公开(公告)号：US5668247A

公开(公告)日：1997-09-16

申请号：US167024

申请日：1993-12-16

申请人： Hiroyuki Furutani ,  Kazuhisa Danno ,  Yoshifumi Okamoto ,  Junya Ida ,  Yoshihide Oonari ,  Hitoshi Nojiri ,  Hirosaku Nagano

发明人： Hiroyuki Furutani ,  Kazuhisa Danno ,  Yoshifumi Okamoto ,  Junya Ida ,  Yoshihide Oonari ,  Hitoshi Nojiri ,  Hirosaku Nagano

IPC分类号： B32B15/08 ,  B32B27/36 ,  C08G69/44 ,  C08G73/10 ,  C08G73/16 ,  C08J5/18 ,  C09D179/08

CPC分类号： C08J5/18 ,  B32B15/08 ,  C08G73/1042 ,  C08G73/16 ,  C08J2379/08 ,  Y10T428/31504 ,  Y10T428/31721

摘要： The invention provides novel thermoplastic polyimide featuring solid adhesive property under low temperature, low hygroscopic coefficient, and solid resistivity to radioactive rays. The invention also provides novel polyamide acid which is substantially precursor of the thermoplastic polyimide, and also provides novel thermally fusible laminated film for covering conductive wires, featuring solid adhesive property under low temperature, solid resistivity to radioactive rays, and distinct suitability for covering superconductive wires in particular.The novel thermoplastic polyimide is represented by general formula (1) corresponding to the chemical structure shown below; ##STR1## wherein, Ar.sub.1, Ar.sub.2, Ar.sub.4, and Ar.sub.6, respectively designate divalent organic radical, whereas Ar.sub.3 and Ar.sub.5 respectively designate quadrivalent organic radical, wherein, 1, m, and n, respectively designate positive integer 0 to 1 or more than 1, wherein the sum of 1 and m aggregates 1 or more than 1, and wherein t designates positive integer of 1 or more than 1.

摘要翻译： 本发明提供了新型热塑性聚酰亚胺，其在低温下具有固体粘合性，低吸湿系数和对放射线的固体电阻率。 本发明还提供了基本上是热塑性聚酰亚胺前体的新型聚酰胺酸，并且还提供了用于覆盖导电线的新型热熔性层压膜，其特征在于在低温下具有固体粘合性，对放射线具有固体电阻率，并且具有明显的适用于覆盖超导线 尤其是。 新型热塑性聚酰亚胺由对应于下述化学结构的通式（1）表示; 其中，Ar1，Ar2，Ar4和Ar6分别表示二价有机基团，Ar3和Ar5分别表示四价有机基团，其中，1，m和n分别表示 正整数0至1或大于1，其中1和m的和聚合1或大于1，其中t表示1或大于1的正整数。

公开(公告)号：US5621068A

公开(公告)日：1997-04-15

申请号：US381890

申请日：1995-02-22

申请人： Yoshifumi Okamoto ,  Hiroyuki Furutani ,  Kazuhisa Danno ,  Junya Ida ,  Hirosaku Nagano

发明人： Yoshifumi Okamoto ,  Hiroyuki Furutani ,  Kazuhisa Danno ,  Junya Ida ,  Hirosaku Nagano

IPC分类号： B32B15/08 ,  C08G73/10 ,  C08L79/08 ,  C09J179/08 ,  H05K1/03 ,  H05K3/28 ,  H05K3/38

CPC分类号： C08G73/1042 ,  B32B15/08 ,  C09J179/08 ,  C08L79/08 ,  H05K1/0346 ,  H05K3/281 ,  H05K3/386 ,  Y10S428/901 ,  Y10T428/31504 ,  Y10T428/31674 ,  Y10T428/31721

