摘要:
A boron nitride inclusion sheet is applied on the surface of a mold package enclosing a semiconductor chip so as to prevent soft error caused by a thermal neutron.
摘要:
Same test data is written into corresponding memory cells of each subarray of a memory cell array to be read out. A comparing and determining circuit determines whether the data read out from each memory cell has the same logic or not, and the data proves defective when any one of the data has different logic. An output of the comparing and determining circuit is stored in a register to be externally outputted through a predetermined pin (e.g. output enable pin). Timing in which the register accepts the data stored in the comparing and determining circuit is controlled by a switching controlling signal generating circuit disposed in a semiconductor memory device. As the above, all signals necessary for a test are generated in the semiconductor memory device, and the test result is outputted through an existing pin, so that it is structured by the same number of pins as that of a standard semiconductor memory device without a testing function.
摘要:
An output buffer circuit comprises a NAND circuit and a NOR circuit each receiving an output a of a signal source and an output b of an output control circuit and an output driving circuit formed by a p channel MOS transistor and an n channel MOS transistor receiving outputs of the NAND circuit and the NOR circuit. Large output capacitance is connected to an output of the output driving circuit. The n channel MOS transistor is connected between the output of the NOR circuit and a ground potential, and has its gate receiving the output of the output driving circuit. When the output of the output driving circuit is at an "H" level, the rise of the output of the NOR circuit is controlled, so that the output of the output driving circuit is first changed to the "L" level slowly. Therefore, discharge current from the output capacitance rises slowly. However, since transconductance of the n channel MOS transistor in the output driving circuit is set large, the output of the output driving circuit falls rapidly from halfway.
摘要:
Memory cells which are adjacent to each other along a column direction share a bipolar transistor driving the potential level of a corresponding bit line. Other memory cells which are adjacent to each other in the column direction share another bipolar transistor driving the potential level of another corresponding bit line. Each bipolar transistor drives the potential level of the corresponding bit line in response to storage information of a selected memory cell, whereby data can be read at a high speed with a low power supply voltage.
摘要:
A semiconductor memory device having a circuit for preventing the operation of a test mode includes a first terminal for receiving an externally applied high voltage exceeding a power supply potential, a second terminal for receiving an externally applied test mode signal and a high voltage detector for detecting that a high voltage signal has been applied through the first terminal. A test mode signal holding circuit is responsive to the high voltage detector and holds the test mode signal applied through the second terminal. A test circuit is responsive to the test mode signal held in the test mode signal holding circuit and performs a test in the semiconductor memory device. A disabling circuit is provided to disable the high voltage detector.
摘要:
An output buffer is connected to a first power supply line and a first ground line, and a strobe buffer is connected to a second power supply line and a second ground line. The first power supply line is connected to a first pad, the first ground line is connected to a second pad, the second power supply line is connected to a third pad, and the second ground line is connected to a fourth pad, respectively. The first and second power supply lines are not connected inside the chip, and the first and second ground lines are not connected inside the chip. The first and third pads are separately connected to the respective lead terminals, and the second and fourth pads are separately connected to the respective lead terminals.
摘要:
A memory cell data is read/written to a memory cell by utilizing the base current of a bipolar transistor having its emitter coupled to a bit line. When activated, a bit line precharge circuit precharges the bit line to a level of a built-in voltage between the emitter and the base of the memory cell bipolar transistor. When bit lines in a pair are lowered in potential from the H level to the L level, the base electrode node potential of the bipolar transistor is never changed to a negative potential by capacitance coupling, and conduction of an access transistor and destruction of memory cell data are prevented. A semiconductor memory device is implemented which does not cause data destruction and can stably operate at high speed even under a low power supply voltage.
摘要:
A memory cell includes two bipolar transistors. An upper side word line is connected to the gates of one access transistor and one depletion type transistor in the memory cell. A lower side word line is connected to the gates of the other access transistor and the other depletion type transistor in the memory cell. In data write operation, the potential on the upper side word line is set to "H" level for a prescribed period and the potential on the lower side word line is thereafter set to "H" level for a prescribed period, regardless of the type of data. As a result, a circuit related to row decoding can be simplified since a circuit for determining the type of data is not necessary in the circuit related to row decoding.
摘要:
When a pre-shipment test of a SRAM is requested, a pulse signal PL having a pulse width exceeding a predetermined time length is applied through a terminal 62. A pulse width detecting circuit 80 detects the pulse width of the applied pulse signal to provide a holding signal HD. A test mode signal holding circuit 90 holds an externally applied test mode request signal TM' in response to the holding signal HD. After the completion of the pre-shipment test, pulse width detecting circuit 80 is disabled by a fusion of a fuse 71. Fuse 71 is fused after the pre-shipment test is conducted, whereby the test mode operation is prevented from undesirably occurring.