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    METHOD FOR PRODUCING PLASMA DISPLAY PANEL
    1.
    发明申请
    METHOD FOR PRODUCING PLASMA DISPLAY PANEL 审中-公开
    生产等离子显示面板的方法

    公开(公告)号：US20110171871A1

    公开(公告)日：2011-07-14

    申请号：US13004361

    申请日：2011-01-11

    申请人： Hiroyoshi Sekiguchi ,  Yasuhiro Asaida ,  Takayuki Ashida ,  Tomohiro Okumura

    发明人： Hiroyoshi Sekiguchi ,  Yasuhiro Asaida ,  Takayuki Ashida ,  Tomohiro Okumura

    IPC分类号： H01J9/20

    CPC分类号： H01J9/38 ,  H01J9/261 ,  H01J11/12

    摘要： A method for producing a plasma display panel includes: (i) providing a front panel and a rear panel, the front panel being a panel wherein an electrode A, a dielectric layer A and a protective layer are formed on a substrate A, and the rear panel being a panel wherein an electrode B, a dielectric layer B, a barrier rib and a phosphor layer are formed on a substrate B; (ii) supplying a glass frit material onto a peripheral region of the substrate A or B to form a glass frit sealing member; (iii) opposing the front and rear panels with each other such that the glass frit sealing member is interposed therebetween; and (iv) heating the opposed front and rear panels to reach a softening point of the glass frit sealing member or a higher temperature than the softening point, while supplying a cleaning gas into a space formed between the opposed front and rear panels. Prior to the heating of step (iv), a gas is introduced into a space formed between the opposed front and rear panels, or a gas is exhausted from a space formed between the opposed front and rear panels.

    摘要翻译： 一种等离子体显示面板的制造方法包括：（i）提供前面板和后面板，前面板是在基板A上形成有电极A，电介质层A和保护层的面板， 后面板是在基板B上形成电极B，电介质层B，隔壁和荧光体层的面板; （ii）将玻璃料材料供应到基板A或B的周边区域上以形成玻璃料密封件; （iii）使所述前面板和所述后面板彼此相对，使得所述玻璃料密封构件插入其间; 以及（iv）将相对的前后板加热到达玻璃料密封件的软化点或比软化点高的温度，同时将清洁气体供应到形成在相对的前板和后板之间的空间中。 在步骤（iv）的加热之前，将气体引入形成在相对的前后面板之间的空间中，或者从形成在相对的前后面板之间的空间排出气体。

    Method for producing plasma display panel
    2.
    发明授权
    Method for producing plasma display panel 失效
    等离子体显示面板的制造方法

    公开(公告)号：US08113899B2

    公开(公告)日：2012-02-14

    申请号：US12502369

    申请日：2009-07-14

    申请人： Tomohiro Okumura ,  Ryuichi Murai ,  Takahiro Takisawa ,  Hiroyoshi Sekiguchi ,  Takayuki Ashida ,  Yoshihiro Sakaguchi

    发明人： Tomohiro Okumura ,  Ryuichi Murai ,  Takahiro Takisawa ,  Hiroyoshi Sekiguchi ,  Takayuki Ashida ,  Yoshihiro Sakaguchi

    IPC分类号： H01J9/24

    CPC分类号： H01J11/12 ,  H01J9/261

    摘要： A method for producing a plasma display panel, the method comprising the steps of: (i) preparing a front panel and a rear panel, the front panel being a panel wherein an electrode A, a dielectric layer A and a protective layer are formed on a substrate A, and the rear panel being a panel wherein an electrode B, a dielectric layer B, a partition wall and a phosphor layer are formed on a substrate B; (ii) applying a glass frit material onto a peripheral region of the substrate A or B, and then opposing the front and rear panels with each other such that the glass frit material is interposed therebetween; (iii) supplying a gas into a space formed between the opposed front and rear panels from a direction lateral to the opposed front and rear panels, under such a condition that the front and rear panels are heated; and (iv) melting the glass frit material to cause the front and rear panels to be sealed.

