终端的通信链路来根据遥控信号控制远程移动通信终端，授权 遥控器; 以及c）否则，通过与所述远程移动通信终端建立呼叫连接并授权远程控制来控制所述远程移动通信终端。

公开(公告)号：US08220108B2

公开(公告)日：2012-07-17

申请号：US12186678

申请日：2008-08-06

申请人： Jang-Keun Oh ,  Min-Ha Kim ,  Hyun-Il Lee

发明人： Jang-Keun Oh ,  Min-Ha Kim ,  Hyun-Il Lee

IPC分类号： A47L9/10

CPC分类号： A47L9/242 ,  A47L5/28 ,  A47L9/02 ,  A47L9/1409

摘要： A vacuum apparatus having a suction nozzle, an air suction unit to which the suction nozzle is pivotally connected and which fluidly communicates with the suction nozzle through a connection channel, a dirt receptacle which has at least two collecting parts fluidly communicating with at least two outlets formed at the air suction unit, respectively.

摘要翻译： 一种真空装置，具有一个吸嘴，一吸气单元，该吸嘴与该吸嘴单元枢转连接，并通过一连接通道与该吸嘴流体连通;一个污物容器，具有与至少两个出口流体连通的至少两个收集部分 分别形成在吸气单元。

公开(公告)号：US07776115B2

公开(公告)日：2010-08-17

申请号：US11975098

申请日：2007-10-17

申请人： Jang-Keun Oh ,  Jung-Gyun Han ,  Min-Ha Kim

发明人： Jang-Keun Oh ,  Jung-Gyun Han ,  Min-Ha Kim

IPC分类号： B01D45/12

CPC分类号： A47L9/1608 ,  A47L9/1625 ,  A47L9/1641 ,  A47L9/165 ,  A47L9/1658 ,  A47L9/1683 ,  B04C5/081 ,  B04C5/13 ,  B04C5/185 ,  B04C5/26 ,  B04C5/28 ,  Y10S56/03

摘要： A multi cyclone dust-separating apparatus is disclosed that includes a cyclone unit having a first cyclone, a plurality of second cyclones, and a dust collecting unit. The first cyclone is disposed so that a longitudinal axis thereof is substantially vertically arranged. The first cyclone separates relatively large dust or dirt from air drawn in through a first air inflow part. Each of the second cyclones is disposed so that longitudinal axes thereof are substantially vertically arranged. Each of the second cyclones has a second air inflow part to communicate with the first cyclone and an air discharging part to discharge the air. The second cyclones separate relatively minute dust or dirt from the air drawn in through the second air inflow part. The dust collecting unit is disposed below the cyclone unit to collect and store the dust or dirt separated from the air by the cyclone unit.

摘要翻译： 公开了一种多旋风除尘装置，其包括具有第一旋风分离器，多个第二旋风分离器和集尘装置的旋风单元。 第一旋风器被设置成使得其纵向轴线基本垂直地布置。 第一旋风分离器通过第一空气流入部分分离出相对较大的灰尘或污物。 每个第二旋风分离器设置成使其纵向轴线基本垂直地布置。 每个第二旋风分离器具有与第一旋风分离器连通的第二空气流入部分和排出空气的排气部分。 第二旋风分离器从通过第二空气流入部分吸入的空气中分离相对较小的灰尘或污垢。 集尘单元设置在旋风单元下方，以收集和存储由旋风单元与空气分离的灰尘或污垢。

公开(公告)号：US06498388B2

公开(公告)日：2002-12-24

申请号：US09995322

申请日：2001-11-26

申请人： Min-Ha Kim ,  Joong-Hyun Baek

发明人： Min-Ha Kim ,  Joong-Hyun Baek

IPC分类号： H01L2972

CPC分类号： H01L23/3677 ,  H01L25/0652 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/16152 ,  H01L2224/0401

摘要： Provided is a semiconductor memory module including semiconductor devices using solder balls as outer connection terminals, which reduces the deterioration of solder joint reliability (SJR) due to the difference in the thermal expansion coefficients of the module components. The memory module includes a module board, an upper heat sink, a lower heat sink and a linking means. The linking means is formed to have a structure that makes it possible to absorb contraction and expansion within the semiconductor module due to the different thermal expansion coefficients of the upper heat sink, the lower heat sink and the module board.