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公开(公告)号：US08686823B2
公开(公告)日：2014-04-01
申请号：US13355818
申请日：2012-01-23
申请人： Hiroaki Asano , Sadanori Suzuki , Kiminori Ozaki , Yasuhiro Koike , Hitoshi Shimadu , Tetsuya Furata , Tomoaki Asai , Takahiro Hayakawa , Ryou Yamauchi , Masao Miyake
发明人： Hiroaki Asano , Sadanori Suzuki , Kiminori Ozaki , Yasuhiro Koike , Hitoshi Shimadu , Tetsuya Furata , Tomoaki Asai , Takahiro Hayakawa , Ryou Yamauchi , Masao Miyake
CPC分类号： H01F27/2804 , H01F27/22 , H01F2027/2819
摘要： An electronic unit includes a double-sided substrate having an insulation substrate, a patterned first metal plate bonded on one side of the insulation substrate, and a patterned second metal plate bonded on the other side of the insulation substrate, and also includes a heat radiation member for releasing heat from the double-sided substrate. The heat radiation member is disposed adjacent to one of the first metal plate and the second metal plate generating a larger amount of heat than the other of the first metal plate and the second metal plate.
摘要翻译： 电子单元包括具有绝缘基板的双面基板，与绝缘基板的一侧结合的图案化的第一金属板以及结合在绝缘基板的另一侧上的图案化的第二金属板，还包括散热 用于从双面基板释放热量的构件。 散热构件与第一金属板和第二金属板中的一个相邻地布置，产生比第一金属板和第二金属板中的另一个更大的热量。
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公开(公告)号：US20140251659A1
公开(公告)日：2014-09-11
申请号：US14129408
申请日：2012-07-02
申请人： Hiroaki Asano , Yasuhiro Koike , Kiminori Ozaki , Hitoshi Shimadu , Tetsuya Furuta , Masao Miyake , Takahiro Hayakawa , Tomoaki Asai , Ryou Yamauchi
发明人： Hiroaki Asano , Yasuhiro Koike , Kiminori Ozaki , Hitoshi Shimadu , Tetsuya Furuta , Masao Miyake , Takahiro Hayakawa , Tomoaki Asai , Ryou Yamauchi
CPC分类号： H05K1/115 , H05K1/0201 , H05K1/0272 , H05K1/09 , H05K1/185 , H05K3/0058 , H05K3/0061 , H05K3/30 , H05K3/341 , H05K3/38 , H05K3/4038 , H05K2201/0305 , H05K2201/09063 , H05K2201/0969 , H05K2203/1178 , Y10T29/4913
摘要： A circuit board, onto which an electronic component is to be mounted, is provided with insulating core substrates and patterned metal plates. The metal plates are bonded to at least one side of the insulating core substrates. The insulating core substrates and the metal plates form a laminated body, in which a gas-vent hole is provided. The gas-vent hole is formed so that when the electronic component is mounted, the gas present between the insulating core substrates and the metal plates expands and is released to a side open to the atmosphere via the gas-vent hole.
摘要翻译： 安装有电子部件的电路板设置有绝缘芯基板和图案化的金属板。 金属板结合到绝缘芯基板的至少一侧。 绝缘芯基板和金属板形成层压体，其中设有排气孔。 排气孔形成为使得当安装电子部件时，存在于绝缘芯基板和金属板之间的气体膨胀并且经由排气孔被释放到大气开放的一侧。
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公开(公告)号：US08963672B2
公开(公告)日：2015-02-24
申请号：US14129148
申请日：2012-06-21
申请人： Hiroaki Asano , Yasuhiro Koike , Kiminori Ozaki , Hitoshi Shimadu , Tetsuya Furuta , Masao Miyake , Takahiro Hayakawa , Tomoaki Asai , Ryou Yamauchi
发明人： Hiroaki Asano , Yasuhiro Koike , Kiminori Ozaki , Hitoshi Shimadu , Tetsuya Furuta , Masao Miyake , Takahiro Hayakawa , Tomoaki Asai , Ryou Yamauchi
CPC分类号： H05K1/115 , H01F27/2804 , H05K1/0265 , H05K1/0268 , H05K1/0298 , H05K1/118 , H05K1/165 , H05K3/20 , H05K2201/0305 , H05K2201/0391 , H05K2201/09036 , H05K2201/0969 , H05K2201/09736 , H05K2201/09745
摘要： This wiring board is provided with an insulating core substrate, a first conductor pattern, a second conductor pattern, and a conductive material. The first conductor pattern and the second conductor pattern are adhered to the insulating core substrate. The second conductor pattern has a first surface and a second surface. The second conductor pattern has a concavity and a through-hole. The opening of the concavity that opens to the first surface and the opening of the through hole that opens to the first surface are interconnected to each other. The first conductor pattern is positioned at the opening of the concavity. The first conductor pattern and the second conductor pattern are electrically connected by means of the conductive material, which fills from the opening of the through hole that opens to the second surface.
