公开(公告)号：US09332638B2

公开(公告)日：2016-05-03

申请号：US14118636

申请日：2012-05-23

申请人： Kiminori Ozaki ,  Yasuhiro Koike ,  Hiroaki Asano ,  Harumitsu Sato ,  Hiroki Watanabe ,  Tadayoshi Kachi ,  Takahiro Suzuki ,  Hitoshi Shimadu ,  Tetsuya Furuta ,  Masao Miyake ,  Takahiro Hayakawa ,  Tomoaki Asai ,  Ryou Yamauchi

发明人： Kiminori Ozaki ,  Yasuhiro Koike ,  Hiroaki Asano ,  Harumitsu Sato ,  Hiroki Watanabe ,  Tadayoshi Kachi ,  Takahiro Suzuki ,  Hitoshi Shimadu ,  Tetsuya Furuta ,  Masao Miyake ,  Takahiro Hayakawa ,  Tomoaki Asai ,  Ryou Yamauchi

IPC分类号： H05K1/11 ,  H05K3/00 ,  H05K3/40 ,  H05K1/02

CPC分类号： H05K1/11 ,  H05K1/0263 ,  H05K1/115 ,  H05K3/0094 ,  H05K3/4038 ,  H05K3/4046 ,  H05K3/4084 ,  H05K2201/0305 ,  H05K2201/09509 ,  H05K2201/0969 ,  H05K2203/033 ,  H05K2203/1178 ,  Y10T29/49165

摘要： An electrically conductive path is configured from a first copper plate, a second copper plate, and solder. The first copper plate has a first bent section extended from a first joining section joined to an electrically insulative board and bent toward the rear surface of the electrically insulative board. The second copper plate has a second bent section which is extended from a second joining section joined to the electrically insulative board, is bent toward the front surface of the electrically insulative board, and is disposed so as to cover, together with the first bent section, the inner wall surface of a base-material through-hole. Through-holes are provided in the portions of the second copper plate which face the inside of the base-material through-hole. Solder is filled between the first bent section and the second bent section.

摘要翻译： 导电路径由第一铜板，第二铜板和焊料构成。 第一铜板具有从接合到电绝缘板的第一接合部延伸并朝向电绝缘板的后表面弯曲的第一弯曲部。 第二铜板具有从连接到电绝缘板的第二接合部延伸的第二弯曲部，朝向电绝缘板的前表面弯曲，并且与第一弯曲部一起覆盖 ，基材通孔的内壁表面。 在第二铜板的与基材通孔的内侧相对的部分设有通孔。 焊料填充在第一弯曲部分和第二弯曲部分之间。

公开(公告)号：US08797759B2

公开(公告)日：2014-08-05

申请号：US13556570

申请日：2012-07-24

申请人： Hiroki Watanabe

发明人： Hiroki Watanabe

IPC分类号： H05K7/00

CPC分类号： H03H9/0566 ,  H03H9/706 ,  H03H9/725 ,  H05K1/025

摘要： An electronic module with excellent electrical characteristics includes an electronic component, a mount board, signal electrodes, a ground electrode, and an insulating layer. The electronic component is mounted on a first main surface of the mount board. The signal electrodes and the ground electrode are located on a second main surface of the mount board. The insulating layer is arranged so as to cover a portion of the second main surface of the mount board. The insulating layer is arranged so as not to cover end portions of the signal electrodes that face the ground electrode.

摘要翻译： 具有优异的电气特性的电子模块包括电子部件，安装板，信号电极，接地电极和绝缘层。 电子部件安装在安装板的第一主表面上。 信号电极和接地电极位于安装板的第二主表面上。 绝缘层被布置成覆盖安装板的第二主表面的一部分。 绝缘层被布置成不覆盖面对接地电极的信号电极的端部。

公开(公告)号：US20110101399A1

公开(公告)日：2011-05-05

申请号：US12923788

申请日：2010-10-07

申请人： Yoshinobu Suehiro ,  Mitsuhiro Inoue ,  Hideaki Kato ,  Kunihiro Hadame ,  Ryoichi Tohmon ,  Satoshi Wada ,  Koichi Ota ,  Kazuya Aida ,  Hiroki Watanabe ,  Yoshinori Yamamoto ,  Masaaki Ohtsuka ,  Naruhito Sawanobori

