摘要:
A green-compact electrode (1) for discharge surface treatment for use in a discharge surface treatment operation for forming a hard coating film (9) on the surface of an object (2) which must be machined by performing a discharging operation in working fluid (4) is structured such that powder (11) made of metal, such as W or Ti, and fluid (12) which is the same as working fluid are mixed with each other, and the mixed substance is compression-molded so that the green-compact electrode (1) for the discharge surface treatment is obtained.
摘要:
A sliding surface of a high-temperature portion is subjected to an electro-discharge surface treatment with one or both of a high-temperature hard material (4) and a material having a lubricating property at a high temperature (6). The high-temperature hard material (4) is any or a mixture of cBN, TiC, TiN, TiAlN, TiB2, WC, Cr3C2, SiC, ZrC, VC, B4C, Si3N4, ZrO2, and Al2O3. The material having the lubricating property at the high temperature (6) contains chromium and/or chromium oxide (Cr2O3) and/or hexaboron nitride (hBN). An electrode formed by compression molding of the high-temperature hard material, and the high-temperature lubricating material containing at least one of Cr and hBN and having the lubricating property at the high temperature is used as the electrode for the electro-discharge surface treatment.
摘要:
A discharge surface treatment apparatus generates a pulsed discharge between poles, that is, between a discharge electrode and a workpiece, and the discharge electrode is obtained by compression-molding of any one of a metal powder, a powder of a metal compound, and a powder of ceramics or a mixture thereof. The apparatus forms a film made of an electrode material or the like on a workpiece surface by thermal energy due to the discharge. The apparatus includes: a capacitor that is connected to any one of the discharge electrode and the workpiece at one end; and a parallel circuit of a resistor and a diode, which is provided between another one of the discharge electrode and the workpiece and another end of the capacitor via a connection line.
摘要:
Using electrical discharge surface treatment of moving an electrode material to a work piece by repeatedly generating pulsed electrical discharge between an electrode for electrical discharge surface treatment (1) containing Si as a main component and a work piece (2) surface in order to form a surface layer excellent in an anti-corrosion property and an anti-erosion property which is useful in applications to anti-corrosion and anti-erosion parts, a surface layer formed with an amorphous structure, in which an Si component is contained in a range of 3 to 11 wt % and which has a thickness of 5 to 10 μm, is formed on the work piece (2) surface.
摘要:
A pulsed discharge is generated between tip ends of a rotating member such as a blade and a discharge electrode including a hard material such as cBN in dielectric liquid or gas by a power supply for discharge to melt the discharge electrode, and a part of the discharge electrode is attached to the tip end of the rotating member to form an abrasive coating film including the hard materials such as cBN.
摘要:
To form a thick coating by a discharge surface treatment, a voltage between an electrode and a workpiece during a discharge is detected, and it is determined that a discharge surface treatment state is abnormal if it is detected that the voltage is reduced. With this arrangement, it is possible to accurately detect an unstable phenomenon in the discharge surface treatment, and take appropriate measures before a state of the coating and a state of the electrode are worsened due to the unstable phenomenon. By discriminating a stability of the discharge surface treatment, the coating and the electrode are prevented from being damaged.
摘要:
An electrode for an electrical-discharge surface-treatment method is molded with a metallic powder or a metallic compound powder having an average grain diameter of 6 micrometers to 10 micrometers. A coat on a surface of a workpiece is formed with a material constituting the electrode or a substance that is generated by a reaction of the material due to a pulse-like electrical discharge. The coat is built up with a material containing metal as a main constituent under conditions of a width of a current pulse for the pulse-like electrical discharge in a range of 50 microseconds to 500 microseconds and a peak of the current pulse equal to or less than 30 amperes.
摘要:
To form a coating film having an excellent wear-resistant property in a temperature range from low temperature to high temperature a coating-film forming method includes a metal-powder producing step of producing a metal powder containing an element exhibiting a lubricating property when oxidized; an oxidizing step of oxidizing the metal powder so that an amount of oxygen contained in the metal powder is within 6 weight % to 14 weight %; and a coating-film forming step of forming a coating film on a material subject to a treatment, the coating film having such a composition that an area where an oxygen content is 3 weight % or less and an area where an oxygen content is 8 weight % or more are distributed in a unit area of the coating film when the metal powder is in a melted state or a semi-melted state, and an oxygen content of the entire coating film after the metal powder is melted or semi-melted being within 5 weight % to 9 weight %.
摘要:
A pulsed discharge is generated between tip ends of a rotating member such as a blade and a discharge electrode including a hard material such as cBN in dielectric liquid or gas by a power supply for discharge to melt the discharge electrode, and a part of the discharge electrode is attached to the tip end of the rotating member to form an abrasive coating film including the hard materials such as cBN.
摘要:
A design support apparatus supports wiring design for bond wires that connect a semiconductor chip and an interposer. The design support apparatus includes a creating unit that creates simulated design data simulating occurrence of fluctuation in an arrangement position of a semiconductor chip on an interposer and occurrence of fluctuation in bond wire connection terminal positions of the interposer, and an analyzing unit that analyzes, based on the simulated design data, deficiencies in manufacturing of semiconductor devices due to the fluctuation in the arrangement position of the semiconductor chip on the interposer and the fluctuation in the bond wire connection terminal positions of the interposer.