摘要翻译： 该布线板设置有绝缘芯基板，第一导体图案，第二导体图案和导电材料。 第一导体图案和第二导体图案粘附到绝缘芯基板。 第二导体图案具有第一表面和第二表面。 第二导体图案具有凹部和通孔。 通向第一表面的凹部的开口和通向第一表面的通孔的开口相互连接。 第一导体图案位于凹部的开口处。 第一导体图案和第二导体图案通过导电材料电连接，导电材料从通孔的开口填充到第二表面。
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公开(公告)号：US09332638B2
公开(公告)日：2016-05-03
申请号：US14118636
申请日：2012-05-23
申请人： Kiminori Ozaki , Yasuhiro Koike , Hiroaki Asano , Harumitsu Sato , Hiroki Watanabe , Tadayoshi Kachi , Takahiro Suzuki , Hitoshi Shimadu , Tetsuya Furuta , Masao Miyake , Takahiro Hayakawa , Tomoaki Asai , Ryou Yamauchi
发明人： Kiminori Ozaki , Yasuhiro Koike , Hiroaki Asano , Harumitsu Sato , Hiroki Watanabe , Tadayoshi Kachi , Takahiro Suzuki , Hitoshi Shimadu , Tetsuya Furuta , Masao Miyake , Takahiro Hayakawa , Tomoaki Asai , Ryou Yamauchi
CPC分类号： H05K1/11 , H05K1/0263 , H05K1/115 , H05K3/0094 , H05K3/4038 , H05K3/4046 , H05K3/4084 , H05K2201/0305 , H05K2201/09509 , H05K2201/0969 , H05K2203/033 , H05K2203/1178 , Y10T29/49165
摘要： An electrically conductive path is configured from a first copper plate, a second copper plate, and solder. The first copper plate has a first bent section extended from a first joining section joined to an electrically insulative board and bent toward the rear surface of the electrically insulative board. The second copper plate has a second bent section which is extended from a second joining section joined to the electrically insulative board, is bent toward the front surface of the electrically insulative board, and is disposed so as to cover, together with the first bent section, the inner wall surface of a base-material through-hole. Through-holes are provided in the portions of the second copper plate which face the inside of the base-material through-hole. Solder is filled between the first bent section and the second bent section.
