摘要:
A dielectric material is disclosed which has a small absolute value of the temperature coefficient of resonance frequency and a high coefficient of unloaded quality. Also disclosed are a process for producing the dielectric material and multilayer and other circuit boards containing the dielectric material. The dielectric material is a highly densified material having a water absorption lower than 0.1%, which is obtained by mixing 95.5 to 99.5 percent by weight mixture of a glass frit and a strontium compound with 0.5 to 4.5 percent by weight titanium dioxide, compacting the resultant mixture, and sintering the compact at a relatively low temperature around 930.degree. C. This dielectric material is a glass ceramic containing strontium anorthite (SrAl.sub.2 Si.sub.2 O.sub.8) as the main crystalline phase, and may contain the TiO.sub.2, which remains unchanged after sintering. The absolute value of the temperature coefficient of resonance frequency of the dielectric material is 20 ppm/.degree. C. or lower, preferably 10 ppm/.degree. C. or lower, more preferably 5 ppm/.degree. C. or lower. The product of the unloaded quality coefficient and resonance frequency is 1,800 GHz or larger, preferably 2,500 GHz or larger. This material therefore has excellent dielectric properties.
摘要翻译:公开了一种介电材料,其谐振频率的温度系数的绝对值小,并且具有高的卸载质量系数。 还公开了用于制造包含电介质材料的电介质材料和多层和其它电路板的方法。 电介质材料是吸水率低于0.1%的高度致密化的材料,其通过将玻璃料和锶化合物的95.5-99.5重量%的混合物与0.5-4.5重量%的二氧化钛混合而获得,将所得物 混合物,并在930℃附近的相对较低的温度下烧结。该介电材料是含有锶钙长石(SrAl 2 Si 2 O 8)作为主要结晶相的玻璃陶瓷,并且可以含有在烧结后保持不变的TiO 2。 介电材料的共振频率的温度系数的绝对值为20ppm /℃以下,优选为10ppm /℃以下,更优选为5ppm /℃以下。 无载质量系数和谐振频率的乘积为1800GHz以上,优选为2,500GHz以上。 因此该材料具有优异的介电特性。
摘要:
Disclosed is a dielectric material comprising: 100 parts by weight of a main component having a composition represented by formula: xBaO—yRE2O3—zTiO2, wherein RE represents at least one rare earth element and x+y+z=100 mol %; 5 parts by weight or less of at least one alkali metal oxide; and 5 parts by weight or less of Bi2O3.
摘要翻译:公开了一种电介质材料,其包含:100重量份具有由式:xBaO-yRE 2 O 3 -zTiO 2表示的组成的主要组分,其中RE表示至少一种稀土元素,x + y + z = 100摩尔% 5重量份以下的至少一种碱金属氧化物; 和5重量份以下的Bi 2 O 3。
摘要:
Disclosed is a dielectric material comprising: a main ingredient having a composition represented by xBaO-yRE2O3-zTiO2, wherein RE represents at least one rare earth element, and x+y+z=100 mol %; at least one alkali metal oxide; and an ingredient derived from an oxygen supplying agent which releases oxygen on heating.
摘要翻译:公开了一种电介质材料,其包含:具有由xBaO-yRE 2 O 3 -zTiO 2表示的组成的主成分,其中RE表示至少一种稀土元素,x + y + z = 100摩尔% 至少一种碱金属氧化物; 以及从加热时释放氧气的供氧剂得到的成分。
摘要:
A dielectric material based on BaO-RE.sub.2 O.sub.3 -TiO.sub.2 is disclosed, which has a relatively high relative permittivity .epsilon..sub.r, a small absolute value of the temperature coefficient of resonance frequency .tau..sub.f and a high coefficient of unloaded quality Q.sub.u. Processes for producing the dielectric material are also disclosed. The dielectric material comprises 100 parts by weight of main ingredients having a composition represented by xBaO-yRE.sub.2 O.sub.3 -zTiO.sub.2 (wherein RE represents a rare earth element and x+y+z=100) and up to 5 parts by weight of at least one alkali metal oxide. This alkali metal oxide serves to improve .epsilon..sub.r and Q.sub.u without a considerable sacrifice of .tau..sub.f. The RE preferably consists of samarium or a combination of samarium with neodymium and/or lanthanum. In producing the dielectric material, a dense sintered body can be obtained without fail by using a raw material containing hydroxyl groups as a starting material for the rare-earth ingredient among the main ingredients.
