公开(公告)号：US5668247A

公开(公告)日：1997-09-16

申请号：US167024

申请日：1993-12-16

申请人： Hiroyuki Furutani ,  Kazuhisa Danno ,  Yoshifumi Okamoto ,  Junya Ida ,  Yoshihide Oonari ,  Hitoshi Nojiri ,  Hirosaku Nagano

发明人： Hiroyuki Furutani ,  Kazuhisa Danno ,  Yoshifumi Okamoto ,  Junya Ida ,  Yoshihide Oonari ,  Hitoshi Nojiri ,  Hirosaku Nagano

IPC分类号： B32B15/08 ,  B32B27/36 ,  C08G69/44 ,  C08G73/10 ,  C08G73/16 ,  C08J5/18 ,  C09D179/08

CPC分类号： C08J5/18 ,  B32B15/08 ,  C08G73/1042 ,  C08G73/16 ,  C08J2379/08 ,  Y10T428/31504 ,  Y10T428/31721

摘要： The invention provides novel thermoplastic polyimide featuring solid adhesive property under low temperature, low hygroscopic coefficient, and solid resistivity to radioactive rays. The invention also provides novel polyamide acid which is substantially precursor of the thermoplastic polyimide, and also provides novel thermally fusible laminated film for covering conductive wires, featuring solid adhesive property under low temperature, solid resistivity to radioactive rays, and distinct suitability for covering superconductive wires in particular.The novel thermoplastic polyimide is represented by general formula (1) corresponding to the chemical structure shown below; ##STR1## wherein, Ar.sub.1, Ar.sub.2, Ar.sub.4, and Ar.sub.6, respectively designate divalent organic radical, whereas Ar.sub.3 and Ar.sub.5 respectively designate quadrivalent organic radical, wherein, 1, m, and n, respectively designate positive integer 0 to 1 or more than 1, wherein the sum of 1 and m aggregates 1 or more than 1, and wherein t designates positive integer of 1 or more than 1.

摘要翻译： 本发明提供了新型热塑性聚酰亚胺，其在低温下具有固体粘合性，低吸湿系数和对放射线的固体电阻率。 本发明还提供了基本上是热塑性聚酰亚胺前体的新型聚酰胺酸，并且还提供了用于覆盖导电线的新型热熔性层压膜，其特征在于在低温下具有固体粘合性，对放射线具有固体电阻率，并且具有明显的适用于覆盖超导线 尤其是。 新型热塑性聚酰亚胺由对应于下述化学结构的通式（1）表示; 其中，Ar1，Ar2，Ar4和Ar6分别表示二价有机基团，Ar3和Ar5分别表示四价有机基团，其中，1，m和n分别表示 正整数0至1或大于1，其中1和m的和聚合1或大于1，其中t表示1或大于1的正整数。

公开(公告)号：US5621068A

公开(公告)日：1997-04-15

申请号：US381890

申请日：1995-02-22

申请人： Yoshifumi Okamoto ,  Hiroyuki Furutani ,  Kazuhisa Danno ,  Junya Ida ,  Hirosaku Nagano

发明人： Yoshifumi Okamoto ,  Hiroyuki Furutani ,  Kazuhisa Danno ,  Junya Ida ,  Hirosaku Nagano

IPC分类号： B32B15/08 ,  C08G73/10 ,  C08L79/08 ,  C09J179/08 ,  H05K1/03 ,  H05K3/28 ,  H05K3/38

CPC分类号： C08G73/1042 ,  B32B15/08 ,  C09J179/08 ,  C08L79/08 ,  H05K1/0346 ,  H05K3/281 ,  H05K3/386 ,  Y10S428/901 ,  Y10T428/31504 ,  Y10T428/31674 ,  Y10T428/31721

摘要： A thermoplastic polyimide film comprising a thermoplastic polyimide polymer, a polyimide laminate, respectively being suited for use as cover-lay adhesive agent and a cover-lay film capable of exerting distinguished thermal resistant property, processability and adhesion property useful for the manufacture of flexible printed circuit boards, and yet, suited for use as the adhesive-agent layers of flexible copper-coated laminates and bilateral adhesive sheets; and a method of manufacturing the polyimide laminate. The thermoplastic polyimide polymer represented by the general formula (1) specified below: ##STR1## wherein Ar.sub.1, Ar.sub.2, Ar.sub.4 and Ar.sub.6, represents divalent organic radical, whereas Ar.sub.3 and Ar.sub.5 represent quadrivalent organic radical, wherein l, m amd n designate positive integer of 0 to 15, wherein the sum of 1 and m is 1 or more than 1, and wherein t designates positive integer of 1 or more than 1.