摘要翻译： 导电路径由第一铜板，第二铜板和焊料构成。 第一铜板具有从接合到电绝缘板的第一接合部延伸并朝向电绝缘板的后表面弯曲的第一弯曲部。 第二铜板具有从连接到电绝缘板的第二接合部延伸的第二弯曲部，朝向电绝缘板的前表面弯曲，并且与第一弯曲部一起覆盖 ，基材通孔的内壁表面。 在第二铜板的与基材通孔的内侧相对的部分设有通孔。 焊料填充在第一弯曲部分和第二弯曲部分之间。
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公开(公告)号：US20140139310A1
公开(公告)日：2014-05-22
申请号：US14129148
申请日：2012-06-21
申请人： Hiroaki Asano , Yasuhiro Koike , Kiminori Ozaki , Hitoshi Shimadu , Tetsuya Furuta , Masao Miyake , Takahiro Hayakawa , Tomoaki Asai , Ryou Yamauchi
发明人： Hiroaki Asano , Yasuhiro Koike , Kiminori Ozaki , Hitoshi Shimadu , Tetsuya Furuta , Masao Miyake , Takahiro Hayakawa , Tomoaki Asai , Ryou Yamauchi
CPC分类号： H05K1/115 , H01F27/2804 , H05K1/0265 , H05K1/0268 , H05K1/0298 , H05K1/118 , H05K1/165 , H05K3/20 , H05K2201/0305 , H05K2201/0391 , H05K2201/09036 , H05K2201/0969 , H05K2201/09736 , H05K2201/09745
摘要： This wiring board is provided with an insulating core substrate, a first conductor pattern, a second conductor pattern, and a conductive material. The first conductor pattern and the second conductor pattern are adhered to the insulating core substrate. The second conductor pattern has a first surface and a second surface. The second conductor pattern has a concavity and a through-hole. The opening of the concavity that opens to the first surface and the opening of the through hole that opens to the first surface are interconnected to each other. The first conductor pattern is positioned at the opening of the concavity. The first conductor pattern and the second conductor pattern are electrically connected by means of the conductive material, which fills from the opening of the through hole that opens to the second surface.
摘要翻译： 该布线板设置有绝缘芯基板，第一导体图案，第二导体图案和导电材料。 第一导体图案和第二导体图案粘附到绝缘芯基板。 第二导体图案具有第一表面和第二表面。 第二导体图案具有凹部和通孔。 通向第一表面的凹部的开口和通向第一表面的通孔的开口相互连接。 第一导体图案位于凹部的开口处。 第一导体图案和第二导体图案通过导电材料电连接，导电材料从通孔的开口填充到第二表面。
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6.发明授权DC-AC converter and method for protecting DC-AC converter from overcurrent 失效DC-AC转换器和DC-AC转换器保护过电流的方法公开(公告)号：US07561449B2
公开(公告)日：2009-07-14
申请号：US11837144
申请日：2007-08-10
CPC分类号： H02H7/1227 , H02M1/32 , H02M7/4807
摘要： A DC-AC converter for converting DC voltage to AC voltage. The converter includes a conversion circuit for converting DC voltage to voltage having a polarity corresponding to AC voltage. A filter circuit receives the converted voltage, smoothes the converted voltage, and outputs the smoothed voltage as AC voltage. A first switch operably connects the voltage conversion circuit and filter circuit. A second switch is arranged between input terminals of the filter circuit. An output current detection circuit detects overcurrent that is greater than a predetermined first threshold. When overcurrent that is greater than the first threshold is detected, the protection circuit stops the supply of power in the voltage conversion circuit, deactivates the first switch, and activates the second switch.
摘要翻译： 用于将直流电压转换成交流电压的直流 - 交流转换器。 该转换器包括用于将DC电压转换为具有对应于AC电压的极性的电压的转换电路。 滤波电路接收转换后的电压，平滑转换后的电压，并输出平滑电压作为交流电压。 第一开关可操作地连接电压转换电路和滤波电路。 第二开关设置在滤波电路的输入端之间。 输出电流检测电路检测大于预定的第一阈值的过电流。 当检测到大于第一阈值的过电流时，保护电路停止电压转换电路中的电力供应，停用第一开关并激活第二开关。
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7.发明申请DC-AC CONVERTER AND METHOD FOR PROTECTING DC-AC CONVERTER FROM OVERCURRENT 失效DC-AC转换器和用于保护直流 - 交流转换器从过流的方法公开(公告)号：US20080037295A1
公开(公告)日：2008-02-14
申请号：US11837144
申请日：2007-08-10
CPC分类号： H02H7/1227 , H02M1/32 , H02M7/4807
摘要： A DC-AC converter for converting DC voltage to AC voltage. The converter includes a conversion circuit for converting DC voltage to voltage having a polarity corresponding to AC voltage. A filter circuit receives the converted voltage, smoothes the converted voltage, and outputs the smoothed voltage as AC voltage. A first switch operably connects the voltage conversion circuit and filter circuit. A second switch is arranged between input terminals of the filter circuit. An output current detection circuit detects overcurrent that is greater than a predetermined first threshold. When overcurrent that is greater than the first threshold is detected, the protection circuit stops the supply of power in the voltage conversion circuit, deactivates the first switch, and activates the second switch.
