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公开(公告)号:US20080283951A1
公开(公告)日:2008-11-20
申请号:US12078894
申请日:2008-04-08
申请人: Yoshihiro Nabe , Masaki Hatano , Hiroshi Asami , Akihiro Morimoto
发明人: Yoshihiro Nabe , Masaki Hatano , Hiroshi Asami , Akihiro Morimoto
CPC分类号: H01L27/14618 , H01L21/76898 , H01L23/3677 , H01L23/481 , H01L31/0203 , H01L2224/05001 , H01L2224/05009 , H01L2224/0557 , H01L2224/05647 , H01L2224/13025 , H01L2224/16 , H01L2924/01078 , H01L2924/01079 , H01L2924/10158 , H01L2924/16235 , H01L2924/3025 , H01L2924/00014
摘要: A semiconductor device includes a semiconductor substrate having a first electronic circuit and a second electronic circuit formed on an active surface, a pad electrode formed on the active surface by being connected to the first electronic circuit and/or the second electronic circuit, a first opening formed to some point along a depth of the semiconductor substrate toward the pad electrode from a surface opposite to the active surface of the semiconductor substrate, a second opening formed so as to reach the pad electrode from a bottom surface of the first opening, an insulating layer formed by covering sidewall surfaces of the first opening and the second opening, a conductive layer formed by covering at least an inner wall surface of the insulating layer and a bottom surface of the second opening, a third opening formed to some point along the depth of the semiconductor substrate from the surface opposite to the active surface of the semiconductor substrate, and a heat insulator imbedded in the third opening.
摘要翻译: 半导体器件包括具有第一电子电路和形成在有源表面上的第二电子电路的半导体衬底,通过连接到第一电子电路和/或第二电子电路而形成在有源表面上的焊盘电极,第一开口 从与半导体基板的有源面相反的表面沿着半导体基板的深度朝向焊盘电极的某一点形成第二开口,从第一开口的底面到达焊盘电极,形成绝缘体 通过覆盖第一开口和第二开口的侧壁表面形成的层,通过覆盖绝缘层的至少内壁表面和第二开口的底表面形成的导电层,形成在沿着深度的某个点的第三开口 的半导体衬底从与半导体衬底的有源表面相反的表面,以及绝热体imb 在第三次开幕。
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公开(公告)号:US20090200629A1
公开(公告)日:2009-08-13
申请号:US12364072
申请日:2009-02-02
申请人: Hiroshi Asami , Yoshihiro Nabe , Akihiro Morimoto
发明人: Hiroshi Asami , Yoshihiro Nabe , Akihiro Morimoto
IPC分类号: H01L31/0203 , H01L21/50 , H01L27/146
CPC分类号: H01L27/14687 , H01L24/48 , H01L27/14618 , H01L31/0203 , H01L2224/48 , H01L2924/00014 , H01L2924/16195 , H01L2924/181 , H01L2224/48091 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要: A semiconductor device which includes a semiconductor chip formed with a light-reception area, a spacer, and a transparent substrate. The spacer is bonded to the semiconductor chip via a first adhesive and surrounding the light-reception area. The transparent substrate is bonded to the spacer via a second adhesive and disposed above the light-reception area. A first projection having a predetermined height is formed on a surface of the spacer which is on a side of the semiconductor chip, and the first projection abuts on the semiconductor chip.
摘要翻译: 一种半导体器件,包括形成有光接收区域的半导体芯片,间隔物和透明基板。 间隔物通过第一粘合剂结合到半导体芯片并且围绕光接收区域。 透明基板通过第二粘合剂粘合到间隔件上并设置在光接收区域的上方。 具有预定高度的第一突起形成在半导体芯片一侧的间隔物的表面上,第一突起抵接在半导体芯片上。
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公开(公告)号:US07939360B2
公开(公告)日:2011-05-10
申请号:US12364072
申请日:2009-02-02
申请人: Hiroshi Asami , Yoshihiro Nabe , Akihiro Morimoto
发明人: Hiroshi Asami , Yoshihiro Nabe , Akihiro Morimoto
IPC分类号: H01L21/00 , H01L31/0203
CPC分类号: H01L27/14687 , H01L24/48 , H01L27/14618 , H01L31/0203 , H01L2224/48 , H01L2924/00014 , H01L2924/16195 , H01L2924/181 , H01L2224/48091 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要: A semiconductor device which includes a semiconductor chip formed with a light-reception area, a spacer, and a transparent substrate. The spacer is bonded to the semiconductor chip via a first adhesive and surrounding the light-reception area. The transparent substrate is bonded to the spacer via a second adhesive and disposed above the light-reception area. A first projection having a predetermined height is formed on a surface of the spacer which is on a side of the semiconductor chip, and the first projection abuts on the semiconductor chip.
