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公开(公告)号:US5172402A
公开(公告)日:1992-12-15
申请号:US666649
申请日:1991-03-08
申请人: Nobutoshi Mizusawa , Ryuichi Ebinuma , Hiroshi Kurosawa , Koji Uda , Takao Kariya , Shunichi Uzawa
发明人: Nobutoshi Mizusawa , Ryuichi Ebinuma , Hiroshi Kurosawa , Koji Uda , Takao Kariya , Shunichi Uzawa
IPC分类号: G03F7/20
CPC分类号: G03F7/70008 , G03F7/702
摘要: An exposure method for manufacture of semiconductor devices, includes moving a shutter having an edge so that the edge is related to a predetermined exposure region; projecting an exposure beam to the edge of the shutter and to at least a portion of the exposure region; determining a position of a shadow of the edge of the shutter formed by the exposure beam with respect to a predetermined coordinate system related to movement of a movable chuck; adjusting the shutter in accordance with the determination; placing a substrate on the chuck; moving the chuck so that the substrate is related to the exposure region; and controlling the exposure of the substrate with the exposure beam through the shutter.
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公开(公告)号:US5577552A
公开(公告)日:1996-11-26
申请号:US412101
申请日:1995-03-28
申请人: Ryuichi Ebinuma , Takao Kariya , Nobutoshi Mizusawa , Koji Uda , Eiji Sakamoto , Shunichi Uzawa
发明人: Ryuichi Ebinuma , Takao Kariya , Nobutoshi Mizusawa , Koji Uda , Eiji Sakamoto , Shunichi Uzawa
CPC分类号: H05K7/20281 , G03F7/707 , G03F7/70875 , G05D23/1919
摘要: A temperature controlling device suitably usable in a semiconductor microcircuit manufacturing exposure apparatus exposes a semiconductor wafer to a mask to print a pattern of the mask on the wafer. The device includes a constant-temperature liquid medium supplying system for controlling temperature of a liquid at high precision, a distributing system for distributing the supplied liquid medium into plural flow passages, to supply the liquid medium to plural subjects of control such as, for example, a mask stage, a wafer stage and the like. The device further includes a plurality of temperature controls each being provided in corresponding one of the flow passages, for correction of any variance in temperature of the distributed liquid medium, resulting from pressure loss energies in the respective flow passages. Thus, temperatures of plural subjects of control can be controlled efficiently and with a simple structure.
摘要翻译: 可适用于半导体微电路制造曝光装置的温度控制装置将半导体晶片暴露于掩模,以将掩模的图案印刷在晶片上。 该装置包括用于高精度地控制液体的温度的恒温液体介质供给系统,用于将供应的液体介质分配到多个流动通道中的分配系统,以将液体介质供应到多个控制对象,例如 ,掩模台,晶片台等。 该装置还包括多个温度控制装置,每个温度控制装置设置在对应的一个流动通道中,用于校正由相应流动通道中的压力损失能量产生的分配液体介质的温度变化。 因此,能够以简单的结构有效地控制多个控制对象的温度。
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公开(公告)号:US5157700A
公开(公告)日:1992-10-20
申请号:US401615
申请日:1989-08-31
申请人: Hiroshi Kurosawa , Mitsuaki Amemiya , Shigeru Terashima , Koji Uda , Isamu Shimoda , Shunichi Uzawa , Kunitaka Ozawa , Makiko Mori , Ryuichi Ebinuma , Shinichi Hara , Nobutoshi Mizusawa , Eigo Kawakami
发明人: Hiroshi Kurosawa , Mitsuaki Amemiya , Shigeru Terashima , Koji Uda , Isamu Shimoda , Shunichi Uzawa , Kunitaka Ozawa , Makiko Mori , Ryuichi Ebinuma , Shinichi Hara , Nobutoshi Mizusawa , Eigo Kawakami
IPC分类号: G03F7/20
CPC分类号: G03F7/70691 , G03F7/70058 , G03F7/70091 , G03F7/702
摘要: An exposure apparatus usable with synchrotron radiation source wherein the synchrotron radiation is generated by electron injection into a ring. The exposure apparatus is to transfer a semiconductor element pattern of a mask onto a semiconductor wafer by the synchrotron radiation. The apparatus includes a shutter for controlling the exposure of the wafer. The shutter controls the exposure with the illuminance distribution on the wafer surface taken into account. The illuminance distribution is determined in response to the electron injection, and thereafter, the illuminance distribution is corrected in a predetermined manner. By this, the illuminance distribution data for controlling the shutter always correspond to the actual illuminance distribution. The entire shot areas of the semiconductor wafer are exposed with high precision.