摘要翻译： 用于将直流电压转换成交流电压的直流 - 交流转换器。 该转换器包括用于将DC电压转换为具有对应于AC电压的极性的电压的转换电路。 滤波电路接收转换后的电压，平滑转换后的电压，并输出平滑电压作为交流电压。 第一开关可操作地连接电压转换电路和滤波电路。 第二开关设置在滤波电路的输入端之间。 输出电流检测电路检测大于预定的第一阈值的过电流。 当检测到大于第一阈值的过电流时，保护电路停止电压转换电路中的电力供应，停用第一开关并激活第二开关。
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公开(公告)号：US08506308B2
公开(公告)日：2013-08-13
申请号：US13345433
申请日：2012-01-06
申请人： Hiroaki Asano , Sadanori Suzuki , Kiminori Ozaki
发明人： Hiroaki Asano , Sadanori Suzuki , Kiminori Ozaki
IPC分类号： H01R12/00
CPC分类号： H01R4/30
摘要： A substrate connection structure includes a first substrate, a second substrate, a first connection terminal plate, a second connection terminal plate, and a fastening member. The first connection terminal plate extends away from the first substrate and includes a flat portion. The second connection terminal plate extends away from the second substrate and includes a flat portion. At least one of the flat portions includes a screw insertion portion. The fastening member fastens the first connection terminal plate and the second connection terminal plate through the screw insertion portion in a state in which the flat portions are in contact with each other.
摘要翻译： 基板连接结构包括第一基板，第二基板，第一连接端子板，第二连接端子板和紧固件。 第一连接端子板从第一基板延伸并且包括平坦部分。 第二连接端子板远离第二基板延伸并且包括平坦部分。 至少一个平坦部分包括螺钉插入部分。 紧固构件在平坦部彼此接触的状态下，通过螺钉插入部紧固第一连接端子板和第二连接端子板。
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公开(公告)号：US08787037B2
公开(公告)日：2014-07-22
申请号：US13332684
申请日：2011-12-21
IPC分类号： H05K9/00
CPC分类号： H05K9/0066 , H03H1/0007
摘要： An electronic device includes a shielding member, an electric circuit, and a filter capacitor. The electric circuit has an output line and is arranged inside the shielding member. The filter capacitor is arranged outside the shielding member to be connected to the output line.
摘要翻译： 电子设备包括屏蔽构件，电路和滤波电容器。 电路具有输出线，并且布置在屏蔽构件的内部。 滤波电容器布置在屏蔽构件外部以连接到输出线。
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公开(公告)号：US08922313B2
公开(公告)日：2014-12-30
申请号：US13328215
申请日：2011-12-16
申请人： Sergey Moiseev , Yasuhiro Koike , Hiroaki Asano , Kiminori Ozaki , Masanori Tsuzaka , Shimpei Sakoda
发明人： Sergey Moiseev , Yasuhiro Koike , Hiroaki Asano , Kiminori Ozaki , Masanori Tsuzaka , Shimpei Sakoda
CPC分类号： H01F27/2804 , H01F27/02
摘要： An induction device includes a casing, a coil retainer, a coil that is disposed in the casing and retained to the coil retainer and a core that is disposed in the casing. The coil extends spirally around the core. The core and the coil retainer are fixed to the casing separately.
摘要翻译： 感应装置包括壳体，线圈保持器，设置在壳体中并保持在线圈保持器上的线圈和设置在壳体中的芯。 线圈围绕芯线螺旋地延伸。 芯和线圈保持架分别固定在外壳上。
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