公开(公告)号：US07422338B2

公开(公告)日：2008-09-09

申请号：US11709756

申请日：2007-02-23

申请人： Hiroshi Kono ,  Masashi Ishida ,  Saiki Yamamoto

发明人： Hiroshi Kono ,  Masashi Ishida ,  Saiki Yamamoto

IPC分类号： G01D11/28 ,  H01L33/00

CPC分类号： H01L33/486 ,  H01L25/0753 ,  H01L33/60 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/01322 ,  Y10S362/80 ,  H01L2924/00

摘要： A light emitting device comprises: a light emitting element; a plurality of lead frames to which the light emitting element is electrically connected; and a package that includes in its interior at least part of said lead frames which protrude outward at one end, that is equipped with an opening for taking off light from the light emitting element, and that extends in the lengthwise direction, wherein a concave portion is formed in the outer surface of at least part of the package wall, the lead frames protruding outward from the package are accommodated in this concave portion, and the walls that constitute said opening and are across from each other in the widthwise direction of the package comprise at least a first wall that is across from the light emitting element, a second wall that is raised up by a step from the first wall, and a third wall that links the first wall and the second wall, and the second wall and third wall are formed thicker than the first wall.

摘要翻译： 发光器件包括：发光元件; 发光元件电连接的多个引线框架; 以及在其内部包括在一端向外突出的所述引线框架的至少一部分的封装，所述引线框架配备有用于从所述发光元件取出光并且沿长度方向延伸的开口，其中凹部 形成在包装壁的至少一部分的外表面上，从包装体向外突出的引线框架容纳在该凹部中，并且构成所述开口的壁在包装的宽度方向上彼此相对 至少包括从所述发光元件穿过的第一壁，从所述第一壁向上升高一级的第二壁和连接所述第一壁和所述第二壁的第三壁，以及所述第二壁和所述第三壁 壁形成比第一壁更厚。

公开(公告)号：US20070247841A1

公开(公告)日：2007-10-25

申请号：US11709756

申请日：2007-02-23

申请人： Hiroshi Kono ,  Masashi Ishida ,  Saiki Yamamoto

发明人： Hiroshi Kono ,  Masashi Ishida ,  Saiki Yamamoto

IPC分类号： F21V15/01 ,  F21V9/00

CPC分类号： H01L33/486 ,  H01L25/0753 ,  H01L33/60 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/01322 ,  Y10S362/80 ,  H01L2924/00

摘要： A light emitting device comprises: a light emitting element; a plurality of lead frames to which the light emitting element is electrically connected; and a package that includes in its interior at least part of said lead frames which protrude outward at one end, that is equipped with an opening for taking off light from the light emitting element, and that extends in the lengthwise direction, wherein a concave portion is formed in the outer surface of at least part of the package wall, the lead frames protruding outward from the package are accommodated in this concave portion, and the walls that constitute said opening and are across from each other in the widthwise direction of the package comprise at least a first wall that is across from the light emitting element, a second wall that is raised up by a step from the first wall, and a third wall that links the first wall and the second wall, and the second wall and third wall are formed thicker than the first wall.

摘要翻译： 发光器件包括：发光元件; 发光元件电连接的多个引线框架; 以及在其内部包括在一端向外突出的所述引线框架的至少一部分的封装，所述引线框架配备有用于从所述发光元件取出光并且沿长度方向延伸的开口，其中凹部 形成在包装壁的至少一部分的外表面上，从包装体向外突出的引线框架容纳在该凹部中，并且构成所述开口的壁在包装的宽度方向上彼此相对 至少包括从所述发光元件穿过的第一壁，从所述第一壁向上升高一级的第二壁和连接所述第一壁和所述第二壁的第三壁，以及所述第二壁和所述第三壁 壁形成比第一壁更厚。

公开(公告)号：US08610164B2

公开(公告)日：2013-12-17

申请号：US13665362

申请日：2012-10-31

申请人： Saiki Yamamoto

发明人： Saiki Yamamoto

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L2224/48247 ,  H01L2933/0033

摘要： A light emitting device includes a package equipped on a front face with a window for installing a light emitting element, and outer lead electrodes that protrude from a bottom face of the package. The package has, on the bottom face, two side face convex components provided on the side face sides and a center convex component provided at a center. The outer lead electrodes are housed in a concave components defined by the side face convex components and the center convex component. The side face convex component has groove provided on the side face.