摘要翻译:公开了一种基于BaO-RE2O3-TiO2的介电材料,它具有相对较高的相对介电常数εr,谐振频率τf的温度系数的绝对值小,以及无负载质量Qu的高系数。 还公开了用于制造电介质材料的方法。 电介质材料包含100重量份具有由xBaO-yRE 2 O 3 -ZTiO 2(其中RE表示稀土元素并且x + y + z = 100)表示的组成的主要成分和至多5重量份的至少一种碱 金属氧化物。 这种碱金属氧化物用于改善ε兰曲,而没有相当大的牺牲τf。 RE优选由钐或钐与钕和/或镧的组合组成。 在电介质材料的制造中,通过使用含有羟基的原料作为主要成分中的稀土成分的原料,可以不失败地获得致密的烧结体。
摘要:
A wiring substrate in which a capacitor is provided, the capacitor comprising a capacitor body including a plurality of dielectric layers and internal electrode layers provided between the different dielectric layers, wherein said capacitor body has, in at least one side face of said capacitor body, recesses extending in a thickness direction of said capacitor body from at least one of a first principal face of said capacitor body and a second principal face positioned on the side opposite to the first principal face.
摘要:
An intermediate board has a board core formed by a main core body and a sub-core portion. The main core body has a plate-like shape and includes an open sub-core housing portion in which the sub-core portion is housed. A first terminal array of the board core has an area that overlaps an orthogonal projection of the sub-core portion. The latter incorporates a laminated ceramic capacitor formed by first and second conductor layers with a ceramic (dielectric) layer therebetween. The first layer is connected to first and second side terminals of a first type while the second layer is connected to first and second side terminals of a second type. The housing portion has an inner edge which, in cross section, is of a quadrate shape, and a radius portion is formed at each corner having a dimension of between 0.1 and 2 mm.
摘要:
A wiring board includes a substrate core and a ceramic chip to be embedded therein. The substrate core has a housing opening portion opening at a core main surface. The ceramic chip is accommodated in the housing opening portion so that the core main surface and a chip first main surface face the same way. The ceramic chip includes a plurality of second terminal electrodes comprised of a metallized layer and formed on the chip second main surface so as to protrude therefrom. A projecting portion, disposed on the second main surface side so as to surround a plurality of the second terminal electrodes, is formed on the chip second main surface so as to protrude therefrom.
摘要:
A ceramic capacitor includes a capacitor body and a metal layer arranged on an outer surface of the capacitor body. The outer surface includes: a first capacitor major surface; a second capacitor major surface opposite to the first capacitor major surface in a thickness direction of the capacitor body; and a capacitor lateral surface between the first and second capacitor major surfaces. The capacitor body includes a first layer section and a second layer section. The first layer section includes a plurality of ceramic dielectric layers and a plurality of internal electrodes, wherein the ceramic dielectric layers and the internal electrodes are layered alternately. The second layer section is exposed at the first capacitor major surface, and includes a corner portion at a boundary between the first capacitor major surface and the capacitor lateral surface. The metal layer covers the corner portion of the second layer section.
摘要:
An intermediate board has a board core formed by a main core body and a sub-core portion. The main core body has a plate-like shape and includes an open sub-core housing portion in which the sub-core portion is housed. A first terminal array of the board core has an area that overlaps an orthogonal projection of the sub-core portion. The latter incorporates a laminated ceramic capacitor formed by first and second conductor layers with a ceramic (dielectric) layer therebetween. The first layer is connected to first and second side terminals of a first type while the second layer is connected to first and second side terminals of a second type. The housing portion has an inner edge which, in cross section, is of a quadrate shape, and a radius portion is formed at each corner having a dimension of between 0.1 and 2 mm.
摘要:
A multi-layer capacitor including a capacitor body including dielectric layers, and first and second internal electrode layers which are alternately laminated by mediation of the dielectric layers. The laminate of the first and second internal electrode layers and the dielectric layers are co-fired. The capacitor body further includes first and second electrode terminals formed on one main surface of the capacitor body. At least a single first via electrode extends through the capacitor body in the lamination direction of the capacitor body so as to connect the first electrode terminal and the first internal electrode layers, and at least a single second via electrode extends through the capacitor body in the lamination direction of the capacitor body so as to connect the second electrode terminal and the second internal electrode layers. The via electrodes have an aspect ratio of 4 to 30 as measured after firing.