摘要翻译: 一种半导体器件,包括形成有光接收区域的半导体芯片,间隔物和透明基板。 间隔物通过第一粘合剂结合到半导体芯片并且围绕光接收区域。 透明基板通过第二粘合剂粘合到间隔件上并设置在光接收区域的上方。 具有预定高度的第一突起形成在半导体芯片一侧的间隔物的表面上,第一突起抵接在半导体芯片上。
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公开(公告)号:US08455969B2
公开(公告)日:2013-06-04
申请号:US12078894
申请日:2008-04-08
申请人: Yoshihiro Nabe , Masaki Hatano , Hiroshi Asami , Akihiro Morimoto
发明人: Yoshihiro Nabe , Masaki Hatano , Hiroshi Asami , Akihiro Morimoto
CPC分类号: H01L27/14618 , H01L21/76898 , H01L23/3677 , H01L23/481 , H01L31/0203 , H01L2224/05001 , H01L2224/05009 , H01L2224/0557 , H01L2224/05647 , H01L2224/13025 , H01L2224/16 , H01L2924/01078 , H01L2924/01079 , H01L2924/10158 , H01L2924/16235 , H01L2924/3025 , H01L2924/00014
摘要: A semiconductor device includes a semiconductor substrate having a first electronic circuit and a second electronic circuit formed on an active surface, a pad electrode formed on the active surface by being connected to the first electronic circuit and/or the second electronic circuit, a first opening formed to some point along a depth of the semiconductor substrate toward the pad electrode from a surface opposite to the active surface of the semiconductor substrate, a second opening formed so as to reach the pad electrode from a bottom surface of the first opening, an insulating layer formed by covering sidewall surfaces of the first opening and the second opening, a conductive layer formed by covering at least an inner wall surface of the insulating layer and a bottom surface of the second opening, a third opening formed to some point along the depth of the semiconductor substrate from the surface opposite to the active surface of the semiconductor substrate, and a heat insulator imbedded in the third opening.
摘要翻译: 半导体器件包括具有第一电子电路和形成在有源表面上的第二电子电路的半导体衬底,通过连接到第一电子电路和/或第二电子电路而形成在有源表面上的焊盘电极,第一开口 从与半导体基板的有源面相反的表面沿着半导体基板的深度朝向焊盘电极的某一点形成第二开口,从第一开口的底面到达焊盘电极,形成绝缘体 通过覆盖第一开口和第二开口的侧壁表面形成的层,通过覆盖绝缘层的至少内壁表面和第二开口的底表面形成的导电层,形成在沿着深度的某个点的第三开口 的半导体衬底从与半导体衬底的有源表面相反的表面,以及绝热体imb 在第三次开幕。
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公开(公告)号:US20120286387A1
公开(公告)日:2012-11-15
申请号:US13553389
申请日:2012-07-19
申请人: Yoshihiro Nabe , Hiroshi Asami , Yuji Takaoka , Yoshimichi Harada
发明人: Yoshihiro Nabe , Hiroshi Asami , Yuji Takaoka , Yoshimichi Harada
IPC分类号: H01L31/0224
CPC分类号: H01L27/14618 , H01L21/76898 , H01L23/481 , H01L24/05 , H01L24/13 , H01L24/16 , H01L27/14634 , H01L27/14636 , H01L31/0224 , H01L2224/02372 , H01L2224/02377 , H01L2224/0401 , H01L2224/05548 , H01L2224/05567 , H01L2224/05647 , H01L2224/1134 , H01L2224/13022 , H01L2224/13024 , H01L2224/131 , H01L2224/13144 , H01L2224/16238 , H01L2924/00014 , H01L2924/0002 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/30105 , H01L2924/351 , H01L2924/014 , H01L2224/05552 , H01L2924/00
摘要: A semiconductor device including a semiconductor substrate having oppositely facing first and second surfaces, the first surface being an active surface and provided with an electronic element thereon, a pad electrode to be connected to the electronic element in a peripheral portion of the electronic element on the active surface, a first opening extending from the second surface toward the pad electrode so as not to reach the first surface of the semiconductor substrate, a second opening formed to reach the pad electrode from a bottom surface of the first opening and having a diameter smaller than that of the first opening, an insulating layer formed to cover sidewall surfaces of the first opening and the second opening, and a conductive layer formed, inside of the insulating layer, to cover at least an inner wall surface of the insulating layer and a bottom surface of the second opening.