摘要翻译： 发光装置包括：装配在正面上的封装，具有用于安装发光元件的窗口;以及从封装的底面突出的外引线电极。 封装在底面上具有设置在侧面侧的两个侧面凸起部件和设置在中心的中心凸起部件。 外部引线电极容纳在由侧面凸起部件和中心凸起部件限定的凹部中。 侧面凸起部分具有设置在侧面上的凹槽。

公开(公告)号：US08314442B2

公开(公告)日：2012-11-20

申请号：US12866383

申请日：2009-01-27

申请人： Saiki Yamamoto

发明人： Saiki Yamamoto

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L2224/48247 ,  H01L2933/0033

摘要： A light emitting device includes a package equipped on a front face with a window for installing a light emitting element, and outer lead electrodes that protrude from a bottom face of the package. The package has, on the bottom face, two side face convex components provided on the side face sides and a center convex component provided at a center. The outer lead electrodes are housed in a concave components defined by the side face convex components and the center convex component. The side face convex component has groove provided on the side face.

摘要翻译： 发光装置包括：装配在正面上的封装，具有用于安装发光元件的窗口;以及从封装的底面突出的外引线电极。 封装在底面上具有设置在侧面侧的两个侧面凸起部件和设置在中心的中心凸起部件。 外部引线电极容纳在由侧面凸起部件和中心凸起部件限定的凹部中。 侧面凸起部分具有设置在侧面上的凹槽。

公开(公告)号：US20100314658A1

公开(公告)日：2010-12-16

申请号：US12866383

申请日：2009-01-27

申请人： Saiki Yamamoto

发明人： Saiki Yamamoto

IPC分类号： H01L33/48

CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L2224/48247 ,  H01L2933/0033

摘要： A light emitting device includes a package equipped on a front face with a window for installing a light emitting element, and outer lead electrodes that protrude from a bottom face of the package. The package has, on the bottom face, two side face convex components provided on the side face sides and a center convex component provided at a center. The outer lead electrodes are housed in a concave components defined by the side face convex components and the center convex component. The side face convex component has groove provided on the side face.

摘要翻译： 发光装置包括：装配在正面上的封装，具有用于安装发光元件的窗口;以及从封装的底面突出的外引线电极。 封装在底面上具有设置在侧面侧的两个侧面凸起部件和设置在中心的中心凸起部件。 外部引线电极容纳在由侧面凸起部件和中心凸起部件限定的凹部中。 侧面凸起部分具有设置在侧面上的凹槽。

公开(公告)号：US20070187709A1

公开(公告)日：2007-08-16

申请号：US11700201

申请日：2007-01-31

申请人： Saiki Yamamoto

发明人： Saiki Yamamoto

IPC分类号： H01L33/00

CPC分类号： H01L33/483 ,  H01L24/97 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/01322 ,  H01L2924/12041 ,  Y10S438/973 ,  H01L2924/00 ,  H01L2924/00014

摘要： The present invention provides a semiconductor device having a structure which is suitable for reduction in thickness and weight. The semiconductor device 1 comprises a housing 12 which has the recess 24 in the front surface 14, the pair of lead electrodes 20 which have the distal ends 34 exposed in the recess 24, protrude from the external surface of the housing 12 and are bent along the bottom surface 16 of the housing 12, and a semiconductor element 36 which is housed in the recess 24 and is electrically connected to the pair of lead electrodes 20. The housing 12 has the grooves 30 which are formed on the pair of side surfaces 18 which adjoin the front surface 14 and the bottom surface 16 on the right and left sides so as to penetrate the housing 12 from the top surface 28 toward the bottom surface 16 of the housing 12. The grooves 30 preferably have width substantially equal to the thickness of the lead electrode 20. The grooves 30 are more preferably formed to be flush with the distal ends 34 of the lead electrode 20.