发明人： Yoshinobu Suehiro ,  Mitsuhiro Inoue ,  Hideaki Kato ,  Kunihiro Hadame ,  Ryoichi Tohmon ,  Satoshi Wada ,  Koichi Ota ,  Kazuya Aida ,  Hiroki Watanabe ,  Yoshinori Yamamoto ,  Masaaki Ohtsuka ,  Naruhito Sawanobori

IPC分类号： H01L33/52 ,  H01L31/0203

CPC分类号： H01L33/56 ,  C03B23/20 ,  C03C8/24 ,  C03C27/06 ,  H01L24/17 ,  H01L24/45 ,  H01L24/73 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/01057 ,  H01L2924/01322 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A solid element device includes a solid element, an electric power receiving and supplying part for receiving electric power from and supplying the electric power to the solid element, and an inorganic sealing material for sealing the solid element. The inorganic sealing material includes a low melting glass selected from SiO2—Nb2O5-based, B2O3—F-based, P2O5—F-based, P2O5—ZnO-based, SiO2—B2O3—La2O3-based, and SiO2—B2O3-based low melting glasses.

摘要翻译： 固体元件装置包括固体元件，用于从固体元件接收电力并向其提供电力的电力接收和供应部件，以及用于密封固体元件的无机密封材料。 无机密封材料包括选自SiO 2-Nb 2 O 5系，B 2 O 3 -F系，P 2 O 5 -F系，P 2 O 5·ZnO系，SiO2-B2O3-La2O3系，SiO2-B2O3系低 熔化眼镜。

公开(公告)号：US20090078959A1

公开(公告)日：2009-03-26

申请号：US12292262

申请日：2008-11-14

申请人： Yoshinobu Suehiro ,  Seiji Yamaguchi ,  Naruhito Sawanobori ,  Masaaki Ohtsuka ,  Hiroki Watanabe ,  Kazuya Aida

发明人： Yoshinobu Suehiro ,  Seiji Yamaguchi ,  Naruhito Sawanobori ,  Masaaki Ohtsuka ,  Hiroki Watanabe ,  Kazuya Aida

IPC分类号： H01L33/00

CPC分类号： C03C8/08 ,  C03C8/24 ,  H01L33/501 ,  H01L33/56 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A solid-state optical device includes a solid-state element, a power supplying/retrieving portion on which the solid-state element is mounted, the power supplying/retrieving portion supplying or retrieving electric power to/from the solid-state element, and a glass sealing material that seals the solid-state element. The glass sealing material has a thermal expansion coefficient equivalent to that of the power supplying/retrieving portion. The glass sealing material includes a P2O5—Al2O3—ZnO-based low-melting glass that includes 55 to 62 wt % of P2O5, 5 to 12 wt % of Al2O3 and 20 to 40 wt % of ZnO in weight %.

摘要翻译： 固体光学器件包括固态元件，固态元件安装在其上的供电/取出部分，向固态元件供电或从固态元件取回电力的供电/取出部分，以及 密封固态元件的玻璃密封材料。 玻璃密封材料具有与供电/取出部分相当的热膨胀系数。 玻璃密封材料包括P2O5-Al2O3-ZnO基低熔点玻璃，其包含55至62重量％的P 2 O 5，5至12重量％的Al 2 O 3和20至40重量％的以重量％计的ZnO。

公开(公告)号：US07470926B2

公开(公告)日：2008-12-30

申请号：US11220777

申请日：2005-09-08

申请人： Yoshinobu Suehiro ,  Seiji Yamaguchi ,  Naruhito Sawanobori ,  Masaaki Ohtsuka ,  Hiroki Watanabe ,  Kazuya Aida

发明人： Yoshinobu Suehiro ,  Seiji Yamaguchi ,  Naruhito Sawanobori ,  Masaaki Ohtsuka ,  Hiroki Watanabe ,  Kazuya Aida

IPC分类号： H01L29/06 ,  H01L29/12

CPC分类号： C03C8/08 ,  C03C8/24 ,  H01L33/501 ,  H01L33/56 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A solid-state optical device having: a solid-state element; a power supplying/retrieving portion that supplies or retrieves electric power to/from the solid-state element; and a glass sealing material that seals the solid-state element. The glass sealing material is made of a P2O5—ZnO-based low-melting glass that has 45 to 50 wt % of P2O5 and 15 to 35 wt % of ZnO.

