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公开(公告)号:US06679950B2
公开(公告)日:2004-01-20
申请号:US09892742
申请日:2001-06-28
IPC分类号: B08B300
CPC分类号: H01L21/67046 , B01F3/04099 , B01F3/0446 , B01F5/0476 , B01F2003/0439 , B01F2003/04886 , B01F2201/01 , B08B1/00 , B08B1/04 , B08B3/02 , Y10S134/902
摘要: A substrate cleaning method of the present invention enables effective cleaning of a wafer having a recess therein without causing any increase in cleaning costs. Ozone gas and ammonia water are supplied to an area right above a wafer 7 having a recess therein, and a gas-dissolving liquid is produced by dissolving the ozone gas in the ammonia water. The gas-dissolving liquid is used to carry out contact and non-contact types of physical cleaning on the wafer.
摘要翻译: 本发明的基板清洗方法能够有效地清洗其中具有凹槽的晶片,而不会导致清洁成本的任何增加。 将臭氧气体和氨水供给到其中具有凹部的晶片7的正上方的区域,并且通过将臭氧气体溶解在氨水中来制造气体溶解液。 气溶液用于在晶片上进行接触和非接触式的物理清洁。
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公开(公告)号:US06543080B1
公开(公告)日:2003-04-08
申请号:US09635848
申请日:2000-08-11
申请人: Hiroshi Tomita , Soichi Nadahara , Mitsuhiko Shirakashi , Kenya Ito , Yuki Inoue
发明人: Hiroshi Tomita , Soichi Nadahara , Mitsuhiko Shirakashi , Kenya Ito , Yuki Inoue
IPC分类号: B08B312
CPC分类号: B08B3/12
摘要: A semiconductor substrate cleaning apparatus and method are capable of efficiently removing contamination from both the obverse and reverse sides of a semiconductor substrate. A single cleaning liquid supply nozzle for supplying a cleaning liquid to both the obverse and reverse sides of a semiconductor substrate to be cleaned is placed at a distance from the outer peripheral edge of the substrate. An ultrasonic vibrator applies ultrasonic waves to both the obverse and reverse sides of the substrate. Four driving rollers are disposed in contact with the outer peripheral edge of the substrate. The driving rollers are adapte to rotate while being engaged with the outer peripheral edge of the substrate thereby drivingly rotating the substrate.
摘要翻译: 半导体衬底清洁装置和方法能够有效地去除半导体衬底的正面和反面两侧的污染物。 将待清洗的半导体衬底的正面和反面两侧的清洗液供给单个清洗液供给喷嘴设置在与衬底的外周边缘一定距离处。 超声波振动器对基板的正反面施加超声波。 四个驱动辊设置成与基板的外周边缘接触。 驱动辊适于旋转,同时与基板的外周边缘接合,从而驱动旋转基板。
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公开(公告)号:US07055535B2
公开(公告)日:2006-06-06
申请号:US10629678
申请日:2003-07-30
申请人: Junji Kunisawa , Norio Kimura , Kenya Ito , Akira Fukunaga , Yuuki Inoue , Hiroshi Tomita , Soichi Nadahara , Motoyuki Sato
发明人: Junji Kunisawa , Norio Kimura , Kenya Ito , Akira Fukunaga , Yuuki Inoue , Hiroshi Tomita , Soichi Nadahara , Motoyuki Sato
IPC分类号: B08B3/08 , B25B11/00 , H01L21/306
CPC分类号: H01L21/6838 , Y10S134/902 , Y10T279/11
摘要: A holding unit holds a substrate to enable a surface of the substrate to be processed. The unit has a vacuum suction member that comes into contact with a peripheral portion of the surface of the substrate and sucks the substrate. A processing apparatus holds the wafer stably and allows an edge, a bevel portion and/or a back surface of the wafer to be processed.
摘要翻译: 保持单元保持基板以使得能够处理基板的表面。 该单元具有与基板的表面的周边部分接触并吸附基板的真空吸附构件。 处理装置稳定地保持晶片,并且允许晶片的边缘,斜面部分和/或背面被处理。
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公开(公告)号:US20080200100A1
公开(公告)日:2008-08-21
申请号:US11630512
申请日:2006-04-18
申请人: Tamami Takahashi , Mitsuhiko Shirakashi , Kenya Ito , Kazuyuki Inoue , Kenji Yamaguchi , Masaya Seki
发明人: Tamami Takahashi , Mitsuhiko Shirakashi , Kenya Ito , Kazuyuki Inoue , Kenji Yamaguchi , Masaya Seki
IPC分类号: B24B9/06 , H01L21/304 , B24B49/12
CPC分类号: H01L21/67219 , B24B9/065 , B24B49/04 , H01L21/302 , H01L21/461 , H01L21/67253 , H01L21/68707 , H01L21/68728
摘要: A substrate processing apparatus (1) includes first and second polishing units (70A, 70B) for polishing a peripheral portion of a substrate (W), a primary cleaning unit (100) for cleaning the substrate (W), a secondary cleaning and drying unit (110) for drying the substrate (W) cleaned in the primary cleaning unit (100), and a measurement unit (30) for measuring the peripheral portion of the substrate (W). The measurement unit (30) includes a mechanism for measurement required for polishing in the first and second polishing units (70A and 70B), such as a diameter measurement mechanism, a cross-sectional shape measurement mechanism, or a surface condition measurement mechanism.