摘要翻译: 一种半导体器件,包括具有相对面对的第一表面和第二表面的半导体衬底,所述第一表面是活性表面,并且在其上设置有电子元件,焊接电极,用于在所述电子元件的周边部分中连接到所述电子元件, 活性表面,从第二表面朝向焊盘电极延伸以便不到达半导体衬底的第一表面的第一开口,形成为从第一开口的底表面到达焊盘电极并具有较小直径的第二开口 形成为覆盖第一开口和第二开口的侧壁表面的绝缘层和在绝缘层内部形成的导电层,以覆盖至少绝缘层的内壁表面和 第二开口的底面。
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公开(公告)号:US08252628B2
公开(公告)日:2012-08-28
申请号:US12046637
申请日:2008-03-12
申请人: Yoshihiro Nabe , Hiroshi Asami , Yuji Takaoka , Yoshimichi Harada
发明人: Yoshihiro Nabe , Hiroshi Asami , Yuji Takaoka , Yoshimichi Harada
IPC分类号: H01L21/76
CPC分类号: H01L27/14618 , H01L21/76898 , H01L23/481 , H01L24/05 , H01L24/13 , H01L24/16 , H01L27/14634 , H01L27/14636 , H01L31/0224 , H01L2224/02372 , H01L2224/02377 , H01L2224/0401 , H01L2224/05548 , H01L2224/05567 , H01L2224/05647 , H01L2224/1134 , H01L2224/13022 , H01L2224/13024 , H01L2224/131 , H01L2224/13144 , H01L2224/16238 , H01L2924/00014 , H01L2924/0002 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/30105 , H01L2924/351 , H01L2924/014 , H01L2224/05552 , H01L2924/00
摘要: A semiconductor device includes a semiconductor substrate having first and second surfaces opposite each other, the first surface being an active surface by provided with an electronic element thereon, a pad electrode formed to be connected to the electronic element in a peripheral portion of the electronic element on the active surface, a first opening extending from the second surface toward the pad electrode so as not to reach the first surface of the semiconductor substrate, a second opening, formed to reach the pad electrode from a bottom surface of the first opening, having a diameter smaller than that of the first opening, an insulating layer formed to cover sidewall surfaces of the first opening and the second opening, and a conductive layer formed, inside of the insulating layer, to cover at least an inner wall surface of the insulating layer and a bottom surface of the second opening.
摘要翻译: 半导体器件包括具有彼此相对的第一和第二表面的半导体衬底,第一表面是通过在其上设置有电子元件的有源表面,形成为在电子元件的周边部分中连接到电子元件的焊盘电极 在所述活性表面上具有从所述第二表面向所述焊盘电极延伸以便不到达所述半导体衬底的所述第一表面的第一开口,形成为从所述第一开口的底表面到达所述焊盘电极的第二开口, 直径小于第一开口的直径,形成为覆盖第一开口和第二开口的侧壁表面的绝缘层,以及形成在绝缘层内部的导电层,以至少覆盖绝缘层的内壁表面 层和第二开口的底表面。
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公开(公告)号:US20080224249A1
公开(公告)日:2008-09-18
申请号:US12046637
申请日:2008-03-12
申请人: Yoshihiro Nabe , Hiroshi Asami , Yuji Takaoka , Yoshimichi Harada
发明人: Yoshihiro Nabe , Hiroshi Asami , Yuji Takaoka , Yoshimichi Harada
IPC分类号: H01L31/0224 , H01L31/18
CPC分类号: H01L27/14618 , H01L21/76898 , H01L23/481 , H01L24/05 , H01L24/13 , H01L24/16 , H01L27/14634 , H01L27/14636 , H01L31/0224 , H01L2224/02372 , H01L2224/02377 , H01L2224/0401 , H01L2224/05548 , H01L2224/05567 , H01L2224/05647 , H01L2224/1134 , H01L2224/13022 , H01L2224/13024 , H01L2224/131 , H01L2224/13144 , H01L2224/16238 , H01L2924/00014 , H01L2924/0002 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/30105 , H01L2924/351 , H01L2924/014 , H01L2224/05552 , H01L2924/00
摘要: A semiconductor device includes a semiconductor substrate having first and second surfaces opposite each other, the first surface being an active surface by provided with an electronic element thereon, a pad electrode formed to be connected to the electronic element in a peripheral portion of the electronic element on the active surface, a first opening extending from the second surface toward the pad electrode so as not to reach the first surface of the semiconductor substrate, a second opening, formed to reach the pad electrode from a bottom surface of the first opening, having a diameter smaller than that of the first opening, an insulating layer formed to cover sidewall surfaces of the first opening and the second opening, and a conductive layer formed, inside of the insulating layer, to cover at least an inner wall surface of the insulating layer and a bottom surface of the second opening.