摘要翻译： PCT No.PCT / JP94 / 01286 Sec。 371日期1995年2月22日 102（e）日期1995年2月22日PCT 1994年8月3日PCT PCT。 第WO95 / 04100号公报 日期1995年2月9日一种热塑性聚酰亚胺薄膜，其包含热塑性聚酰亚胺聚合物，聚酰亚胺层压材料，分别适合用作覆盖层粘合剂和覆盖层，其能够发挥显着的耐热性，加工性和粘附性， 柔性印刷电路板的制造，并且适用于柔性铜包覆层压板和双面粘合片的粘合剂层; 和聚酰亚胺层叠体的制造方法。 由下述通式（1）表示的热塑性聚酰亚胺聚合物：其中Ar1，Ar2，Ar4和Ar6表示二价有机基团，Ar 3和Ar 5表示四价有机基团 其中l，m amd n表示0〜15的正整数，其中1和m的和为1或大于1，其中t表示1或大于1的正整数。

公开(公告)号：US5932345A

公开(公告)日：1999-08-03

申请号：US714072

申请日：1996-09-10

申请人： Hiroyuki Furutani ,  Naoki Hase ,  Junya Ida ,  Yoshifumi Okamoto ,  Hitoshi Nojiri ,  Shinji Inoue ,  Hirosaku Nagano

发明人： Hiroyuki Furutani ,  Naoki Hase ,  Junya Ida ,  Yoshifumi Okamoto ,  Hitoshi Nojiri ,  Shinji Inoue ,  Hirosaku Nagano

IPC分类号： C08G73/10 ,  C08G73/16 ,  C08J5/18 ,  C09J179/08 ,  H01G4/18 ,  H01L23/29 ,  H01L23/49 ,  H05K1/03 ,  D02G3/00

CPC分类号： H01L23/293 ,  C08G73/1042 ,  C08G73/105 ,  C08G73/1089 ,  C08G73/16 ,  C08J5/18 ,  C09J179/08 ,  H01G4/18 ,  C08J2379/08 ,  H01L2224/16 ,  H01L2224/32245 ,  H01L2224/432 ,  H01L2224/451 ,  H01L2224/45572 ,  H01L2224/45599 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01058 ,  H01L2924/07802 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H05K1/0346

摘要： A novel heat-fusible copolymer possessing a combination of excellent properties, including mechanical strength, resistivity against radioactive rays, chemical resistance, low temperature stability, thermal resistance, processabilty, adhesiveness, thermal fusible adhesive stability, and simultaneously satisfying requirements relating to low hygroscopic characteristic and stable dielectric constant. Also, a powder, film, laminated film, laminated insulating material, and article, such as electronic modules and capacitors, made from a thermoplastic polyimide resin composed mainly of the copolymer and suitable for use as electronic components and materials for electronic circuit components. The copolymer possesses a glass transition temperature of 100.degree. C. to 250.degree. C., a hygroscopic degree of 1 or less, and a dielectric rate of 3 or less, and has the following formula: ##STR1## wherein Ar.sub.1 represents a quadrivalent organic radical, Ar.sub.2 represents a divalent organic radial, R represents a divalent organic radical, X represents trivalent bonding radicals, m and n are each integers of 0 or more, the sum of m and n being an integer of 1 or more, and 1 is an integer of 1 or more.