摘要翻译： 本发明提供了一种具有适于减小厚度和重量的结构的半导体器件。 半导体器件1包括在前表面14中具有凹部24的壳体12，具有露出在凹部24中的远端34的一对引线电极20从壳体12的外表面突出并且沿着壳体12弯曲 壳体12的底表面16和半导体元件36，其被容纳在凹部24中并且电连接到该对引线电极20。 壳体12具有形成在一对侧表面18上的凹槽30，该侧表面18在左右两侧与前表面14和底表面16相邻，从而从顶表面28朝向底表面28穿透壳体12 16个外壳12。 槽30优选地具有基本上等于引线电极20的厚度的宽度。 凹槽30更优选地形成为与引线电极20的远端34齐平。

公开(公告)号：US08198108B2

公开(公告)日：2012-06-12

申请号：US12905353

申请日：2010-10-15

申请人： Saiki Yamamoto

发明人： Saiki Yamamoto

IPC分类号： H01L21/60

CPC分类号： H01L33/483 ,  H01L24/97 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/01322 ,  H01L2924/12041 ,  Y10S438/973 ,  H01L2924/00 ,  H01L2924/00014

摘要： The semiconductor device 1 comprises a housing 12 which has a recess 24 in the front surface 1; a pair of lead electrodes 20 which have the distal ends 34 exposed in the recess 24, protrude from the external surface of the housing 12, and are bent along the bottom surface 16 of the housing 12; and a semiconductor element 36 which is housed in the recess 24 and is electrically connected to the pair of lead electrodes 20. The housing 12 has grooves 30 which are formed on the pair of side surfaces 18 which adjoin the front surface 14 and the bottom surface 16 on the right and left sides so as to penetrate the housing 12 from the top surface 28 toward the bottom surface 16 of the housing 12. The grooves 30 preferably have width substantially equal to the thickness of the lead electrode 20. The grooves 30 are more preferably formed to be flush with the distal ends 34 of the lead electrode 20.

摘要翻译： 半导体器件1包括在前表面1中具有凹部24的壳体12; 具有露出在凹部24中的前端部34的一对引线电极20从壳体12的外表面突出，并沿壳体12的底面16弯曲; 以及半导体元件36，其容纳在凹部24中并与该一对引线电极20电连接。壳体12具有形成在与前表面14相邻的一对侧面18上的槽30， 16，以便从壳体12的顶表面28朝向底表面16穿透壳体12.槽30优选地具有基本上等于引线电极20的厚度的宽度。槽30是 更优选地形成为与引线电极20的远端34齐平。

公开(公告)号：US07432589B2

公开(公告)日：2008-10-07

申请号：US11785380

申请日：2007-04-17

申请人： Saiki Yamamoto ,  Ikuya Nii ,  Hiroaki Ukawa

发明人： Saiki Yamamoto ,  Ikuya Nii ,  Hiroaki Ukawa

IPC分类号： H01L23/52

CPC分类号： H01L33/486 ,  B29C45/14639 ,  H01L23/49861 ,  H01L24/45 ,  H01L24/48 ,  H01L25/167 ,  H01L31/0203 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/48091 ,  H01L2224/48097 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48997 ,  H01L2224/73265 ,  H01L2224/85951 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： The present invention provides a semiconductor device capable of preventing an adhesive for die bonding from flowing to wire bonding area.The semiconductor device of the present invention comprises a semiconductor element 28 having a pair of electrodes, a housing 12 having the recess 14 for accommodating the semiconductor element 28, a first lead electrode 18 and the second lead electrode 20 which are exposed on the bottom of the recess 14, an adhesive layer 30 for die bonding between the semiconductor element 28 and the first lead electrode 18, and electrically conductive wires 32 for wire bonding between one electrode of the pair of electrodes of the semiconductor element and the first lead electrode 18 and between the other electrode and the second lead electrode 20, wherein the housing 12 has the wall 26 formed to extend across the bottom surface of the recess 14 so as to divide the surface of the first lead electrode 18 into a die bonding area 22 and a wire bonding area 24, and the first lead electrode 18 has the notch 36 which is formed by cutting off a portion of an edge of the first lead electrode 18 and located at least just below the wall 26, while the wall 26 and the bottom portion 40 of the housing 12 are connected to each other through the notch 36.