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公开(公告)号:US5377251A
公开(公告)日:1994-12-27
申请号:US203498
申请日:1994-02-28
申请人: Nobutoshi Mizusawa , Ryuichi Ebinuma , Hiroshi Kurosawa , Koji Uda , Takao Kariya , Shumichi Uzawa
发明人: Nobutoshi Mizusawa , Ryuichi Ebinuma , Hiroshi Kurosawa , Koji Uda , Takao Kariya , Shumichi Uzawa
CPC分类号: G03F7/70008 , G03F7/702
摘要: An exposure method for manufacture of semiconductor devices, includes moving a shutter having an edge so that the edge is related to a predetermined exposure region; projecting an exposure beam to the edge of the shutter and to at least a portion of the exposure region; determining a position of a shadow of the edge of the shutter formed by the exposure beam with respect to a predetermined coordinate system related to movement of a movable chuck; adjusting the shutter in accordance with the determination; placing a substrate on the chuck; moving the chuck so that the substrate is related to the exposure region; and controlling the exposure of the substrate with the exposure beam through the shutter.
摘要翻译: 一种用于制造半导体器件的曝光方法,包括移动具有边缘的快门,使得边缘与预定曝光区域相关; 将曝光光束投影到所述光闸的边缘和所述曝光区域的至少一部分; 确定由曝光光束形成的快门的边缘相对于与可移动卡盘移动有关的预定坐标系的位置; 根据确定调整快门; 将基板放置在卡盘上; 移动卡盘使得基板与曝光区域相关; 以及通过所述快门控制所述基板与曝光光束的曝光。
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公开(公告)号:US5182615A
公开(公告)日:1993-01-26
申请号:US563420
申请日:1990-08-07
申请人: Hiroshi Kurosawa , Koji Uda , Kunitaka Ozawa , Shunichi Uzawa , Nobutoshi Mizusawa , Shigeyuki Suda , Noriyuki Nose , Takao Kariya
发明人: Hiroshi Kurosawa , Koji Uda , Kunitaka Ozawa , Shunichi Uzawa , Nobutoshi Mizusawa , Shigeyuki Suda , Noriyuki Nose , Takao Kariya
CPC分类号: G03F7/70691 , G03F9/7049
摘要: An exposure apparatus for printing a pattern of a mask to a wafer includes a mask moving mechanism for moving the mask; a wafer moving mechanism or moving the wafer along a predetermined movement coordinate; a measuring system for measuring an error with respect to the movement coordinate, resulting from the movement of the mask by the mask moving mechanism; and a memorizing device for memorizing a data table prepared on the basis of the error measured by the measuring system; wherein the wafer moving mechanism uses the data in the data table when it moves the wafer for positioning of the wafer with respect to the mask.
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公开(公告)号:US5277539A
公开(公告)日:1994-01-11
申请号:US58791
申请日:1993-05-10
IPC分类号: G03F7/20 , H01L21/677 , H01L21/68 , B65G47/24
CPC分类号: G03F7/70691 , H01L21/67766 , H01L21/67778 , H01L21/68
摘要: A substrate conveying apparatus usable with a semiconductor manufacturing apparatus wherein a pattern of a mask is transferred onto a semiconductor wafer by exposing the semiconductor wafer to synchrotron orbital radiation or other exposure energy through a mask. The conveying apparatus transfers the semiconductor wafer to and from a wafer chuck while the surface thereof extends vertically, and/or transfers the wafer to and from a wafer cassette which contains a plurality of wafers horizontally. The apparatus includes a conveying hand having a gimbal mechanism for supporting the semiconductor wafer to assure the semiconductor wafer transfer to and from the wafer chuck while the wafer is vertical. When the semiconductor wafer is transferred to and from a wafer cassette, the apparatus is provided with a correcting mechanism for correcting the attitude of the conveying hand to prevent the semiconductor wafer from contacting the wafer cassette.