摘要翻译： PCT No.PCT / JP96 / 00049 Sec。 371日期：1996年9月10日 102（e）1996年9月10日PCT PCT 1996年1月11日PCT公布。 WO96 / 21693 PCT出版物 日期1996年7月18日新型热熔共聚物具有机械强度，放射线电阻率，耐化学性，低温稳定性，耐热性，可加工性，粘合性，热熔粘合剂稳定性等优异性能的组合，同时满足要求 涉及低吸湿特性和稳定的介电常数。 另外，由主要由共聚物构成的热塑性聚酰亚胺树脂制成的适合用作电子电路部件的电子部件和材料的粉末，薄膜，层压薄膜，层叠绝缘材料，以及电子模块和电容器等制品。 共聚物的玻璃化转变温度为100〜250℃，吸湿度为1以下，介电速度为3以下，具有下式：其中Ar 1表示四价有机基团，Ar 2 表示二价有机径向，R表示二价有机基团，X表示三价键键合基团，m和n各自为0以上的整数，m和n的和为1以上的整数，1为 1个或更多。

公开(公告)号：US5167985A

公开(公告)日：1992-12-01

申请号：US614483

申请日：1990-11-16

申请人： Hiroshi Ito ,  Hirosaku Nagano ,  Hiroyuki Furutani ,  Hitoshi Nojiri

发明人： Hiroshi Ito ,  Hirosaku Nagano ,  Hiroyuki Furutani ,  Hitoshi Nojiri

IPC分类号： B32B15/088 ,  B05D5/12 ,  C08G73/10 ,  C08L79/08 ,  C09D179/08 ,  H05K1/03

CPC分类号： H05K1/0346 ,  C08G73/1007 ,  C08G73/1071

摘要： A process for producing a flexible printed circuit board comprising a metallic foil and a polyimide is provided, which comprises coating a metallic foil with a resin solution prepared by adding a tertiary amino compound to a solution of a polyamic acid (a polyimide precursor) represented by the following general formula (I): ##STR1## followed by the imidization thereof, the amount of said tertiary amino compound added to the solution being 10 to 50 parts by weight per 100 parts by weight of solid polyamic acid contained in said resin solution. According to the present invention, a flexible printed circuit board which is free from curling, wrinkling and warping, and which has excellent heat resistance, electrical characteristics and mechanical properties is provided with a simplified production process.

公开(公告)号：US5397419A

公开(公告)日：1995-03-14

申请号：US051683

申请日：1993-04-23

申请人： Hiroyuki Furutani ,  Junya Ida

发明人： Hiroyuki Furutani ,  Junya Ida

IPC分类号： B32B15/04 ,  C08G73/00 ,  C08G73/10 ,  C08G73/12 ,  C09D179/00 ,  C09D179/08 ,  H05K1/03 ,  C09J5/02

CPC分类号： C08G73/10 ,  B32B15/04 ,  C08G73/00 ,  C08G73/12 ,  C08G73/125 ,  C08G73/126 ,  C08G73/127 ,  C09D179/00 ,  C09D179/085 ,  H05K1/0346

摘要： The invention discloses a thermosetting imide oligomer represented by the general formula (1A) or (1B): ##STR1## Where Ar.sub.1 indicates a tetravalent aromatic group, Ar.sub.2 indicates a divalent aromatic group, Ar.sub.1 or Ar.sub.2 can be of the same or different kind, X indicates a trivalent group and it can be of the same or different kind, n is an integer selected from 1 to 15, and R is a substitution group having reactivity.The invention further discloses a method for manufacturing a heat resistant laminated sheet using the imide oligomer, which is excellent in heat resistance, hygroscopic resistance and electric properties.

摘要翻译： 本发明公开了由通式（1A）或（1B）表示的热固性酰亚胺低聚物：其中Ar1表示四价芳族基团，Ar2表示二价芳基，Ar1或Ar2 可以是相同或不同的，X表示三价基团，可以是相同或不同的种类，n是选自1至15的整数，R是具有反应性的取代基。 本发明还公开了一种耐热性，耐吸湿性和电性能优异的使用该酰亚胺低聚物的耐热性层压片的制造方法。

公开(公告)号：US07746623B2

公开(公告)日：2010-06-29

申请号：US12173325

申请日：2008-07-15

申请人： Mutsuaki Murakami ,  Masamitsu Tachibana ,  Hiroyuki Furutani ,  Hideo Yamagishi

发明人： Mutsuaki Murakami ,  Masamitsu Tachibana ,  Hiroyuki Furutani ,  Hideo Yamagishi