摘要： A thermoplastic polyimide film comprising a thermoplastic polyimide polymer, a polyimide laminate, respectively being suited for use as cover-lay adhesive agent and a cover-lay film capable of exerting distinguished thermal resistant property, processability and adhesion property useful for the manufacture of flexible printed circuit boards, and yet, suited for use as the adhesive-agent layers of flexible copper-coated laminates and bilateral adhesive sheets; and a method of manufacturing the polyimide laminate. The thermoplastic polyimide polymer represented by the general formula (1) specified below: ##STR1## wherein Ar.sub.1, Ar.sub.2, Ar.sub.4 and Ar.sub.6, represents divalent organic radical, whereas Ar.sub.3 and Ar.sub.5 represent quadrivalent organic radical, wherein l, m amd n designate positive integer of 0 to 15, wherein the sum of 1 and m is 1 or more than 1, and wherein t designates positive integer of 1 or more than 1.

摘要翻译： PCT No.PCT / JP94 / 01286 Sec。 371日期1995年2月22日 102（e）日期1995年2月22日PCT 1994年8月3日PCT PCT。 第WO95 / 04100号公报 日期1995年2月9日一种热塑性聚酰亚胺薄膜，其包含热塑性聚酰亚胺聚合物，聚酰亚胺层压材料，分别适合用作覆盖层粘合剂和覆盖层，其能够发挥显着的耐热性，加工性和粘附性， 柔性印刷电路板的制造，并且适用于柔性铜包覆层压板和双面粘合片的粘合剂层; 和聚酰亚胺层叠体的制造方法。 由下述通式（1）表示的热塑性聚酰亚胺聚合物：其中Ar1，Ar2，Ar4和Ar6表示二价有机基团，Ar 3和Ar 5表示四价有机基团 其中l，m amd n表示0〜15的正整数，其中1和m的和为1或大于1，其中t表示1或大于1的正整数。

公开(公告)号：US5932345A

公开(公告)日：1999-08-03

申请号：US714072

申请日：1996-09-10

申请人： Hiroyuki Furutani ,  Naoki Hase ,  Junya Ida ,  Yoshifumi Okamoto ,  Hitoshi Nojiri ,  Shinji Inoue ,  Hirosaku Nagano

发明人： Hiroyuki Furutani ,  Naoki Hase ,  Junya Ida ,  Yoshifumi Okamoto ,  Hitoshi Nojiri ,  Shinji Inoue ,  Hirosaku Nagano

IPC分类号： C08G73/10 ,  C08G73/16 ,  C08J5/18 ,  C09J179/08 ,  H01G4/18 ,  H01L23/29 ,  H01L23/49 ,  H05K1/03 ,  D02G3/00

CPC分类号： H01L23/293 ,  C08G73/1042 ,  C08G73/105 ,  C08G73/1089 ,  C08G73/16 ,  C08J5/18 ,  C09J179/08 ,  H01G4/18 ,  C08J2379/08 ,  H01L2224/16 ,  H01L2224/32245 ,  H01L2224/432 ,  H01L2224/451 ,  H01L2224/45572 ,  H01L2224/45599 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01058 ,  H01L2924/07802 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H05K1/0346

摘要： A novel heat-fusible copolymer possessing a combination of excellent properties, including mechanical strength, resistivity against radioactive rays, chemical resistance, low temperature stability, thermal resistance, processabilty, adhesiveness, thermal fusible adhesive stability, and simultaneously satisfying requirements relating to low hygroscopic characteristic and stable dielectric constant. Also, a powder, film, laminated film, laminated insulating material, and article, such as electronic modules and capacitors, made from a thermoplastic polyimide resin composed mainly of the copolymer and suitable for use as electronic components and materials for electronic circuit components. The copolymer possesses a glass transition temperature of 100.degree. C. to 250.degree. C., a hygroscopic degree of 1 or less, and a dielectric rate of 3 or less, and has the following formula: ##STR1## wherein Ar.sub.1 represents a quadrivalent organic radical, Ar.sub.2 represents a divalent organic radial, R represents a divalent organic radical, X represents trivalent bonding radicals, m and n are each integers of 0 or more, the sum of m and n being an integer of 1 or more, and 1 is an integer of 1 or more.