摘要翻译: 一种基板处理装置(1)包括:用于研磨基板周边部分的第一和第二研磨单元(70A,70B);用于清洗基板(W)的主清洁单元(100),二次清洗 以及用于干燥在主清洗单元(100)中清洁的基板(W)的干燥单元(110),以及用于测量基板(W)的周边部分的测量单元(30)。 测量单元(30)包括用于在第一和第二研磨单元(70A和70B)中抛光所需的测量机构,例如直径测量机构,横截面形状测量机构或表面状态测量机构 。
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公开(公告)号:US06494220B1
公开(公告)日:2002-12-17
申请号:US09584091
申请日:2000-05-31
申请人: Naoki Matsuda , Kenya Ito , Mitsuhiko Shirakashi
发明人: Naoki Matsuda , Kenya Ito , Mitsuhiko Shirakashi
IPC分类号: B08B304
CPC分类号: H01L21/67051 , B08B1/04 , B08B3/02 , Y10S134/902
摘要: A cleaning apparatus comprises a holder for holding a substrate such as a semiconductor wafer horizontally and rotating the substrate about its central axis, while conducting a cleaning operation of the substrate by supplying a cleaning liquid thereto. The apparatus further comprises a cleaning vessel including a side wall encircling the substrate rotated by the holder to intercept the cleaning liquid supplied to and scattered from the rotating substrate and then finally drain the cleaning liquid. There is provided a vent duct for carrying gas from the inside of the cleaning vessel to the outside of the same. The vent duct includes an inlet provided at substantially the same level as that of the substrate for introducing the gas into the vent duct. The side wall may include an inner surface along which the cleaning liquid scattered from the substrate flows downward in a spiral manner, with the inner surface, being of a construction which impedes the spiral movement of the liquid in a circumferential or peripheral direction.
摘要翻译: 清洁装置包括用于水平地保持诸如半导体晶片的基板并且使基板围绕其中心轴旋转的保持器,同时通过向其提供清洁液体进行清洁操作。 该装置还包括一个清洁容器,该清洁容器包括围绕由保持器旋转的基板的侧壁,以拦截供应到旋转基板并从旋转基板散射的清洗液体,然后最终排出清洗液体。 设置有用于将气体从清洁容器的内部输送到其外部的通风管道。 排气管道包括与基板基本相同的水平设置的入口,用于将气体引入通风管道。 侧壁可以包括内表面,从衬底散射的清洁液体沿着内表面以螺旋方式向下流动,内表面具有阻止液体在周向或周向上的螺旋运动的结构。
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公开(公告)号:US20090017733A1
公开(公告)日:2009-01-15
申请号:US11629463
申请日:2006-04-18
申请人: Tamami Takahashi , Mitsuhiko Shirakashi , Kenya Ito , Kazuyuki Inoue , Kenji Yamaguchi , Masaya Seki
发明人: Tamami Takahashi , Mitsuhiko Shirakashi , Kenya Ito , Kazuyuki Inoue , Kenji Yamaguchi , Masaya Seki
IPC分类号: B24B9/00
CPC分类号: B24B21/16 , B24B9/065 , H01L21/67046 , H01L21/67092 , H01L21/67161 , H01L21/6719 , H01L21/67219 , H01L21/67766 , H01L21/68707 , H01L21/68728 , H01L21/68792
摘要: A substrate processing apparatus (1) has a first polishing unit (400A) and a second polishing unit (400B) for polishing a peripheral portion of a substrate. Each of the two polishing units (400A, 400B) includes a bevel polishing device (450A, 450B) for polishing a peripheral portion of a substrate and a notch polishing device (480A, 480B) for polishing a notch of a substrate. The substrate processing apparatus (1) has a maintenance space (7) formed between the two polishing units (400A, 400B). The bevel polishing devices (450A, 450B) in the two polishing units (400A, 400B) face the maintenance space (7) so as to be accessible from the maintenance space (7).
摘要翻译: 基板处理装置(1)具有用于研磨基板周边部分的第一研磨单元(400A)和第二研磨单元(400B)。 两个抛光单元(400A,400B)中的每一个包括用于抛光基板的周边部分的斜面抛光装置(450A,450B)和用于抛光基板的凹口的凹口抛光装置(480A,480B)。 基板处理装置(1)具有形成在两个研磨单元(400A,400B)之间的维护空间(7)。 两个抛光单元(400A,400B)中的斜面抛光装置(450A,450B)面向维护空间(7),以便从维护空间(7)进入。
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公开(公告)号:US20050242064A1
公开(公告)日:2005-11-03
申请号:US11177279
申请日:2005-07-11
申请人: Takayuki Saito , Tsukuru Suzuki , Yuji Makita , Kaoru Yamada , Mitsuhiko Shirakashi , Kenya Ito
发明人: Takayuki Saito , Tsukuru Suzuki , Yuji Makita , Kaoru Yamada , Mitsuhiko Shirakashi , Kenya Ito
IPC分类号: C25D17/00 , H01L21/00 , H01L21/304 , H01L21/306 , B44C1/22
CPC分类号: H01L21/6708 , H01L21/67051
摘要: A substrate processing apparatus comprises roll chucks for holding and rotating a substrate, a closable chamber housing the roll chucks therein, and a gas introduction pipe for introducing a gas into the chamber. The substrate processing apparatus further comprises an etching unit for etching and cleaning a peripheral portion of the substrate while the substrate is being rotated by the roll chucks, and a first supply passage for supplying a first liquid to the etching unit.
