摘要:
The present invention provides a thermally expandable microcapsule that maintains a high expansion ratio and hardly bursts and shrinks even at a high temperature, a foamable thermoplastic resin masterbatch and a foam molded product that are produced using the thermally expandable microcapsule, and a method for producing the thermally expandable microcapsule. The thermally expandable microcapsule comprises a volatile expansion agent included in a shell as a core agent and the shell formed of a polymer, the shell containing a thermosetting resin and a polymer obtainable by polymerization of a monomer composition containing a nitrile-type monomer and a monomer having a carboxyl group, and the thermosetting resin having no radical-polymerizable double bond and at least two functional groups reactive with a carboxyl group per molecule.
摘要:
The present invention provides a thermally expandable microcapsule that is excellent in heat resistance and durability. The present invention is a thermally expandable microcapsule, which comprises a shell containing a copolymer, and a volatile liquid as a core agent included in the shell, the copolymer being obtainable by polymerization of a monomer mixture containing a monomer A and a monomer B, the monomer A being at least one selected from the group consisting of a nitrile group-containing methacrylic monomer and an amide group-containing methacrylic monomer, the monomer B being at least one selected from the group consisting of a carboxyl group-containing methacrylic monomer and an ester group-containing methacrylic monomer, a total amount of the monomer A and the monomer B accounting for 70% by weight or more of the monomer mixture, a weight ratio of the monomer A and the monomer B being 5:5 to 9:1, and the monomer mixture containing methacrylonitrile and methacrylic acid in a total amount of not more than 70% by weight of the monomer mixture.
摘要:
The present invention provides a resin composition for foam molding which can achieve high expansion ratio and can significantly improve tactile impression and vibration damping properties of the foam molding to be obtained.The present invention relates to a resin composition for foam molding comprising: a thermally expandable microcapsule that includes a shell containing an epoxy resin and a core agent that is a volatile expansion agent encapsulated by the shell; a thermoplastic resin; and a curable compound having two or more functional groups each selected from the group consisting of a carboxy group, a hydroxy group, an amino group, an amido group, and an acid anhydride group in each molecule.
摘要:
The present invention provides a thermally expandable microcapsule that is excellent in heat resistance and durability and exhibits an excellent foaming property in a wide temperature range from low temperatures to high temperatures. The present invention is a thermally expandable microcapsule, which comprises a shell containing a copolymer, and a volatile liquid as a core agent included in the shell, the copolymer being obtainable by polymerization of a monomer mixture containing a monomer A and a monomer B, the monomer A being at least one selected from the group consisting of a nitrile group-containing acrylic monomer and an amide group-containing acrylic monomer, the monomer B being at least one selected from the group consisting of a carboxyl group-containing acrylic monomer and an ester group-containing acrylic monomer, a total amount of the monomer A and the monomer B accounting for 70% by weight or more of the monomer mixture, and a weight ratio of the monomer A and the monomer B being 5:5 to 9:1.
摘要:
The present invention provides a thermally expandable microcapsule that is excellent in heat resistance and durability and exhibits an excellent foaming property in a wide temperature range from low temperatures to high temperatures. The present invention is a thermally expandable microcapsule, which comprises a shell containing a copolymer, and a volatile liquid as a core agent included in the shell, the copolymer being obtainable by polymerization of a monomer mixture containing a monomer A and a monomer B, the monomer A being at least one selected from the group consisting of a nitrile group-containing acrylic monomer and an amide group-containing acrylic monomer, the monomer B being at least one selected from the group consisting of a carboxyl group-containing acrylic monomer and an ester group-containing acrylic monomer, a total amount of the monomer A and the monomer B accounting for 70% by weight or more of the monomer mixture, and a weight ratio of the monomer A and the monomer B being 5:5 to 9:1.
摘要:
The present invention aims to provide a foamable resin composition which enables foam molding at high expansion ratios and reduction of open cells. The present invention also aims to provide a foam molded body produced from the foamable resin composition. The present invention is a foamable resin composition including a thermoplastic resin, thermal expansion microcapsules, and a chemical foaming agent, wherein Ts is not lower than 120° C., Tmax is not lower than 190° C., and Ts-Tc is not lower than −30° C. and not higher than 6° C., where Ts denotes a foaming starting temperature of the thermal expansion microcapsules, Tmax denotes a maximum foaming temperature of the thermal expansion microcapsules, and Tc denotes a decomposition temperature of the chemical foaming agent.
摘要:
The present invention provides a thermally expandable microcapsule that maintains a high expansion ratio and hardly bursts and shrinks even at a high temperature, a foamable thermoplastic resin masterbatch and a foam molded product that are produced using the thermally expandable microcapsule, and a method for producing the thermally expandable microcapsule. The thermally expandable microcapsule comprises a volatile expansion agent included in a shell as a core agent and the shell formed of a polymer, the shell containing a thermosetting resin and a polymer obtainable by polymerization of a monomer composition containing a nitrile-type monomer and a monomer having a carboxyl group, and the thermosetting resin having no radical-polymerizable double bond and at least two functional groups reactive with a carboxyl group per molecule.
摘要:
A method containing a step of reacting a conjugated diene polymer having an alkali metal or alkaline earth metal active end with a hydrocarbyloxysilane compound having one or more of each of the following functional groups I and II in its molecule to obtain a modified conjugated diene polymer containing a functional group II, and a step of mixing the modified conjugated diene polymer and a compound such as organic acid. A modified conjugated diene rubber which can be used as a raw material of a cross-linked rubber which can be used in tire treads and the like and can enhance low fuel consumption performance is provided. The functional group I is a hydrocarbyloxysilyl group. The functional group II is a nitrogen-containing group in which both of two hydrogen atoms of a primary amino group are substituted with protective groups.
摘要:
The present invention aims to ensure strength of a thin-walled sintered magnet. A sintered magnet is a ferrite sintered magnet made by sintering a magnetic material. A magnetic powder mixture obtained by mixing magnetic powder with a binder resin is injection-molded into a mold with a magnetic field applied thereto to produce a molded body, which is then sintered to produce the sintered magnet. The sintered magnet has a thickness of 3.5 mm or less in the position of center of gravity thereof. The sintered magnet has a surface roughness Rz of 0.1 μm or more and 2.5 μm or less. The surface roughness Rz is a 10 point average roughness.
摘要:
A microcomputer includes: a CPU executing a predetermined calculation process; and a PWM timer generating a PWM pulse. The PWM timer includes a RAM for storing a duty value of the PWM pulse and a PWM controller for generating the PWM pulse. The PWM controller includes a PWM counter for counting up from a predetermined value as an initial value. The PWM pulse has an unit waveform, which is generated based on comparison between the duty value of the RAM and an output value of the PWM counter. The RAM outputs a new duty value at every comparison without functioning the CPU so that the duty value of the PWM pulse is changed in chronological order.