    摘要翻译： 一种等离子体显示面板的制造方法，其特征在于，包括以下步骤：（i）前面板和后面板的制作，前面板为面板，其中，电极A，电介质层A和保护层形成在 基板A，后面板是在基板B上形成电极B，电介质层B，分隔壁和荧光体层的面板; （ii）将玻璃料材料施加到基板A或B的周边区域上，然后使前后板彼此相对，使得玻璃料材料插入其间; （iii）在前后板被加热的条件下，从相对的前板和后板的横向方向将气体供给到形成在相对的前板和后板之间的空间中; 和（iv）熔化玻璃料材料以使前面板和后面板被密封。

    METHOD FOR PRODUCING PLASMA DISPLAY PANEL
    3.
    发明申请
    METHOD FOR PRODUCING PLASMA DISPLAY PANEL 失效
    生产等离子显示面板的方法

    公开(公告)号：US20100015877A1

    公开(公告)日：2010-01-21

    申请号：US12502369

    申请日：2009-07-14

    申请人： Tomohiro Okumura ,  Ryuichi Murai ,  Takahiro Takisawa ,  Hiroyoshi Sekiguchi ,  Takayuki Ashida ,  Yoshihiro Sakaguchi

    发明人： Tomohiro Okumura ,  Ryuichi Murai ,  Takahiro Takisawa ,  Hiroyoshi Sekiguchi ,  Takayuki Ashida ,  Yoshihiro Sakaguchi

    IPC分类号： H01J9/26

    CPC分类号： H01J11/12 ,  H01J9/261

    摘要： A method for producing a plasma display panel, the method comprising the steps of: (i) preparing a front panel and a rear panel, the front panel being a panel wherein an electrode A, a dielectric layer A and a protective layer are formed on a substrate A, and the rear panel being a panel wherein an electrode B, a dielectric layer B, a partition wall and a phosphor layer are formed on a substrate B; (ii) applying a glass frit material onto a peripheral region of the substrate A or B, and then opposing the front and rear panels with each other such that the glass frit material is interposed therebetween; (iii) supplying a gas into a space formed between the opposed front and rear panels from a direction lateral to the opposed front and rear panels, under such a condition that the front and rear panels are heated; and (iv) melting the glass frit material to cause the front and rear panels to be sealed.

    摘要翻译： 一种等离子体显示面板的制造方法，其特征在于，包括以下步骤：（i）前面板和后面板的制作，前面板为面板，其中，电极A，电介质层A和保护层形成在 基板A，后面板是在基板B上形成电极B，电介质层B，分隔壁和荧光体层的面板; （ii）将玻璃料材料施加到基板A或B的周边区域上，然后使前后板彼此相对，使得玻璃料材料插入其间; （iii）在前后板被加热的条件下，从相对的前板和后板的横向方向将气体供给到形成在相对的前板和后板之间的空间中; 和（iv）熔化玻璃料材料以使前面板和后面板被密封。

    Circuit board packaging structure
    4.
    发明授权
    Circuit board packaging structure 失效
    电路板封装结构

    公开(公告)号：US06388879B1

    公开(公告)日：2002-05-14

    申请号：US08387046

    申请日：1995-02-09

    申请人： Hiroyuki Otaguro ,  Takayuki Ashida ,  Hitoshi Yokemura ,  Hidenao Nakajima ,  Yoshimi Watanabe ,  Shuuhei Fujita

    发明人： Hiroyuki Otaguro ,  Takayuki Ashida ,  Hitoshi Yokemura ,  Hidenao Nakajima ,  Yoshimi Watanabe ,  Shuuhei Fujita

    IPC分类号： H05K720

    CPC分类号： H05K7/1458 ,  G02B6/43

    摘要： A circuit board packaging structure comprises a plurality of circuit boards disposed in parallel to each other and each packaged with electric circuit parts. The circuit board packaged with electric circuit parts exhibiting a larger exothermic quantity than those of the electric circuit parts packaged on the other circuit boards is disposed outermost among the plurality of circuit boards. The surface of the circuit board packed with the electric circuit parts exhibiting the larger exothermic quantity is directed outside the structure.

    摘要翻译： 一种电路板封装结构，包括彼此并联设置的多个电路板，并且每个电路板与电路部件一起封装。 与多个电路基板中包含的电路部件相比，具有比放电量大的电路部件的电路板设置在多个电路基板的最外侧。 填充有显示较大放热量的电路部件的电路板的表面指向结构外部。

    Multilayered circuit board design support method, program, and apparatus, and multilayered circuit board
    5.
    发明申请
    Multilayered circuit board design support method, program, and apparatus, and multilayered circuit board 有权
    多层电路板设计支持方法，程序和装置以及多层电路板

    公开(公告)号：US20070079276A1

    公开(公告)日：2007-04-05

    申请号：US11311655

    申请日：2005-12-20

    申请人： Takayuki Ashida ,  Kenichirou Tsubone

    发明人： Takayuki Ashida ,  Kenichirou Tsubone

    IPC分类号： G06F17/50

    CPC分类号： H05K3/0005 ,  G06F17/5081 ,  H05K1/0201 ,  H05K1/116 ,  H05K3/429 ,  H05K2201/062 ,  H05K2201/0969

    摘要： A multilayered board data input unit inputs design data of a multilayered circuit board provided with through holes penetrating and mutually connecting solid-layer conductors disposed in a multilayer manner. A limitation rule setting unit sets a limitation rule for limiting the number of solid-layer conductors to be connected to the through holes. A separation processing unit separates connections of the solid-layer conductors to the through holes in the design data based on the limitation rule. At this time, when a solid-layer conductor to be separated from the through holes is selected as a candidate, the separation processing unit determines whether the solid-layer conductor is isolated by separation, when the solid-layer conductor is not isolated, determines isolation, and when the solid-layer conductor is isolated, stops separation.