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公开(公告)号:US06932884B2
公开(公告)日:2005-08-23
申请号:US10233467
申请日:2002-09-04
申请人: Takayuki Saito , Tsukuru Suzuki , Yuji Makita , Kaoru Yamada , Mitsuhiko Shirakashi , Kenya Ito
发明人: Takayuki Saito , Tsukuru Suzuki , Yuji Makita , Kaoru Yamada , Mitsuhiko Shirakashi , Kenya Ito
IPC分类号: C25D17/00 , H01L21/00 , H01L21/304 , H01L21/306 , C23F1/00 , A47L15/00 , A47L25/00
CPC分类号: H01L21/6708 , H01L21/67051
摘要: A substrate processing apparatus comprises roll chucks for holding and rotating a substrate, a closable chamber housing the roll chucks therein, and a gas introduction pipe for introducing a gas into the chamber. The substrate processing apparatus further comprises an etching unit for etching and cleaning a peripheral portion of the substrate while the substrate is being rotated by the roll chucks, and a first supply passage for supplying a first liquid to the etching unit.
摘要翻译: 基板处理装置包括用于保持和旋转基板的辊卡盘,容纳辊卡盘的可关闭的腔室,以及用于将气体引入腔室的气体引入管。 基板处理装置还包括蚀刻单元,用于在基板被辊卡盘旋转的同时蚀刻和清洁基板的周边部分,以及用于向蚀刻单元供应第一液体的第一供给通道。
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公开(公告)号:US06308361B1
公开(公告)日:2001-10-30
申请号:US09361244
申请日:1999-07-27
申请人: Naoki Matsuda , Kenya Ito , Mitsuhiko Shirakashi
发明人: Naoki Matsuda , Kenya Ito , Mitsuhiko Shirakashi
IPC分类号: B08B104
CPC分类号: H01L21/67051 , B08B1/00 , B08B3/024 , H01L21/67046
摘要: A cleaning apparatus is suitable for cleaning workpieces that require a high degree of cleanliness, such as semiconductor wafers, glass substrates, or liquid crystal displays. The cleaning apparatus has a holding device for holding the substrate and a cleaning unit capable of slidably contacting the surface of the substrate. The cleaning unit has a nozzle for ejecting high-pressure cleaning liquid onto the substrate, and a cleaning member surrounding the nozzle.
摘要翻译: 清洁装置适用于清洁需要高度清洁度的工件,例如半导体晶片,玻璃基板或液晶显示器。 清洁装置具有用于保持基板的保持装置和能够与基板的表面滑动接触的清洁单元。 清洁单元具有用于将高压清洗液喷射到基板上的喷嘴和围绕喷嘴的清洁部件。
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公开(公告)号:US09287158B2
公开(公告)日:2016-03-15
申请号:US11630512
申请日:2006-04-18
申请人: Tamami Takahashi , Mitsuhiko Shirakashi , Kenya Ito , Kazuyuki Inoue , Kenji Yamaguchi , Masaya Seki
发明人: Tamami Takahashi , Mitsuhiko Shirakashi , Kenya Ito , Kazuyuki Inoue , Kenji Yamaguchi , Masaya Seki
IPC分类号: B44C1/22 , C03C15/00 , C03C25/68 , H01L21/302 , H01L21/461 , H01L21/687 , B24B9/06 , B24B49/04 , H01L21/67
CPC分类号: H01L21/67219 , B24B9/065 , B24B49/04 , H01L21/302 , H01L21/461 , H01L21/67253 , H01L21/68707 , H01L21/68728
摘要: A substrate processing apparatus includes first and second polishing units for polishing a peripheral portion of a substrate, a primary cleaning unit for cleaning the substrate, a secondary cleaning and drying unit for drying the substrate cleaned in the primary cleaning unit, and a measurement unit for measuring the peripheral portion of the substrate. The measurement unit includes a mechanism for measurement required for polishing in the first and second polishing units, such as a diameter measurement mechanism, a cross-sectional shape measurement mechanism, or a surface condition measurement mechanism.
摘要翻译: 基板处理装置包括:第一抛光单元,用于抛光基板周边部分;第一清洗单元,用于清洁基板;二次清洁和干燥单元,用于干燥在主清洗单元中清洁的基板;以及测量单元, 测量衬底的周边部分。 测量单元包括用于在第一和第二抛光单元中抛光所需的测量机构,例如直径测量机构,横截面形状测量机构或表面状态测量机构。
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