摘要翻译： PCT No.PCT / JP96 / 00049 Sec。 371日期：1996年9月10日 102（e）1996年9月10日PCT PCT 1996年1月11日PCT公布。 WO96 / 21693 PCT出版物 日期1996年7月18日新型热熔共聚物具有机械强度，放射线电阻率，耐化学性，低温稳定性，耐热性，可加工性，粘合性，热熔粘合剂稳定性等优异性能的组合，同时满足要求 涉及低吸湿特性和稳定的介电常数。 另外，由主要由共聚物构成的热塑性聚酰亚胺树脂制成的适合用作电子电路部件的电子部件和材料的粉末，薄膜，层压薄膜，层叠绝缘材料，以及电子模块和电容器等制品。 共聚物的玻璃化转变温度为100〜250℃，吸湿度为1以下，介电速度为3以下，具有下式：其中Ar 1表示四价有机基团，Ar 2 表示二价有机径向，R表示二价有机基团，X表示三价键键合基团，m和n各自为0以上的整数，m和n的和为1以上的整数，1为 1个或更多。

公开(公告)号：US5167985A

公开(公告)日：1992-12-01

申请号：US614483

申请日：1990-11-16

申请人： Hiroshi Ito ,  Hirosaku Nagano ,  Hiroyuki Furutani ,  Hitoshi Nojiri

发明人： Hiroshi Ito ,  Hirosaku Nagano ,  Hiroyuki Furutani ,  Hitoshi Nojiri

IPC分类号： B32B15/088 ,  B05D5/12 ,  C08G73/10 ,  C08L79/08 ,  C09D179/08 ,  H05K1/03

CPC分类号： H05K1/0346 ,  C08G73/1007 ,  C08G73/1071

摘要： A process for producing a flexible printed circuit board comprising a metallic foil and a polyimide is provided, which comprises coating a metallic foil with a resin solution prepared by adding a tertiary amino compound to a solution of a polyamic acid (a polyimide precursor) represented by the following general formula (I): ##STR1## followed by the imidization thereof, the amount of said tertiary amino compound added to the solution being 10 to 50 parts by weight per 100 parts by weight of solid polyamic acid contained in said resin solution. According to the present invention, a flexible printed circuit board which is free from curling, wrinkling and warping, and which has excellent heat resistance, electrical characteristics and mechanical properties is provided with a simplified production process.

公开(公告)号：US4742099A

公开(公告)日：1988-05-03

申请号：US936524

申请日：1986-12-01

申请人： Hirosaku Nagano ,  Junji Takase ,  Hideki Kawai ,  Hitoshi Nojiri ,  Tsuneo Yamamoto

发明人： Hirosaku Nagano ,  Junji Takase ,  Hideki Kawai ,  Hitoshi Nojiri ,  Tsuneo Yamamoto

IPC分类号： C08J5/18 ,  C08K3/24 ,  C08K5/00 ,  C08K5/04 ,  C08K5/42 ,  C08K5/52 ,  C08L79/08

CPC分类号： C08J5/18 ,  C08K5/0091 ,  C08J2379/08

摘要： A new polyimide film which contains 30 to 800 ppm of titanium based on the weight of the film, and a process for producing a new polyimide film which comprises introducing an organic titanium compound substance into the film-forming polyimide resin prior to the casting step. This process enables one to control the film surface forming process and improve directly the adhesive properties of the film.

摘要翻译： 一种新的聚酰亚胺薄膜，其包含基于薄膜重量的30至800ppm的钛，以及一种新的聚酰亚胺薄膜的制造方法，其包括在铸造步骤之前将有机钛化合物引入成膜聚酰亚胺树脂中。 该方法使得能够控制膜表面形成过程并直接改善膜的粘合性能。

公开(公告)号：US07011905B2

公开(公告)日：2006-03-14

申请号：US11003598

申请日：2004-12-06

申请人： Shigeru Sakamoto ,  Hiroko Sanda ,  Hirosaku Nagano ,  Hidekazu Kuromatsu ,  Kiyoyuki Namura