摘要翻译： 一种固态光学器件，具有：固态元件; 供电/取出部分，用于向/从固态元件供电或取回电力; 以及密封固态元件的玻璃密封材料。 玻璃密封材料由P2O5-ZnO系低熔点玻璃制成，其具有45〜50重量％的P 2 O 5和15〜35重量％的ZnO。

公开(公告)号：US06997550B2

公开(公告)日：2006-02-14

申请号：US10912189

申请日：2004-08-06

申请人： Shoko Uchisako ,  Nobuya Kishi ,  Hiroki Watanabe ,  Tetsuo Fukumoto ,  Takateru Yamamoto ,  Kenji Tanaka ,  Keisuke Tateishi ,  Masako Shinozuka

发明人： Shoko Uchisako ,  Nobuya Kishi ,  Hiroki Watanabe ,  Tetsuo Fukumoto ,  Takateru Yamamoto ,  Kenji Tanaka ,  Keisuke Tateishi ,  Masako Shinozuka

IPC分类号： B41J2/01 ,  B41J2/145 ,  B41J11/00

CPC分类号： B41J3/54

摘要： Print is made on a recording paper by running an ink carriage along the supporting axis in a reciprocating motion. The ink carriage includes ink heads respectively provided with a front ink nozzle and a back ink nozzle facing their respective directions, so that print is made simultaneously at two portions on the recording paper along the transportation direction in which the recording paper is transported through a single transportation path one by one. Consequently, there can be provided an ink jet printer which can improve printing efficiency by increasing a printing rate and printing resolution, and realizing printing of an overstrike character, simultaneous printing of mixed information, double-side printing, etc.

摘要翻译： 通过以往复运动的方式沿支撑轴运行油墨支架，在记录纸上进行打印。 油墨架包括分别设置有面向其各自方向的前墨水喷嘴和后墨水喷嘴的墨头，使得沿着传送方向在记录纸上的两个部分同时进行打印，其中记录纸通过单个 运输路径一个一个。 因此，可以提供一种能够通过提高打印速度和打印分辨率而提高打印效率的喷墨打印机，实现打印字符的打印，混合信息的同时打印，双面打印等。

公开(公告)号：US09315416B2

公开(公告)日：2016-04-19

申请号：US13137150

申请日：2011-07-22

申请人： Seiji Yamaguchi ,  Koji Tasumi ,  Hiroyuki Tajima ,  Satoshi Wada ,  Miki Moriyama ,  Kazuya Aida ,  Hiroki Watanabe

发明人： Seiji Yamaguchi ,  Koji Tasumi ,  Hiroyuki Tajima ,  Satoshi Wada ,  Miki Moriyama ,  Kazuya Aida ,  Hiroki Watanabe

IPC分类号： C03C27/00 ,  H01L33/56

CPC分类号： C03C27/00 ,  H01L33/56 ,  H01L2224/13 ,  H01L2933/005

摘要： A method of manufacturing a light-emitting device including a light-emitting element mounted on a substrate and sealed with a glass. The method includes heating the glass by a first mold that is heated to a temperature higher than a yield point of the glass, the glass contacting the first mold, and pressing the glass against the light-emitting element mounted on the substrate supported by a second mold to seal the light-emitting element with the glass.

摘要翻译： 一种制造包括安装在基板上并用玻璃密封的发光元件的发光装置的方法。 该方法包括通过加热至高于玻璃的屈服点的温度的第一模具加热玻璃，玻璃与第一模具接触，并将玻璃压靠在安装在基板上的发光元件上，第二模具由第二模具 模具用玻璃密封发光元件。

公开(公告)号：US08685766B2

公开(公告)日：2014-04-01

申请号：US13419093

申请日：2012-03-13

申请人： Yoshinobu Suehiro ,  Mitsuhiro Inoue ,  Hideaki Kato ,  Kunihiro Hadame ,  Ryoichi Tohmon ,  Satoshi Wada ,  Koichi Ota ,  Kazuya Aida ,  Hiroki Watanabe ,  Yoshinori Yamamoto ,  Masaaki Ohtsuka ,  Naruhito Sawanobori

发明人： Yoshinobu Suehiro ,  Mitsuhiro Inoue ,  Hideaki Kato ,  Kunihiro Hadame ,  Ryoichi Tohmon ,  Satoshi Wada ,  Koichi Ota ,  Kazuya Aida ,  Hiroki Watanabe ,  Yoshinori Yamamoto ,  Masaaki Ohtsuka ,  Naruhito Sawanobori

IPC分类号： H01L21/56

CPC分类号： H01L33/56 ,  C03B23/20 ,  C03C8/24 ,  C03C27/06 ,  H01L24/17 ,  H01L24/45 ,  H01L24/73 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/01057 ,  H01L2924/01322 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of making a solid element device that includes a solid element, an element mount part on which the solid element is mounted and which has a thermal conductivity of not less than 100 W/mK, an external terminal provided separately from the element mount part and electrically connected to the solid element, and a glass sealing part directly contacting and covering the solid element for sealing the solid element, includes pressing a glass material at a temperature higher than a yield point of the glass material for forming the glass sealing part.