IPC分类号： H01G9/00

CPC分类号： H01G9/022 ,  C25D11/02 ,  C25D11/06 ,  C25D11/26 ,  H01G11/48 ,  Y02E60/13

摘要： The present invention provides means for forming an oxide film on a metal surface, means for repairing a defect of an oxide film, a high-performance electrolytic capacitor using the means, and an electrolyte of the capacitor. Namely, the prevent invention provides a method for easily forming an oxide film on the surface of a metal or an alloy thereof by anodization using a solution containing an ionic liquid. In an application of this method, an electrolytic capacitor having means for repairing a defect of an oxide film can be formed by a method using, as an electrolyte, an ionic liquid, a solution containing an ionic liquid and a salt, or a solution containing an ionic liquid and a conductive polymer or a TCNQ salt, and a valve metal or an alloy thereof as a metal.

摘要翻译： 本发明提供了在金属表面上形成氧化膜的装置，用于修复氧化膜缺陷的装置，使用该装置的高性能电解电容器和电容器的电解质。 也就是说，本发明提供了一种通过使用含有离子液体的溶液进行阳极氧化在金属或其合金的表面上容易地形成氧化膜的方法。 在该方法的应用中，具有用于修复氧化膜缺陷的装置的电解电容器可以通过使用离子液体，含有离子液体和盐的溶液作为电解质的方法或含有 离子液体和导电聚合物或TCNQ盐，以及作为金属的阀金属或其合金。

公开(公告)号：US20080201926A1

公开(公告)日：2008-08-28

申请号：US12071695

申请日：2008-02-25

申请人： Kazuyuki Tateishi ,  Mutsuaki Murakami ,  Hiroyuki Furutani

发明人： Kazuyuki Tateishi ,  Mutsuaki Murakami ,  Hiroyuki Furutani

IPC分类号： H01G9/15

CPC分类号： H01G9/0036 ,  H01G9/151 ,  Y10T29/41 ,  Y10T29/413 ,  Y10T29/417

摘要： A method of manufacturing a conductive polymer electrolytic capacitor comprising the step of aging a capacitor element including an electrolyte containing a conductive polymer and an ionic liquid by applying an aging voltage y (V) to the capacitor element to satisfy the following formula (1) or the following formula (2) is provided. In the following formulas (1) and (2), x represents a forming voltage for a valve metal. An electrolytic capacitor having a high withstand voltage is implemented by this method. 0.5x≦y≦x (0

摘要翻译： 一种制造导电聚合物电解电容器的方法，包括通过向电容器元件施加老化电压y（V）使包含导电聚合物和离子液体的电解质的电容器元件老化以满足下式（1）或 提供下列公式（2）。 在下式（1）和（2）中，x表示阀金属的形成电压。 通过该方法实现具有高耐压的电解电容器。 <？in-line-formula description =“In-line Formulas”end =“lead”？> 0.5x <= y <= x（0 <？in-line-formula description =“In-line Formulas”end =“lead”？> 24 <= y <= x（48

公开(公告)号：US07101455B1

公开(公告)日：2006-09-05

申请号：US10129037

申请日：2000-10-30

申请人： Naoki Hase ,  Kosuke Kataoka ,  Hiroyuki Furutani ,  Yasuo Fushiki

发明人： Naoki Hase ,  Kosuke Kataoka ,  Hiroyuki Furutani ,  Yasuo Fushiki

IPC分类号： B32B37/04 ,  B32B37/06 ,  B32B37/08 ,  B32B37/12 ,  B32B37/20 ,  B32B38/10

CPC分类号： B32B37/0015 ,  B32B37/26 ,  B32B2309/02 ,  B32B2309/14 ,  H05K3/022

摘要： The present invention provides a method for producing a laminate suitable for a flexible circuit board which is free from visual defects such as wrinkles and curls that appear when a plurality of laminating materials containing a thermally fusible laminating material are formed by thermally laminating these materials each other using a thermal-press forming device, which comprises the steps of: arranging a heat resistant protective material between a pressing surface and the laminating materials, laminating the materials by thermal pressure at not lower than 200° C., wherein the bonded laminating materials are in contact with the protective material, cooling the bonded laminating materials, and peeling off the protective material from the bonded laminating materials, whereby the laminate with less nonuniformity in pressurization, a uniform surface, and a good inter-layer adhesion, and the method and device for producing the laminate can be provided, more particularly, the thermal pressure and forming is performed by a thermal-press forming device having at least a pair of metal rolls.

