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13 条记录 (耗时 0.019 秒)

    Flexible board made by joining two pieces through an adhesive film
    1.
    发明授权
    Flexible board made by joining two pieces through an adhesive film 有权
    通过粘合膜连接两片制成的柔性板

    公开(公告)号：US06437251B1

    公开(公告)日：2002-08-20

    申请号：US09505871

    申请日：2000-02-17

    申请人： Hideyuki Kurita ,  Masanao Watanabe ,  Toshihiro Shinohara ,  Yukio Anzai ,  Mitsuhiro Fukuda

    发明人： Hideyuki Kurita ,  Masanao Watanabe ,  Toshihiro Shinohara ,  Yukio Anzai ,  Mitsuhiro Fukuda

    IPC分类号： H05K100

    CPC分类号： H05K3/363 ,  H05K1/036 ,  H05K3/305 ,  H05K3/328 ,  H05K3/3473 ,  H05K3/361 ,  H05K2201/0129 ,  H05K2201/10977 ,  H05K2203/0285 ,  H05K2203/065 ,  H05K2203/1189

    摘要： This invention provides a specially-shaped, double-face flexible printed wiring board having a small pitch at a high production yield. Metal wirings 22 and 32 formed on a base film 21, 31 of two elemental pieces 20 and 30 of a flexible printed wiring board are arranged in such a manner as to face each other while sandwiching a bonding film 16 not containing conductive particles between them, and are heat-pressed to each other. The adhesive resin film 16 so softened is pushed aside from the metal wirings 22 and 32 and the low melting point metal coating films 23 and 33 formed on the surface of the metal wirings 22 and 32 come into direct contact with each other and are fused. In this instance, the softened adhesive resin film 16 is charged between the metal wirings 22 and 32. Therefore, the molten low melting point metal does not scatter. The base films 21 and 31 are bonded by the adhesive resin film 16.

    摘要翻译： 本发明提供一种以高产量产生具有小间距的特殊形状的双面柔性印刷线路板。 在柔性印刷电路板的两个元件20和30的基膜21,31上形成的金属布线22和32以彼此面对的方式布置，同时夹着不含导电颗粒的接合膜16， 并彼此热压。 被软化的粘合树脂膜16被从金属布线22和32推开，并且形成在金属布线22和32的表面上的低熔点金属涂覆膜23和33彼此直接接触并被熔合。 在这种情况下，软化的粘合树脂膜16被填充在金属布线22和32之间。因此，熔融的低熔点金属不会散射。 基膜21和31通过粘合树脂膜16粘接。

    Board pieces, flexible wiring boards, and processes for manufacturing flexible wiring boards
    3.
    发明授权
    Board pieces, flexible wiring boards, and processes for manufacturing flexible wiring boards 有权
    板件，柔性布线板以及制造柔性布线板的工艺

    公开(公告)号：US06596947B1

    公开(公告)日：2003-07-22

    申请号：US09937590

    申请日：2002-01-18

    申请人： Hideyuki Kurita ,  Masanao Watanabe ,  Toshihiro Shinohara ,  Mitsuhiro Fukuda ,  Yukio Anzai

    发明人： Hideyuki Kurita ,  Masanao Watanabe ,  Toshihiro Shinohara ,  Mitsuhiro Fukuda ,  Yukio Anzai

    IPC分类号： H05K103

    CPC分类号： H05K3/363 ,  H05K1/036 ,  H05K1/0393 ,  H05K3/28 ,  H05K3/284 ,  H05K3/305 ,  H05K3/3457 ,  H05K3/3473 ,  H05K3/3494 ,  H05K2201/0129 ,  H05K2201/10977 ,  H05K2203/0195 ,  H05K2203/0285 ,  H05K2203/065 ,  Y10T428/2804

    摘要： A board piece 2 of the present invention comprises a non-thermoplastic resin film 11, a thermoplastic resin film 10 formed on the non-thermoplastic resin film 11 and a metal wiring 8 formed on the surface of the thermoplastic resin film 10. Metal wiring 8 is partially exposed on board piece 2 to form a contact 12. A low-melting metal coating 13 is formed on contact 12 and two board pieces 2a, 2b are pressed against each other under heating with contacts 12a, 12b thereof being in contact with each other so that thermoplastic resin films 10a, 10b soften to adhere board pieces 2a, 2b to each other and low-melting metal coatings 13a, 13b melt and then solidify to connect contacts 12a, 12b to each other. The region of metal wiring 8 not used for connection is wiring 17 connecting contacts 12 to each other and a cover film 19 can be provided on the surface thereof. Contacts 12a, 12b can also be connected by applying ultrasonic wave.

