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43 条记录 (耗时 0.037 秒)

    Exposure method
    4.
    发明授权
    Exposure method 失效
    曝光方法

    公开(公告)号：US5498501A

    公开(公告)日：1996-03-12

    申请号：US416503

    申请日：1995-04-04

    申请人： Isamu Shimoda ,  Takao Kariya ,  Nobutoshi Mizusawa ,  Kunitaka Ozawa ,  Shunichi Uzawa

    发明人： Isamu Shimoda ,  Takao Kariya ,  Nobutoshi Mizusawa ,  Kunitaka Ozawa ,  Shunichi Uzawa

    IPC分类号： G03F7/20 ,  G03F9/00

    CPC分类号： G03F7/70066 ,  G03F7/2022 ,  G03F7/7045 ,  Y10S438/949

    摘要： A method of manufacturing of semiconductor devices, includes exposing different portions of a semiconductor substrate with a first exposure apparatus having a first exposure range; placing and aligning the semiconductor substrate with respect to a second exposure range of a second exposure apparatus, which range is larger than the first exposure range of the first exposure apparatus; detecting an alignment error of each of the portions of the semiconductor substrate as covered by the second exposure range of the second exposure apparatus; calculating an overall alignment error of those portions of the semiconductor substrate with respect to the entire second exposure range of the second exposure apparatus, on the basis of the detected alignment errors; and controlling the exposure operation of the second exposure apparatus on the basis of the calculated overall alignment error.

    摘要翻译： 一种半导体器件的制造方法，包括用具有第一曝光范围的第一曝光装置曝光半导体衬底的不同部分; 将半导体衬底相对于第二曝光装置的第二曝光范围放置和对准，该范围大于第一曝光装置的第一曝光范围; 检测由第二曝光装置的第二曝光范围所覆盖的半导体衬底的每个部分的对准误差; 基于检测到的对准误差，计算半导体衬底的这些部分相对于第二曝光装置的整个第二曝光范围的总体对准误差; 并根据计算的整体对准误差来控制第二曝光装置的曝光操作。

    Substrate conveying apparatus
    5.
    发明授权
    Substrate conveying apparatus 失效
    基板输送装置

    公开(公告)号：US5277539A

    公开(公告)日：1994-01-11

    申请号：US58791

    申请日：1993-05-10

    申请人： Shin Matsui ,  Takao Kariya ,  Nobutoshi Mizusawa ,  Ryuichi Ebinuma ,  Shunichi Uzawa

    发明人： Shin Matsui ,  Takao Kariya ,  Nobutoshi Mizusawa ,  Ryuichi Ebinuma ,  Shunichi Uzawa

    IPC分类号： G03F7/20 ,  H01L21/677 ,  H01L21/68 ,  B65G47/24

    CPC分类号： G03F7/70691 ,  H01L21/67766 ,  H01L21/67778 ,  H01L21/68

    摘要： A substrate conveying apparatus usable with a semiconductor manufacturing apparatus wherein a pattern of a mask is transferred onto a semiconductor wafer by exposing the semiconductor wafer to synchrotron orbital radiation or other exposure energy through a mask. The conveying apparatus transfers the semiconductor wafer to and from a wafer chuck while the surface thereof extends vertically, and/or transfers the wafer to and from a wafer cassette which contains a plurality of wafers horizontally. The apparatus includes a conveying hand having a gimbal mechanism for supporting the semiconductor wafer to assure the semiconductor wafer transfer to and from the wafer chuck while the wafer is vertical. When the semiconductor wafer is transferred to and from a wafer cassette, the apparatus is provided with a correcting mechanism for correcting the attitude of the conveying hand to prevent the semiconductor wafer from contacting the wafer cassette.

    摘要翻译： 一种可用于半导体制造装置的基板输送装置，其中通过将半导体晶片暴露于同步加速器轨道辐射或通过掩模的其他曝光能量将掩模的图案转印到半导体晶片上。 输送装置将晶片卡盘的表面向垂直方向延伸和/或从晶片卡盘传送半导体晶片，和/或将晶片从包含多个晶片的晶片盒水平地传送到晶片盒。 该装置包括具有用于支撑半导体晶片的万向架机构的传送手，以确保半导体晶片在晶片垂直时传送到晶片卡盘。 当将半导体晶片转移到晶片盒或从晶片盒转移时，该装置设置有校正机构，用于校正传送手的姿态以防止半导体晶片接触晶片盒。

    Exposure apparatus
    6.
    发明授权
    Exposure apparatus 失效
    曝光装置

    公开(公告)号：US5390227A

    公开(公告)日：1995-02-14

    申请号：US062151

    申请日：1993-05-17

    申请人： Nobutoshi Mizusawa ,  Ryuichi Ebinuma ,  Takao Kariya ,  Isamu Shimoda ,  Shunichi Uzawa

    发明人： Nobutoshi Mizusawa ,  Ryuichi Ebinuma ,  Takao Kariya ,  Isamu Shimoda ,  Shunichi Uzawa

    IPC分类号： G03F7/20 ,  G21K5/00

    CPC分类号： G03F7/70066 ,  G03F7/702 ,  G03F7/70858 ,  G03F7/70875

    摘要： An exposure apparatus for exposing a semiconductor wafer to a semiconductor device pattern formed in a mask. The exposure energy is, for example, X-rays contains in synchrotron orbit radiation. A blade for limiting the area irradiated with the exposure energy on a mask or wafer is integrally movable in an alignment detecting unit for detecting the alignment mark. Four of such blades are provided to provide a square exposure area. The blades are movable independently by the associated alignment detecting units. Each of the blades is finely movable relative to the associated alignment detecting unit. The shape or size or the like of the blade is determined in consideration of the position of the blade in the direction of the exposure energy irradiation, and the maximum and minimum exposure view angle. The blade is cooled. The exposure area can be changed highly accurately and efficiently with a simple structure.

    摘要翻译： 一种用于将半导体晶片暴露于形成在掩模中的半导体器件图案的曝光装置。 曝光能量例如是X射线含有同步加速器轨道辐射。 用于将在曝光能量上照射的面积限制在掩模或晶片上的刀片可在用于检测对准标记的对准检测单元中一体地移动。 提供四个这样的刀片以提供方形曝光区域。 叶片可通过相关联的对准检测单元独立地移动。 每个叶片相对于相关联的对准检测单元精细地移动。 考虑到叶片在曝光能量照射方向上的位置以及最大和最小曝光视角来确定叶片的形状或尺寸等。 刀片冷却。 曝光区域可以用简单的结构高精度高效地进行改变。