摘要翻译： 本发明提供了一种适用于柔性电路板的层叠方法，该柔性电路板在没有视觉缺陷的情况下，例如当通过将这些材料彼此热层叠形成多个包含热熔性层压材料的层压材料时，出现褶皱和卷曲 使用热压成型装置，其包括以下步骤：在挤压表面和层压材料之间布置耐热保护材料，通过热压不低于200℃层压材料，其中粘合层压材料为 与保护材料接触，冷却接合的层压材料，并从保护层压材料剥离保护材料，由此加压不均匀性，均匀表面和良好的层间粘合性的层压体，以及该方法和 可以提供用于制造层压体的装置，更具体地，提供热压 通过具有至少一对金属辊的热压成形装置进行确定和成形。

公开(公告)号：US07850439B2

公开(公告)日：2010-12-14

申请号：US12397398

申请日：2009-03-04

申请人： Hiroyuki Furutani

发明人： Hiroyuki Furutani

IPC分类号： B29C33/10 ,  B29D30/06

CPC分类号： B29C43/36 ,  B29C33/10 ,  B29D30/0606 ,  B29D2030/0617

摘要： The invention relates to a vent plug for a tire vulcanization mold used for a vent hole of the mold, the tire vulcanization mold, and a manufacturing method for the tire using the mold. The vent plug includes a plug holder with a hollow ventilation portion and a plug head within the ventilation portion. The plug holder includes a tapered seat portion, an inside diameter of which becomes smaller toward a mold rear side, and a cylinder portion located at the mold rear side of the seat portion. The plug head includes a tapered head portion, an outer diameter of which becomes smaller toward the mold rear side, a base body portion located at the mold rear side of the head portion, and a slit portion communicating with the ventilation portion from an upper end face of the plug head.

摘要翻译： 本发明涉及一种用于模具通气孔，轮胎硫化模具和使用该模具的轮胎的制造方法的轮胎硫化模具用排气塞。 通风插头包括具有中空通风部分的插头支架和通风部分内的插头头部。 插头保持器包括锥形座部，其内径朝向模具后侧变小，以及位于座部的模具后侧的筒部。 插塞头包括锥形头部，其外径朝向模具后侧变小，位于头部的模具后侧的基部主体部分和从上部与通气部分连通的狭缝部分 插头头面。

公开(公告)号：US20090251849A1

公开(公告)日：2009-10-08

申请号：US12084154

申请日：2006-11-02

申请人： Hideo Yamagishi ,  Masamitsu Tachibana ,  Mutsuaki Murakami ,  Yasuhiro Tsukada ,  Hiroyuki Furutani

发明人： Hideo Yamagishi ,  Masamitsu Tachibana ,  Mutsuaki Murakami ,  Yasuhiro Tsukada ,  Hiroyuki Furutani

IPC分类号： H01G9/038 ,  H01G9/035

CPC分类号： H01G9/038 ,  H01G9/155 ,  H01G9/22 ,  H01G11/02 ,  H01G11/06 ,  H01G11/62 ,  Y02E60/13 ,  Y02T10/7022

摘要： Disclosed is an energy storage device having high energy density and excellent power density. For example, electric double layer capacitors, redox capacitors, lithium ion electrolyte type capacitors and devices applying any of them are greatly improved in the energy density without deteriorating their advantages such as high power density, high charge/discharge efficiency and long life. Specifically disclosed is an energy storage device containing a positive electrode, a negative electrode and an electrolyte solution, which device is characterized in that a compound capable of performing a doping/dedoping reaction is present in the electrolyte solution.

摘要翻译： 公开了具有高能量密度和优异的功率密度的能量存储装置。 例如，双电层电容器，氧化还原电容器，锂离子电解质型电容器和应用它们的器件在能量密度方面大大提高，而不会降低其功率密度高，充电/放电效率高以及长寿命等优点。 具体公开了包含正极，负极和电解质溶液的能量存储装置，该装置的特征在于，在电解液中存在能够进行掺杂/去掺杂反应的化合物。