发明人： Shigeru Sakamoto ,  Hiroko Sanda ,  Hirosaku Nagano ,  Hidekazu Kuromatsu ,  Kiyoyuki Namura

IPC分类号： H01M8/10

CPC分类号： H01M8/1004 ,  H01B1/122 ,  H01M8/1023 ,  H01M8/1032 ,  H01M8/1039 ,  H01M8/1053 ,  H01M2300/0082 ,  H01M2300/0094 ,  Y10T29/49108 ,  Y10T29/49112 ,  Y10T29/49114 ,  Y10T29/49115 ,  Y10T29/53135

摘要： A solid polymer electrolyte membrane and a catalytic layer are properly assembled even when the solid polymer electrolyte membrane and an ion exchange resin in the catalytic layer are formed of different materials. In a fuel cell, a solid polymer electrolyte membrane 20 is provided with a first solid polymer electrolyte membrane 200, and second solid polymer electrolyte membranes 202 and 204 provided at respective sides thereof. The second solid polymer electrolyte membranes 202 and 204 are formed of the same material as the ion exchange resin (not shown) included in a catalytic layer 26 and a catalytic layer 30.

摘要翻译： 即使固体高分子电解质膜和催化剂层中的离子交换树脂由不同的材料形成，也能够适当地组装固体高分子电解质膜和催化剂层。 在燃料电池中，固体高分子电解质膜20设置有第一固体聚合物电解质膜200和设置在其各自侧的第二固体聚合物电解质膜202和204。 第二固体聚合物电解质膜202和204由与催化剂层26和催化剂层30中所包含的离子交换树脂（未示出）相同的材料形成。

公开(公告)号：US5665802A

公开(公告)日：1997-09-09

申请号：US711072

申请日：1996-09-09

申请人： Haruhiko Maki ,  Hirosaku Nagano ,  Yoshiaki Inaba

发明人： Haruhiko Maki ,  Hirosaku Nagano ,  Yoshiaki Inaba

IPC分类号： C08J5/18 ,  C08K5/49 ,  C08L79/08 ,  H05K1/03 ,  C08K5/523 ,  C08K5/521 ,  C08K5/53

CPC分类号： C08J5/18 ,  C08K5/49 ,  H05K1/0346 ,  C08J2379/08 ,  H05K1/0373 ,  Y10T428/31721

摘要： The present invention provides an improved grade of polyimide containing an organic phosphorus compound, a film composed thereof and a method of making the aforementioned film. According to the present invention, it is possible to obtain a polyimide film improved in mechanical strength.

摘要翻译： 本发明提供一种改进的含有有机磷化合物的聚酰亚胺等，其组成的膜和制备上述膜的方法。 根据本发明，可以获得提高机械强度的聚酰亚胺膜。

公开(公告)号：US5081229A

公开(公告)日：1992-01-14

申请号：US362793

申请日：1989-06-07

申请人： Kiyokazu Akahori ,  Hideki Kawai ,  Hirosaku Nagano

发明人： Kiyokazu Akahori ,  Hideki Kawai ,  Hirosaku Nagano

IPC分类号： C08G73/10 ,  H05K1/03

CPC分类号： C08G73/1071 ,  C08G73/1042 ,  C08G73/1067 ,  H05K1/0346

摘要： The present invention provides a copolyimide characterized in that the copolyimide contains units represented by formulas (I) and (II) ##STR1## (wherein R.sub.0 represents an aromatic tetracarboxylic residue). The polyimide has excellent thermal dimensional stability, and can be fabricated by using conventional inexpensive materials.