摘要翻译: 一种可用于半导体制造装置的基板输送装置,其中通过将半导体晶片暴露于同步加速器轨道辐射或通过掩模的其他曝光能量将掩模的图案转印到半导体晶片上。 输送装置将晶片卡盘的表面向垂直方向延伸和/或从晶片卡盘传送半导体晶片,和/或将晶片从包含多个晶片的晶片盒水平地传送到晶片盒。 该装置包括具有用于支撑半导体晶片的万向架机构的传送手,以确保半导体晶片在晶片垂直时传送到晶片卡盘。 当将半导体晶片转移到晶片盒或从晶片盒转移时,该装置设置有校正机构,用于校正传送手的姿态以防止半导体晶片接触晶片盒。
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公开(公告)号:US5524131A
公开(公告)日:1996-06-04
申请号:US441641
申请日:1995-05-15
申请人: Shunichi Uzawa , Takao Kariya , Makoto Higomura , Nobutoshi Mizusawa , Ryuichi Ebinuma , Kohji Uda , Kunitaka Ozawa , Mitsuaki Amemiya , Eiji Sakamoto , Naoto Abe , Kenji Saitoh
发明人: Shunichi Uzawa , Takao Kariya , Makoto Higomura , Nobutoshi Mizusawa , Ryuichi Ebinuma , Kohji Uda , Kunitaka Ozawa , Mitsuaki Amemiya , Eiji Sakamoto , Naoto Abe , Kenji Saitoh
IPC分类号: G21K1/06 , G03F7/20 , G03F9/00 , G21K5/02 , G21K5/04 , G21K5/10 , H01L21/027 , H01L21/30 , H05H13/04 , G21K5/00
CPC分类号: G03F7/70008 , G03F7/702 , G03F7/70691 , G03F7/70741 , G03F7/70841 , G03F7/70866 , G03F7/70975 , G03F9/70 , G21K1/06
摘要: A semiconductor device manufacturing SOR X-ray exposure apparatus wherein, after a mask and a semiconductor wafer are aligned, and SOR X-ray is used to transfer a semiconductor device pattern on the mask onto a resist on the semiconductor wafer. The apparatus includes a mirror unit and an exposure unit for exposing the wafer through the mask to the X-ray from the mirror unit. The mirror unit includes an X-ray mirror for diverging the X-ray in a desired direction, a first chamber for providing a desired vacuum ambience around the X-ray mirror and a first supporting device for supplying the X-ray mirror. The exposure unit includes a shutter for controlling the exposure, a mask stage for holding the mask, a wafer stage for holding the wafer, a second chamber for providing a desired He ambience around the mask stage and the wafer stage, a frame structure for mounting the mask stage and the wafer stage and a second supporting device for supporting the frame structure. By this, a more highly integrated semiconductor device can be produced.