摘要翻译： 一种固体元件装置的制造方法，该固体元件装置包括固体元件，安装有固体元件的元件安装部件，其导热率不小于100W / mK，与元件安装部件分开设置的外部端子 并且与固体元件电连接，并且直接接触和覆盖固体元件以密封固体元件的玻璃密封部件包括在玻璃材料的高于用于形成玻璃密封部分的玻璃材料的屈服点的温度下挤压玻璃材料。

公开(公告)号：US20120067085A1

公开(公告)日：2012-03-22

申请号：US13137150

申请日：2011-07-22

申请人： Seiji Yamaguchi ,  Koji Tasumi ,  Hiroyuki Tajima ,  Satoshi Wada ,  Miki Moriyama ,  Kazuya Aida ,  Hiroki Watanabe

发明人： Seiji Yamaguchi ,  Koji Tasumi ,  Hiroyuki Tajima ,  Satoshi Wada ,  Miki Moriyama ,  Kazuya Aida ,  Hiroki Watanabe

IPC分类号： C03B23/20

CPC分类号： C03C27/00 ,  H01L33/56 ,  H01L2224/13 ,  H01L2933/005

摘要： A method of manufacturing a light-emitting device including a light-emitting element mounted on a substrate and sealed with a glass. The method includes heating the glass by a first mold that is heated to a temperature higher than a yield point of the glass, the glass contacting the first mold, and pressing the glass against the light-emitting element mounted on the substrate supported by a second mold to seal the light-emitting element with the glass.

摘要翻译： 一种制造包括安装在基板上并用玻璃密封的发光元件的发光装置的方法。 该方法包括通过加热至高于玻璃的屈服点的温度的第一模具加热玻璃，玻璃与第一模具接触，并将玻璃压靠在安装在基板上的发光元件上，第二模具由第二模具 模具用玻璃密封发光元件。

公开(公告)号：US20090186433A1

公开(公告)日：2009-07-23

申请号：US12318150

申请日：2008-12-22

申请人： Seiji Yamaguchi ,  Takashi Nonogawa ,  Yoshinobu Suehiro ,  Hiroki Watanabe ,  Kazuya Aida

发明人： Seiji Yamaguchi ,  Takashi Nonogawa ,  Yoshinobu Suehiro ,  Hiroki Watanabe ,  Kazuya Aida

IPC分类号： H01L21/00 ,  C03B19/00

CPC分类号： C03B19/063 ,  C03C8/24 ,  C03C14/004 ,  C03C14/006 ,  C03C27/00 ,  C09K11/7734 ,  C09K11/7741 ,  H01L24/97 ,  H01L33/501 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05124 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/13 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2933/0041 ,  Y02P40/57 ,  H01L2924/00 ,  H01L2924/00014

摘要： A method of making a light emitting device includes mixing a glass powder with a phosphor powder including at least one of a sulfide phosphor, an aluminate phosphor and a silicate phosphor to produce a mixed powder in which the phosphor powder is dispersed in the glass powder, heating and softening the mixed powder to provide an integrated material, and subsequently solidifying the integrated material to provide a phosphor-dispersed glass, and fusion-bonding the phosphor-dispersed glass onto a mounting portion on which a light emitting element is mounted by hot pressing, and simultaneously sealing the light emitting element with the phosphor-dispersed glass on the mounting portion.

摘要翻译： 制造发光器件的方法包括：将玻璃粉末与包含硫化物荧光体，铝酸盐荧光体和硅酸盐荧光体中的至少一种的荧光体粉末混合，制成荧光体粉末分散在玻璃粉末中的混合粉末， 加热和软化混合粉末以提供一体化材料，随后固化一体化材料以提供荧光体分散玻璃，并将磷光体分散玻璃熔融粘合到通过热压安装有发光元件的安装部分 并且将发光元件与分散有荧光体的玻璃同时密封在安装部上。