公开(公告)号：US4451621A

公开(公告)日：1984-05-29

申请号：US452432

申请日：1982-12-23

申请人： Kazuya Yonezawa ,  Kazuaki Kira ,  Hiroshi Wakabayashi ,  Hirosaku Nagano

发明人： Kazuya Yonezawa ,  Kazuaki Kira ,  Hiroshi Wakabayashi ,  Hirosaku Nagano

IPC分类号： C08F299/00 ,  C08F290/00 ,  C08F299/02 ,  C08G73/00 ,  C08G73/14 ,  H01B3/30 ,  H05K1/03 ,  C08G73/10

CPC分类号： C08G73/14 ,  H01B3/305 ,  H01B3/306 ,  H05K1/0346

摘要： A heat resistant resin composition comprising a, polyamide imide resin having carboxyl groups and modified with an N-methylolated methacryl- or acryl- amide compound and, when desired, further with a bismaleimide compound. The composition has improved properties over conventional polyamide imide resins. When the composition is used, for example, in the form of a film for printed circuit boards, the film has improved heat resistance and enhanced flexural strength and is capable of withstanding soldering baths at high temperatures.

公开(公告)号：US5861192A

公开(公告)日：1999-01-19

申请号：US690975

申请日：1996-08-01

申请人： Masao Nakata ,  Kosuke Kataoka ,  Hirosaku Nagano

发明人： Masao Nakata ,  Kosuke Kataoka ,  Hirosaku Nagano

IPC分类号： C08J7/00 ,  B05D3/08 ,  B05D3/10 ,  B05D3/12 ,  B29C59/00 ,  B29C59/02 ,  B29C59/08 ,  B29C71/00 ,  C08J7/02 ,  C08J7/12 ,  H05K1/03 ,  H05K3/38 ,  B05D3/00

CPC分类号： C08J7/12 ,  B05D3/08 ,  B05D3/101 ,  B05D3/12 ,  B29C59/005 ,  B29C59/02 ,  B29C59/08 ,  B29C71/0009 ,  H05K3/381 ,  B29C2059/027 ,  B29C2791/001 ,  B29K2079/08 ,  C08J2379/08 ,  H05K1/0346

摘要： The invention solves a problem of that sufficient adhesive intensity to satisfy recent demand for high adhesive property cannot be obtained by conventional surface treatment, and provides a method of improving adhesive property of polyimide film and achieving distinctly improved effect of adhesive property. The invention further provides novel polyimide film having improved adhesive property.A method for improving adhesive property of polyimide film according to the present invention comprises a combination of steps of;execution of a liquid applying process for treating polyimide film surface by exerting physical mechanical force on said film surface under the condition of that said film surface remains wet with water or organic solvent, or solution of organic solvent or aqueous solution; and execution of a surface treatment process for treating polyimide film surface by performing selected treatment among flame treatment, alkaline treatment, coupling agent treatment or surface treatment by way of projecting grinding material of fine grading onto film surface at high velocity, and said steps are performed in an arbitrary order. For example, using a surface treating device 10 shown in FIG. 1, consecutive execution of a surface treatment process for treating film surface, a liquid applying process and a drying process is realized by that polyimide film 22 is run from a feeding device 18 to a winding device 20.

摘要翻译： 本发明解决了通过常规的表面处理不能获得足够的粘合强度以满足最近对高粘合性能的要求的问题，并且提供了改进聚酰亚胺膜的粘合性能并且显着提高粘合性能的效果的方法。 本发明还提供了具有改进的粘合性能的新型聚酰亚胺膜。 根据本发明的改进聚酰亚胺薄膜的粘合性的方法包括以下步骤的组合： 执行用于在所述膜表面保持用水或有机溶剂润湿的条件下或在有机溶剂或水溶液的溶液的条件下在所述膜表面上施加物理机械力来处理聚酰亚胺膜表面的液体施加过程; 并且通过在火焰处理，碱处理，偶联剂处理或表面处理中进行选择的处理，通过以高速投影细微分级的研磨材料到薄膜表面上来执行用于处理聚酰亚胺膜表面的表面处理工艺，并且执行所述步骤 以任意顺序。 例如，使用图1所示的表面处理装置10， 如图1所示，通过聚酰亚胺膜22从供给装置18向卷绕装置20运行，连续执行用于处理膜表面的表面处理工艺，液体施加处理和干燥处理。