摘要翻译： 本发明提供一种半导体器件，其能够防止芯片接合用粘合剂流向引线接合区域。 本发明的半导体器件包括具有一对电极的半导体元件28，具有用于容纳半导体元件28的凹部14的壳体12，暴露在半导体元件28的底部的第一引线电极18和第二引线电极20 凹部14，用于半导体元件28和第一引线电极18之间的晶片接合的粘合层30，以及用于在半导体元件的一对电极的一个电极和第一引线电极18之间引线接合的导电线32，以及 在另一个电极和第二引线电极20之间，其中壳体12具有形成为延伸穿过凹部14的底表面的壁26，以便将第一引线电极18的表面分成芯片粘合区域22和 引线接合区域24，并且第一引线电极18具有切口36，其通过切除第一引线电极18的边缘的一部分而形成，并且位于 至少在壁26的下方，壳体12的壁26和底部40通过凹口36相互连接。

公开(公告)号：US20080043477A1

公开(公告)日：2008-02-21

申请号：US11826675

申请日：2007-07-17

申请人： Saiki Yamamoto ,  Hideo Asakawa

发明人： Saiki Yamamoto ,  Hideo Asakawa

IPC分类号： F21V15/01

CPC分类号： F21V15/01 ,  H01L2924/0002 ,  Y10S362/80 ,  H01L2924/00

摘要： A light emitting device, comprises: a light emitting element; a plurality of lead frames electrically connected to the light emitting element; and a package that extends in the lengthwise direction, has an opening in its front face for taking out light from the light emitting element, and makes one end of the lead frames to protrude to the outside thereof and sandwiches at least a part thereof, wherein the package has cut-outs in part of its outer surface on both sides in the lengthwise direction of the opening on the front face side, and the width of the cut-outs in the lengthwise direction increases from the rear face side toward the front face side, and the depth from the top face side toward the bottom face side increases from the rear face side toward the front face side.

摘要翻译： 发光器件，包括：发光元件; 电连接到所述发光元件的多个引线框架; 以及沿长度方向延伸的包装件，其前表面具有用于从发光元件取出的光的开口，并且使引线框架的一端突出到其外部，并将其至少一部分夹在中间，其中 该包装在其前表面侧的开口的长度方向的两侧的外表面的一部分上具有切口，并且切口在长度方向上的宽度从后表面侧朝向前表面增加 并且从顶面侧朝向底面侧的深度从背面侧向前面侧增大。

公开(公告)号：US08803182B2

公开(公告)日：2014-08-12

申请号：US12711041

申请日：2010-02-23

申请人： Saiki Yamamoto

发明人： Saiki Yamamoto

IPC分类号： H01L33/48

CPC分类号： H01L25/167 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12032 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： To provide a light emitting device that is compact and has high efficiency of extracting light comprising a support body that incorporates a light emitting element.The light emitting device has the protective element 106 mounted on the electrically conductive member 103a and the base 105 mounted on the electrically conductive member 103a, while at least part of the protective element 106 is covered with the base 105, and the light emitting element 104 is mounted on the top surface of the base 105.

摘要翻译： 提供一种紧凑的发光装置，并且具有提取光的高效率，其包括包含发光元件的支撑体。 发光装置具有安装在导电构件103a上的保护元件106和安装在导电构件103a上的基座105，而保护元件106的至少一部分被基座105覆盖，并且发光元件104 安装在基座105的顶面上。