    摘要翻译： 本发明的板片2包括非热塑性树脂膜11，形成在非热塑性树脂膜11上的热塑性树脂膜10和形成在热塑性树脂膜10的表面上的金属布线8.金属布线8 被部分地暴露在板件2上以形成触点12.在触点12上形成低熔点金属涂层13，并且两个板片2a，2b在加热时被彼此挤压，其触点12a，12b与每个 使得热塑性树脂膜10a，10b软化以将板片2a，2b彼此粘合并且熔融金属涂层13a，13b熔化然后固化以将触点12a，12b彼此连接。 不用于连接的金属布线8的区域是将触点12彼此连接的布线17，并且可以在其表面上设置覆盖膜19。 触点12a，12b也可以通过施加超声波来连接。

    Method for manufacturing wiring circuit boards with bumps and method for forming bumps
    4.
    发明授权
    Method for manufacturing wiring circuit boards with bumps and method for forming bumps 失效
    用于制造具有凸块的布线电路板的方法和用于形成凸块的方法

    公开(公告)号：US06977349B2

    公开(公告)日：2005-12-20

    申请号：US10403024

    申请日：2003-04-01

    申请人： Yutaka Kaneda ,  Keiichi Naito ,  Toshihiro Shinohara

    发明人： Yutaka Kaneda ,  Keiichi Naito ,  Toshihiro Shinohara

    IPC分类号： H05K3/34 ,  H05K3/06 ,  H05K3/20 ,  H05K3/40 ,  H05K3/46 ,  H01K1/00

    CPC分类号： H05K3/4007 ,  H05K3/06 ,  H05K3/20 ,  H05K2201/0367 ,  H05K2203/0369

    摘要： Wiring circuit boards with bumps can be manufactured such that stable bump connections are possible and plating pre-treatments or other difficult operations are rendered unnecessary. By utilizing a technique whereby a bump-formation etching mask 7 is formed on a bump-forming surface 3a of a metal foil 3 which has a thickness that is the sum of the thickness t1 of the wiring circuit 1 and the height t2 of the bumps 2 which are to be formed on the wiring circuit 1 (t1+t2), and then the bumps 2 are formed by half-etching the metal foil 3 to a depth corresponding to the desired bump height t2 from the bump-formation etching mask 7 side, wiring circuit boards with bumps can be manufactured such that stable bump connections are possible and plating pre-treatments or other complex processes are rendered unnecessary.

    摘要翻译： 可以制造具有凸块的布线电路板，使得可以进行稳定的凸点连接，并且不需要电镀预处理或其他难以操作的电镀。 通过利用凸起形成蚀刻掩模7形成在金属箔3的凸起形成表面3a上的技术，金属箔3的厚度是布线电路1的厚度t 1和高度t 2之和 要形成在布线电路1上的凸块2（t 1 + t 2），然后通过将金属箔3半蚀刻到与所需的凸起高度t 2相对应的深度来形成凸块2 凸点形成蚀刻掩模7侧，可以制造具有凸起的布线电路板，使得可以进行稳定的凸点连接，并且不需要电镀预处理或其他复杂的工艺。

    Color image pick-up apparatus
    9.
    发明授权
    Color image pick-up apparatus 失效
    彩色摄像机

    公开(公告)号：US4390895A

    公开(公告)日：1983-06-28

    申请号：US301440

    申请日：1981-09-11

    申请人： Itsuzo Sato ,  Kazushige Ooi ,  Kikuo Saito ,  Yasuo Takemura ,  Toshihiro Shinohara

    发明人： Itsuzo Sato ,  Kazushige Ooi ,  Kikuo Saito ,  Yasuo Takemura ,  Toshihiro Shinohara

    IPC分类号： H04N9/07 ,  H04N9/04

    CPC分类号： H04N9/045

    摘要： A color image pick-up apparatus using a single planar array of solid state light-sensitive elements with a color mosaic filter. The color mosaic filter is made up of three types of elements occurring in repeating patterns which are such that luminance-type elements occur at every other element portion along both of two orthogonal direction. The signal corresponding to luminance is separated from the output signal of the solid state light-sensitive elements and delayed for one horizontal scanning period. The high frequency component of the delayed signal is extracted. The extracted high frequency component signal is added to the signal corresponding to luminance which is succeedingly produced from the solid state light-sensitive elements.

    摘要翻译： 使用具有彩色马赛克滤光片的固态光敏元件的单个平面阵列的彩色图像拾取装置。 彩色马赛克滤波器由重复图案中出现的三种类型的元件组成，这些元件在两个正交方向沿着每隔一个元件部分出现亮度元件。 对应于亮度的信号与固态感光元件的输出信号分离并延迟一个水平扫描周期。 提取延迟信号的高频分量。 提取的高频分量信号被加到对应于从固态光敏元件继续产生的亮度的信号上。