    摘要翻译： 多层板数据输入单元输入设置有穿透并相互连接以多层方式布置的固体层导体的通孔的多层电路板的设计数据。 限制规则设定单元设定用于限制要连接到通孔的固体导体的数量的限制规则。 分离处理单元基于限制规则将设计数据中的固体导体与通孔的连接分离。 此时，当选择与通孔分离的固体层导体作为候选时，分离处理单元通过分离确定固体层导体是否被隔离，当固体层导体未被隔离时，确定 隔离，当固体层导体隔离时，停止分离。

    Multilayered circuit board design support method, program, and apparatus for suppressing thermal diffusion from solid-layer conductor to through hole
    6.
    发明授权
    Multilayered circuit board design support method, program, and apparatus for suppressing thermal diffusion from solid-layer conductor to through hole 有权
    用于抑制从固体导体到通孔的热扩散的多层电路板设计支持方法，程序和装置

    公开(公告)号：US07703064B2

    公开(公告)日：2010-04-20

    申请号：US11311655

    申请日：2005-12-20

    申请人： Takayuki Ashida ,  Kenichirou Tsubone

    发明人： Takayuki Ashida ,  Kenichirou Tsubone

    IPC分类号： G06F17/50 ,  H03K17/693 ,  H05K1/00 ,  H05K1/11

    CPC分类号： H05K3/0005 ,  G06F17/5081 ,  H05K1/0201 ,  H05K1/116 ,  H05K3/429 ,  H05K2201/062 ,  H05K2201/0969

    摘要： A multilayered board data input unit inputs design data of a multilayered circuit board provided with through holes penetrating and mutually connecting solid-layer conductors disposed in a multilayer manner. A limitation rule setting unit sets a limitation rule for limiting the number of solid-layer conductors to be connected to the through holes. A separation processing unit separates connections of the solid-layer conductors to the through holes in the design data based on the limitation rule. At this time, when a solid-layer conductor to be separated from the through holes is selected as a candidate, the separation processing unit determines whether the solid-layer conductor is isolated by separation, when the solid-layer conductor is not isolated, determines isolation, and when the solid-layer conductor is isolated, stops separation.

    摘要翻译： 多层板数据输入单元输入设置有穿透并相互连接以多层方式布置的固体层导体的通孔的多层电路板的设计数据。 限制规则设定单元设定用于限制要连接到通孔的固体导体的数量的限制规则。 分离处理单元基于限制规则将设计数据中的固体导体与通孔的连接分离。 此时，当选择与通孔分离的固体层导体作为候选时，分离处理单元通过分离确定固体层导体是否被隔离，当固体层导体未被隔离时，确定 隔离，当固体层导体隔离时，停止分离。

    Electronic device with heat radiation members
    10.
    发明授权
    Electronic device with heat radiation members 失效
    具有散热构件的电子设备

    公开(公告)号：US6067230A

    公开(公告)日：2000-05-23

    申请号：US188716

    申请日：1998-11-10

    申请人： Takayuki Ashida ,  Katsunori Kuroki ,  Takayoshi Tanemura

    发明人： Takayuki Ashida ,  Katsunori Kuroki ,  Takayoshi Tanemura

    IPC分类号： H01L23/40 ,  H05K7/20

    CPC分类号： H05K7/20509

    摘要： An electronic device including a circuit part having a semiconductor chip. The device includes a first heat radiation member kept in contact with the circuit part for radiating the heat generated by the circuit part, a second heat radiation member, and an intermediate member 32. Fins of the intermediate member are fitted in or on the fins of the first heat radiation member, and the base portion of the intermediate member is coupled to the base portion of the second heat radiation member. Therefore, the second heat radiation member can be conveniently added to the first heat radiation member via the intermediate member.

    摘要翻译： 一种电子设备，包括具有半导体芯片的电路部分。 该装置包括与电路部分保持接触的第一散热构件，用于辐射由电路部分产生的热量，第二散热构件和中间构件32.中间构件的叶片装配在 第一散热构件和中间构件的基部联接到第二散热构件的基部。 因此，第二散热构件可以经由中间构件方便地添加到第一散热构件。