摘要翻译: 半导体器件包括具有彼此相对的第一和第二表面的半导体衬底,第一表面是通过在其上设置有电子元件的有源表面,形成为在电子元件的周边部分中连接到电子元件的焊盘电极 在所述活性表面上具有从所述第二表面向所述焊盘电极延伸以便不到达所述半导体衬底的所述第一表面的第一开口,形成为从所述第一开口的底表面到达所述焊盘电极的第二开口, 直径小于第一开口的直径,形成为覆盖第一开口和第二开口的侧壁表面的绝缘层,以及形成在绝缘层内部的导电层,以至少覆盖绝缘层的内壁表面 层和第二开口的底表面。
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公开(公告)号:US20100244270A1
公开(公告)日:2010-09-30
申请号:US12727804
申请日:2010-03-19
申请人: Hiroshi Asami , Masaki Hatano , Akihiro Morimoto
发明人: Hiroshi Asami , Masaki Hatano , Akihiro Morimoto
CPC分类号: H01L27/14636 , H01L21/486 , H01L23/49827 , H01L24/83 , H01L27/1464 , H01L27/1469 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/83801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/00 , H01L2924/01047 , H01L2924/01049 , H01L2924/01079 , H01L2924/01083 , H01L2224/13111 , H01L2924/00012 , H01L2224/13109 , H01L2924/00014
摘要: A semiconductor device includes: a component substrate of a semiconductor device; electrode pads provided on one surface of the component substrate; a support plate material reinforcing the component substrate; via holes made in the support plate material; a conducting material filled in the via holes; and a joining member interposed between the electrode pads and the conducting material and joining the component substrate and the support plate material.
摘要翻译: 半导体器件包括:半导体器件的元件衬底; 设置在所述部件基板的一个表面上的电极焊盘; 增强部件基板的支撑板材料; 在支撑板材料上形成的通孔; 填充在通孔中的导电材料; 以及插入在电极焊盘和导电材料之间并将部件基板和支撑板材料接合的接合部件。
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9.
公开(公告)号:US20120205817A1
公开(公告)日:2012-08-16
申请号:US13454139
申请日:2012-04-24
申请人: Hiroshi Asami , Masaki Hatano , Akihiro Morimoto
发明人: Hiroshi Asami , Masaki Hatano , Akihiro Morimoto
IPC分类号: H01L23/498
CPC分类号: H01L27/14636 , H01L21/486 , H01L23/49827 , H01L24/83 , H01L27/1464 , H01L27/1469 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/83801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/00 , H01L2924/01047 , H01L2924/01049 , H01L2924/01079 , H01L2924/01083 , H01L2224/13111 , H01L2924/00012 , H01L2224/13109 , H01L2924/00014
摘要: A semiconductor device including a component substrate of a semiconductor device; electrode pads provided on one surface of the component substrate; a support plate material reinforcing the component substrate; via holes made in the support plate material; a conducting material filled in the via holes; and a joining member interposed between the electrode pads and the conducting material and joining the component substrate and the support plate material.
摘要翻译: 一种半导体器件,包括半导体器件的元件衬底; 设置在所述部件基板的一个表面上的电极焊盘; 增强部件基板的支撑板材料; 在支撑板材料上形成的通孔; 填充在通孔中的导电材料; 以及插入在电极焊盘和导电材料之间并将部件基板和支撑板材料接合的接合部件。
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公开(公告)号:US11598977B2
公开(公告)日:2023-03-07
申请号:US16648766
申请日:2018-09-19
申请人: Hiroshi Asami , Yasunori Izawa
发明人: Hiroshi Asami , Yasunori Izawa
摘要: A lens, system for designing, computer program for designing and a method for designing, with a computer, a progressive addition lens including a distance vision region, a near vision region, and an intermediate vision region, wherein a power gradually changes between the distance vision region and the near vision region, and wherein the progressive addition lens is based on prescription data, the method including: determining a transmission astigmatic performance parameter corresponding to a sum of a prescribed astigmatism included in the prescription data and of a predetermined amount of extra astigmatism; determining lens surface data corresponding to the determined transmission performance parameter.
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