摘要翻译: 一种制造SOR X射线曝光装置的半导体器件,其中在掩模和半导体晶片对准之后,使用SOR X射线将掩模上的半导体器件图案转印到半导体晶片上的抗蚀剂上。 该装置包括反射镜单元和曝光单元,用于将晶片通过掩模曝光到来自反射镜单元的X射线。 镜单元包括用于沿所需方向分散X射线的X射线镜,用于在X射线反射镜周围提供期望的真空环境的第一腔室和用于供给X射线镜的第一支撑装置。 曝光单元包括用于控制曝光的快门,用于保持掩模的掩模台,用于保持晶片的晶片台,用于在掩模台和晶片台周围提供期望的He环境的第二室,用于安装的框架结构 掩模台和晶片台以及用于支撑框架结构的第二支撑装置。 由此,可以制造更高度集成的半导体器件。
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公开(公告)号:US5390227A
公开(公告)日:1995-02-14
申请号:US062151
申请日:1993-05-17
CPC分类号: G03F7/70066 , G03F7/702 , G03F7/70858 , G03F7/70875
摘要: An exposure apparatus for exposing a semiconductor wafer to a semiconductor device pattern formed in a mask. The exposure energy is, for example, X-rays contains in synchrotron orbit radiation. A blade for limiting the area irradiated with the exposure energy on a mask or wafer is integrally movable in an alignment detecting unit for detecting the alignment mark. Four of such blades are provided to provide a square exposure area. The blades are movable independently by the associated alignment detecting units. Each of the blades is finely movable relative to the associated alignment detecting unit. The shape or size or the like of the blade is determined in consideration of the position of the blade in the direction of the exposure energy irradiation, and the maximum and minimum exposure view angle. The blade is cooled. The exposure area can be changed highly accurately and efficiently with a simple structure.
摘要翻译: 一种用于将半导体晶片暴露于形成在掩模中的半导体器件图案的曝光装置。 曝光能量例如是X射线含有同步加速器轨道辐射。 用于将在曝光能量上照射的面积限制在掩模或晶片上的刀片可在用于检测对准标记的对准检测单元中一体地移动。 提供四个这样的刀片以提供方形曝光区域。 叶片可通过相关联的对准检测单元独立地移动。 每个叶片相对于相关联的对准检测单元精细地移动。 考虑到叶片在曝光能量照射方向上的位置以及最大和最小曝光视角来确定叶片的形状或尺寸等。 刀片冷却。 曝光区域可以用简单的结构高精度高效地进行改变。
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公开(公告)号:US5317615A
公开(公告)日:1994-05-31
申请号:US987554
申请日:1992-12-08
申请人: Ryuichi Ebinuma , Nobutoshi Mizusawa , Takao Kariya , Shigeyuki Suda , Shunichi Uzawa , Takayuki Hasegawa
发明人: Ryuichi Ebinuma , Nobutoshi Mizusawa , Takao Kariya , Shigeyuki Suda , Shunichi Uzawa , Takayuki Hasegawa
CPC分类号: G03F7/70066 , G03F7/70858 , G03F7/70891 , G03F9/70
摘要: An exposure apparatus and method for exposing a workpiece to a pattern of an original with radiation includes a masking device having movable blades for variably defining an aperture to selectively block and transmit the radiation to define on the workpiece a desired exposure zone corresponding to the aperture, the masking device having a window, and a detector for detecting the positional deviation between the original and the workpiece by using light passing through the window of the masking device.
摘要翻译: 一种用于将工件暴露于具有辐射的原稿图案的曝光装置和方法包括:具有可动刀片的掩模装置,用于可变地限定孔径以选择性地阻挡和透射辐射,以在工件上限定对应于孔的期望曝光区域, 具有窗口的掩蔽装置和用于通过使用穿过掩蔽装置的窗口的光检测原件和工件之间的位置偏差的检测器。
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公开(公告)号:US5168512A
公开(公告)日:1992-12-01
申请号:US668238
申请日:1991-03-12
IPC分类号: G03F7/20 , G21K1/02 , H01L21/027
CPC分类号: G03F7/702 , G03F7/2039 , G03F7/70691 , G03F7/70808 , G21K1/025 , H01L21/0278
摘要: A method for the manufacture of semiconductor devices wherein a radiation beam including first and second beams is projected from a synchrotron orbit radiation source into an ambience maintained substantially at a vacuum, includes the steps of directing the radiation beam to a wafer through a window effective to isolate the ambience to thereby print a circuit pattern on an X-ray sensitive layer on the wafer with the first beam, providing a support for supporting the window having an opening, extracting the second beam through the opening, and detecting and correcting any deviation of the first beam with respect to the wafer.
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